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XC7A15T-1FTG256C
+StücklisteIC FPGA 170 I/O 256FTBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC7A15T-1FTG256C
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Paket LBGA-256
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Auf Lager1868
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Artix-7 |
| Part Status | Active |
| Number of LABs/CLBs | 1300 |
| Number of Logic Elements/Cells | 16640 |
| Total RAM Bits | 921600 |
| Number of I/O | 170 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Übersicht
Description
Key features of the XC7A15T-1FTG256C include:
1. Logic Cells: It contains around 15,850 logic cells, allowing for significant parallel processing capabilities.
2. Memory: The FPGA includes block RAM to support data storage and buffering.
3. DSP Slices: It features DSP slices for efficient signal processing tasks.
4. I/O Pins: The device offers multiple input/output pins, supporting various interface standards.
5. Low Power: Designed with low power consumption in mind, suitable for energy-efficient applications.
The "1" in the part number denotes the speed grade, which affects the performance and power consumption characteristics of the FPGA. This device is ideal for cost-sensitive applications requiring a balance between performance and power efficiency.
Equivalent
1. Intel Cyclone IV E series (e.g., EP4CE15F17C8).
2. Lattice ECP5 series (e.g., LFE5U-25F).
3. Microsemi/Microchip IGLOO2 series (e.g., M2GL010).
These alternatives offer similar logic capacity and features, though exact equivalency should be verified based on specific project requirements and performance criteria.
Features
1. Logic Cells: Approximately 15,850 logic cells, providing significant flexibility for custom digital circuits.
2. Package: Comes in a FTG256 package, which is a 256-pin fine-pitch ball grid array (BGA).
3. Speed Grade: The "-1" denotes a standard speed grade, balancing performance and power consumption.
4. DSP Slices: Offers 45 DSP slices, ideal for implementing efficient signal processing operations.
5. Block RAM: Integrates 1,080 Kbits of block RAM for data storage and buffering tasks.
6. I/O Pins: Provides 170 user I/O pins, facilitating connectivity with various peripheral devices.
7. Power Efficiency: Built on 28nm process technology, ensuring low power consumption for portable and energy-sensitive applications.
8. Performance: Supports high-speed serial connectivity and includes advanced clock management features.
This FPGA is suitable for applications in areas like embedded processing, communications, and digital signal processing due to its balance of performance, flexibility, and power efficiency.
Pinout
The 256 pins of this package provide a range of functionalities including:
1. I/O Pins: Used for general-purpose input and output operations; they facilitate interfacing with other components and peripherals.
2. Power and Ground Pins: Supply power to the device and provide a ground reference for the internal circuitry.
3. Configuration Pins: Used for initial configuration and programming of the FPGA.
4. Dedicated Clock Pins: Essential for clock signal input, which the FPGA uses for synchronous operations.
5. Special Function Pins: These include JTAG interface pins for testing and debugging, as well as pins for advanced features like differential signaling.
The exact functions of the pins depend on the specific user configuration and design requirements implemented in the FPGA.
Manufacturer
Xilinx was a pioneer in the development of FPGAs and played a significant role in advancing the technology since its founding in 1984. The company has been influential in enabling customized hardware solutions and providing silicon platforms that allow for rapid prototyping and deployment of electronic systems. Xilinx was acquired by Advanced Micro Devices (AMD) in February 2022, expanding AMD's product portfolio and capabilities in adaptive computing.
Application
1. Communications: Implementing protocols and custom logic for networking equipment.
2. Industrial Automation: Control systems, signal processing, and data acquisition.
3. Consumer Electronics: Advanced audio/video processing and interface bridging.
4. Medical Devices: Signal processing for imaging and diagnostics.
5. Automotive: Advanced driver-assistance systems (ADAS) and in-car entertainment.
6. Aerospace and Defense: Secure communications, encryption, and real-time processing.
Its flexibility and performance make it suitable for cost-sensitive applications across various industries.