Abbildungen dienen nur als Referenz
XC7A200T-1FBG676I
+StücklisteIC FPGA 400 I/O 676FCBGA
-
HerstellerAMD Xilinx
-
Herstellerteil #XC7A200T-1FBG676I
-
Paket FCBGA-676
-
Auf Lager6753
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Artix-7 |
| Part Status | Active |
| Number of LABs/CLBs | 16825 |
| Number of Logic Elements/Cells | 215360 |
| Total RAM Bits | 13455360 |
| Number of I/O | 400 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
1. Logic Cells: It contains approximately 215,360 logic cells, enabling complex computations and data processing.
2. I/O Pins: The device supports 676 pins, enhancing connectivity options for various peripherals and interfaces.
3. Performance: The "-1" speed grade indicates its performance level, suitable for many mid-range applications.
4. Temperature Range: The "I" suffix denotes industrial-grade temperature range, from -40°C to +100°C, suitable for demanding environments.
5. Package: It comes in a FBG676 package, a Ball Grid Array providing a compact form factor.
6. Applications: Commonly used in communications, automotive, industrial, and consumer electronics due to its balance of power, performance, and cost.
The XC7A200T-1FBG676I is a versatile and reliable choice for designers seeking to implement FPGA solutions in a wide range of applications.
Equivalent
1. Intel (Altera) Cyclone V series, specifically models like the Cyclone V GX.
2. Lattice ECP5 series, which offers competitive power and performance.
3. Microsemi (now Microchip) SmartFusion2 or IGLOO2 FPGAs.
These devices vary slightly in features and specifications, so it's essential to compare based on specific project requirements.
Features
1. Logic Cells: It offers approximately 215,360 logic cells.
2. Configurable Logic Blocks (CLBs): Includes 33,650 CLB slices.
3. Memory: Contains 740 Block RAMs, with a total capacity of about 13,140 Kbits.
4. DSP Slices: Provides 740 DSP slices for efficient digital signal processing.
5. I/O Pins: Supports up to 300 user I/O pins.
6. Transceivers: Does not include high-speed transceivers, focusing on cost-effective logic and I/O density.
7. Package: Comes in a 676-pin FBGA package.
8. Operating Temperature: Industrial grade, supporting -40°C to +100°C.
9. Power Efficiency: Optimized for low power consumption, suitable for battery-powered and portable applications.
10. Applications: Ideal for applications in consumer electronics, automotive, industrial automation, and communication systems.
These features make it a versatile choice for a wide range of applications that require efficient processing and flexible design capabilities.
Pinout
The main functions of the XC7A200T include:
1. Logic Resources: It features a large number of configurable logic blocks (CLBs) to implement complex digital circuits.
2. I/O Interfaces: Provides numerous I/O pins for connectivity with external components, supporting various I/O standards.
3. Memory: Includes block RAM for data storage and processing needs.
4. DSP Slices: Equipped with dedicated DSP slices for high-performance arithmetic operations.
5. Clock Management: Comes with clock management tiles for efficient clock distribution and frequency synthesis.
These features make the XC7A200T a versatile FPGA choice for implementing advanced digital designs.
Manufacturer
As a part of AMD, Xilinx continues to operate within the larger framework of AMD’s diverse technology portfolio, which includes CPUs, GPUs, and adaptive computing solutions. AMD is a global semiconductor company serving various segments, including gaming, data centers, and embedded systems. The combination of AMD's processing technologies and Xilinx's programmable solutions aims to deliver comprehensive solutions for data-driven applications and emerging workloads.