XC7A200T-3FFG1156E

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XC7A200T-3FFG1156E

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IC FPGA 500 I/O 1156FCBGA

  • HerstellerAMD Xilinx

  • Herstellerteil #XC7A200T-3FFG1156E

  • Paket BBGA-1156

  • Auf Lager4403

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Spezifikationen

Attribut Wert
Supplier AMD Xilinx
Package / Case Tray
Series Artix-7
Part Status Active
Number of LABs/CLBs 16825
Number of Logic Elements/Cells 215360
Total RAM Bits 13455360
Number of I/O 500
Voltage - Supply 0.95V ~ 1.05V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 100°C (TJ)

Übersicht

Description

XC7A200T-3FFG1156E is a Xilinx Artix-7 FPGA. It sits in the 7‑series on a 28 nm process for low power and cost. The A200T denotes mid-to-high density fabric resources (≈200k logic cells). FFG1156 is a Fine-Pitch Ball Grid Array package with 1,156 balls. The -3 is the speed grade; E indicates extended operating temperature (-40 to 85 °C). The device combines programmable logic with DSP slices, block RAM, clock management, and multiple I/O banks for a range of interfaces. It’s aimed at cost- and power-sensitive applications such as embedded controllers, motor drives, and communications hardware. Design is via Xilinx Vivado (ISE for older flows) with Xilinx reference designs and IP. In short: a mid-density, power-efficient FPGA in a large BGA package suitable for mainstream digital designs needing moderate logic, memory, and I/O.

Equivalent

Equivalent parts (same device family and package):
- XC7A200T-1FFG1156E
- XC7A200T-2FFG1156E
Notes:
- All share the same capacity and pinout; only timing differs by speed grade (−1 fastest, −2 mid, −3 slowest).
- No other pin-compatible equivalents in a different package.

Features

XC7A200T-3FFG1156E is an Artix-7 FPGA. Key features:
- 28nm, low-power, high-performance fabric
- Density around 200K logic cells
- LUT-based logic with fast carry, distributed RAM and BRAM
- On‑chip resources: ample Block RAM, DSP slices, and PLLs/MMCMs
- Multiple I/O banks with 3.3V-tolerant I/O
- 1156-ball flip-chip FFG package (FFG1156E)
- Speed grade -3
- Industrial temperature range (extended temp)
Ideal for cost-sensitive, mid-density designs needing DSP and memory without high-speed transceivers.

Pinout

- Pin count: 1156 pins (FFG1156 package)
- Function: Xilinx Artix-7 FPGA device (XC7A200T) with ~200k logic cells, used as a general-purpose FPGA for digital logic, DSP, memory interfaces, and I/O in a 1156-ball BGA package.

Manufacturer

- Manufacturer: Xilinx, Inc. (the XC7A200T-3FFG1156E is an Artix-7 FPGA from Xilinx; Xilinx is now a subsidiary of AMD).
- What kind of company: A semiconductor company that designs and manufactures programmable logic devices, primarily FPGAs (and related CPLDs/SoCs) and the associated design tools.

Application

XC7A200T-3FFG1156E is an Artix‑7 FPGA optimized for cost‑efficient, DSP‑intensive designs. Common applications include:
- Communications and networking (packet processing, protocol offload)
- Embedded processing and system controllers
- Video, image, and vision processing
- Data acquisition, measurement, and test equipment
- Industrial automation and motor control
- Automotive, rail, avionics sensing and control
- Medical imaging and diagnostic equipment
- Edge AI, FPGA accelerators, and prototyping platforms
- High‑speed I/O interfaces and custom interfacing solutions

Package

Package type: FFG1156E — Flip-Chip Grid Array package with 1156 balls (Artix-7 XC7A200T-3FFG1156E).

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