Abbildungen dienen nur als Referenz
XC7A200T-3SBG484E
+StücklisteIC FPGA 285 I/O 484FCBGA
-
HerstellerAMD Xilinx
-
Herstellerteil #XC7A200T-3SBG484E
-
Paket FBGA-484
-
Auf Lager4987
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Artix-7 |
| Part Status | Active |
| Number of LABs/CLBs | 16825 |
| Number of Logic Elements/Cells | 215360 |
| Total RAM Bits | 13455360 |
| Number of I/O | 285 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
Übersicht
Description
- FPGA Fabric: 200K logic cells, 13,140 slices, 740 DSPs, and 13.5 Mb block RAM.
- Performance: Optimized for cost-sensitive applications with low power consumption (28nm process).
- I/O & Interfaces: Supports 484-pin SBGA package, high-speed transceivers (up to 6.6 Gbps), and multiple I/O standards (LVDS, LVCMOS).
- Applications: Used in embedded vision, motor control, aerospace, and communications.
- Tools: Programmable via Xilinx Vivado or ISE Design Suite.
The -3 speed grade ensures balanced performance and power efficiency. Ideal for space-constrained, high-throughput designs.
Equivalent
- Xilinx Artix-7 series: XC7A100T, XC7A50T (lower capacity), or XC7A200T-2SBG484E (slower speed grade).
- Competitors: Intel (Altera) Cyclone V (5CEA2) or Lattice ECP5 (LFE5UM-85).
For exact replacements, check Xilinx's product table or distributors like Digi-Key/Mouser for same package/specs.
Pinout
Key features:
- 484-ball SBGA package (19x19 mm, 1.0 mm pitch).
- Logic capacity: ~200K logic cells, 13,140 slices.
- I/O pins: 285 user I/Os (supports LVDS, LVCMOS, etc.).
- Memory: 4,860 Kb block RAM, 740 DSP slices.
- High-speed interfaces: GTP transceivers (up to 6.6 Gbps).
- Power: Requires multiple voltage rails (1.0V core, 1.8V/2.5V/3.3V I/O).
Functions:
- Suitable for embedded processing, DSP, and high-speed connectivity.
- Supports PCIe, Ethernet, and memory interfaces (DDR3).
Application
- Embedded Systems (industrial control, automation)
- Communications (SDR, networking, baseband processing)
- Aerospace & Defense (radar, avionics)
- Medical Imaging (ultrasound, diagnostic equipment)
- Consumer Electronics (HD video, IoT edge devices)
- Automotive (ADAS, infotainment)
Its low power, high performance, and cost-effectiveness make it ideal for applications requiring real-time processing, high-speed I/O, and flexibility.