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XC7A35T-2CSG325I
+StücklisteIC FPGA 150 I/O 324CSBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC7A35T-2CSG325I
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Paket LFBGA-324
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Auf Lager1375
365 Tage Qualitätsgarantie
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Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Artix-7 |
| Part Status | Active |
| Number of LABs/CLBs | 2600 |
| Number of Logic Elements/Cells | 33280 |
| Total RAM Bits | 1843200 |
| Number of I/O | 150 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
The "-2" in the part number denotes a specific speed grade, which affects the timing characteristics and operational efficiency of the FPGA. The "CSG325" indicates the package type and pin count, with CSG325 being a 325-ball grid array package. Finally, the "I" at the end signifies the industrial temperature range, allowing the device to operate in more extreme temperature conditions, from -40°C to 100°C, making it suitable for industrial applications.
The Artix-7 series is optimized for cost-sensitive applications, offering a balance of performance and power efficiency, making the XC7A35T-2CSG325I a versatile choice for various applications, including wireless communication, automotive, and industrial systems.
Equivalent
Features
1. Logic Cells: Approximately 33,280 logic cells.
2. DSP Slices: 90 DSP slices for signal processing tasks.
3. Block RAM: 1,800 Kb of block RAM for data storage.
4. Clock Management: Multiple clock management tiles with phase-locked loops (PLLs) for advanced clocking options.
5. I/O Pins: Up to 210 user I/O pins for peripheral interfacing.
6. Transceivers: No transceivers; typically used in non-high-speed applications.
7. Package: Available in a CSG325 package.
8. Temperature Range: Industrial grade with an operating temperature range from -40°C to +100°C.
9. Low Power: Built on a 28nm process for reduced power consumption.
This FPGA is ideal for applications requiring cost-effective and energy-efficient processing capabilities without the need for high-speed serial transceivers.
Pinout
Key functions and features of the XC7A35T-2CSG325I include:
- Logic Cells: Approximately 33,280
- Block RAM: 1,800 Kb
- DSP Slices: 90
- I/O Pins: Up to 210 user I/Os, depending on configuration
- Transceivers: This specific model does not include high-speed serial transceivers.
It operates in an industrial temperature range, indicated by the 'I' in its part number, and is characterized by low static and dynamic power consumption. The device is programmed using Xilinx's Vivado Design Suite, which allows for efficient synthesis and implementation of complex digital designs.
Manufacturer
Xilinx's products are typically used in various applications, including aerospace and defense, automotive, data centers, industrial, and telecommunications. The company's technology enables flexibility and rapid prototyping for engineers and developers, allowing them to optimize and customize their hardware solutions.
In 2020, it was announced that Xilinx would be acquired by Advanced Micro Devices (AMD), another major player in the semiconductor industry, a deal that was completed in 2022. This acquisition aimed to enhance AMD's product portfolio, particularly in adaptive computing solutions, by leveraging Xilinx's expertise and technology in programmable logic.
Application
1. Embedded Systems: Used in custom processing and control functions.
2. Communications: Supports high-speed data transfer and protocol bridging.
3. Industrial Automation: Facilitates real-time processing for control systems.
4. Consumer Electronics: Provides processing power for multimedia applications.
5. Medical Devices: Supports imaging and diagnostic equipment.
6. Automotive: Assists in infotainment systems and advanced driver-assistance systems (ADAS).
7. Aerospace and Defense: Used for signal processing and secure communications.
It offers designers a flexible platform for implementing custom logic and processing tasks.