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XC7A50T-1CSG324I
+StücklisteIC FPGA 210 I/O 324CSBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC7A50T-1CSG324I
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Paket CSBGA-324
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Auf Lager4712
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package | Tray |
| Series | Artix-7 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 4075 |
| NumberofLogicElements/Cells | 52160 |
| TotalRAMBits | 2764800 |
| NumberofI/O | 210 |
| Voltage-Supply | 0.95V ~ 1.05V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 324-LFBGA, CSPBGA |
Übersicht
Description
The 1CSG324I variant comes in a 324-pin CSPBGA package, supporting -1 speed grade (moderate performance). It includes 16 high-speed transceivers (up to 6.6 Gbps), 200+ user I/Os, and supports common interfaces like LVDS, HDMI, and PCIe.
Key advantages:
- Low power consumption (optimized for efficiency).
- High logic density for mid-range designs.
- Robust I/O flexibility for diverse applications.
Ideal for prototyping, signal processing, and compact designs requiring a balance of performance and cost.
Features
- Logic Cells: ~52,160
- DSP Slices: 120
- Block RAM: 2,700 Kb (2700 KB)
- I/O Pins: 210 (324-pin CSG324 package)
- Transceivers: None (Artix-7 lacks high-speed transceivers)
- Max Speed Grade: -1 (moderate performance)
- Process Technology: 28nm
- Power Efficiency: Optimized for low power
- Configuration: Supports SPI, BPI, JTAG, and Xilinx-specific modes
- Operating Temp: Industrial (-40°C to +100°C)
Ideal for embedded, industrial, and cost-sensitive applications requiring moderate logic density and low power.
Pinout
Key functions:
- Logic Cells: ~52,160
- DSP Slices: 120
- Block RAM: 2,700 Kb
- I/O Pins: 150 (supports LVDS, LVCMOS, and other standards)
- Clock Management: 6 MMCMs/PLLs
- High-speed transceivers: None (base Artix-7 model)
Designed for cost-sensitive, low-power applications like embedded systems, motor control, and IoT. The CSG324 package balances performance and footprint efficiency.
Application
1. Embedded Systems – Industrial control, automation.
2. Communications – Software-defined radio (SDR), networking.
3. Consumer Electronics – HD video processing, drones.
4. Automotive – ADAS, infotainment.
5. Medical Devices – Imaging, diagnostics.
6. Aerospace & Defense – Radar, avionics.
Its low power, high performance, and compact 324-pin CSP package make it ideal for cost-sensitive, space-constrained applications.