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XC7A75T-2FGG676C
+StücklisteIC FPGA 300 I/O 676FBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC7A75T-2FGG676C
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Paket BGA-676
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Auf Lager7722
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Artix-7 |
| Part Status | Active |
| Number of LABs/CLBs | 5900 |
| Number of Logic Elements/Cells | 75520 |
| Total RAM Bits | 3870720 |
| Number of I/O | 300 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Übersicht
Description
Key features include a 28nm process technology that enhances performance and power efficiency. The device offers a substantial number of configurable logic blocks, DSP slices, and a flexible I/O structure. It supports a wide range of interfaces, including high-speed serial connectivity, which is crucial for applications requiring rapid data transfer.
The -2 speed grade indicates moderate speed performance, balancing power consumption and processing capabilities. The FG676 package refers to a Fine-pitch Ball Grid Array (BGA) with 676 pins, which allows for compact integration on circuit boards.
Overall, the XC7A75T-2FGG676C is ideal for applications requiring a balance of performance, cost, and power efficiency, making it a versatile choice for engineers and developers in various sectors.
Equivalent
Features
1. Logic Cells: It offers approximately 75,850 logic cells, providing substantial processing capability.
2. Slices and LUTs: The FPGA contains 11,950 slices, each with four 6-input LUTs and eight flip-flops, enhancing its logic capacity.
3. Block RAM: It features 4.9 Mb of block RAM for efficient data storage.
4. DSP Slices: There are 180 DSP slices, enabling high-performance digital signal processing tasks.
5. I/O Pins: The device supports up to 300 user I/O pins, facilitating extensive interfacing options.
6. Clock Management: Equipped with 6 clock management tiles, each with a PLL and mixed-mode clock manager (MMCM), ensuring robust clocking solutions.
7. Transceivers: The part includes high-speed transceivers for fast data transmission.
8. Power Efficiency: Built on a 28nm process technology, it offers a balance of performance and power efficiency.
9. Package: Available in an FGG676 package, which is a 676-pin fine-pitch ball grid array.
These features make it suitable for a range of applications, including communications, automotive, and industrial systems.
Pinout
In terms of functionality, the XC7A75T-2FGG676C provides the following key features:
- Logic Cells: It contains approximately 75,850 logic cells.
- Block RAM: It offers up to 4,860 Kbits of block RAM.
- DSP Slices: The device includes up to 180 DSP slices for efficient signal processing tasks.
- I/O Pins: It supports up to 300 user I/O pins, providing flexibility for interfacing with other components.
- Clock Management: It features integrated clock management tiles (CMTs) for efficient clock distribution and management.
- Transceivers: The Artix-7 series typically has high-speed transceivers, though specifics depend on the exact model within the series.
These features make the XC7A75T-2FGG676C a versatile choice for high-performance and cost-sensitive applications.
Manufacturer
Application
1. Communications: Supports high-speed data processing in wireless and wired telecommunications.
2. Industrial Automation: Used in control systems and instrumentation.
3. Consumer Electronics: Powers devices requiring flexible, scalable computing.
4. Automotive: Applied in advanced driver-assistance systems (ADAS) and infotainment systems.
5. Medical Devices: Utilized in imaging systems and diagnostic equipment.
6. Aerospace and Defense: Suitable for radar, avionics, and electronic warfare systems.
These applications leverage its capabilities in digital signal processing, logic integration, and connectivity.