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XC7A75T-2FGG676I
+StücklisteIC FPGA 300 I/O 676FBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC7A75T-2FGG676I
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Paket FBGA-676
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Auf Lager5007
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Artix-7 |
| Part Status | Active |
| Number of LABs/CLBs | 5900 |
| Number of Logic Elements/Cells | 75520 |
| Total RAM Bits | 3870720 |
| Number of I/O | 300 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key features of the XC7A75T-2FGG676I include 75,520 logic cells, 4,860 Kb of block RAM, and 240 DSP slices, providing ample resources for complex digital signal processing tasks. The device is built using a 28nm process, which enhances power efficiency and performance metrics. It supports a wide range of I/O standards and is optimized for high-speed serial connectivity, making it ideal for applications requiring fast data throughput.
The "-2" denotes the speed grade, indicating a balance between power consumption and performance. The "FGG676" package offers 676 pins, facilitating a high number of I/O connections. Lastly, the "I" signifies an industrial temperature range, ensuring reliable operation in varied environmental conditions.
Equivalent
Features
1. Logic Cells: Approximately 74,560 logic cells, providing substantial capacity for complex designs.
2. DSP Slices: Contains 180 DSP slices for efficient signal processing tasks.
3. Memory: Equipped with about 4,860 Kb of block RAM for data storage and buffering.
4. I/O Pins: Provides 300 user I/O pins to facilitate connectivity with other devices and systems.
5. Transceivers: Supports high-speed serial transceivers for data rates up to 6.6 Gbps.
6. Clock Management: Advanced clock management features, including multiple clock domains and PLLs.
7. Operating Temperature: Industrial-grade device with an operating temperature range of -40°C to +100°C.
8. Package: Available in a FGG676 package, which denotes a fine-pitch BGA with 676 pins.
These features make it suitable for applications in digital signal processing, communications, and embedded systems requiring high performance and low power.
Pinout
The primary function of the XC7A75T-2FGG676I is to serve as a configurable logic block for digital design applications. It offers numerous I/Os, high-speed transceivers, and DSP slices for signal processing. The "-2" denotes its speed grade, and "I" signifies an industrial-grade temperature range, which typically supports operation between -40°C to 100°C.
Overall, this FPGA is valued for its low power consumption and high performance, making it suitable for cost-sensitive applications that require efficient processing and flexibility.
Manufacturer
Application
1. Digital Signal Processing (DSP): Used in applications like wireless communication, video processing, and audio signal manipulation.
2. Data Acquisition Systems: Facilitates high-speed data capture and processing.
3. Embedded Systems: Acts as a customizable hardware platform for diverse embedded applications.
4. Industrial Automation: Supports control systems and monitoring tools.
5. Medical Devices: Used in imaging systems and diagnostic equipment.
6. Prototyping and Development: Suitable for developing and testing new hardware algorithms and systems.
These applications benefit from the FPGA's configurable logic, DSP slices, and high-speed I/O capabilities.