XC7K160T-1FFG676I

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XC7K160T-1FFG676I

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IC FPGA 400 I/O 676FCBGA

  • HerstellerAMD Xilinx

  • Herstellerteil #XC7K160T-1FFG676I

  • Paket BGA-676

  • Auf Lager6887

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Spezifikationen

Attribut Wert
Package / Case Tray
Series Kintex®-7
Part Status Active
Number of LABs/CLBs 12675
Number of Logic Elements/Cells 162240
Total RAM Bits 11980800
Number of I/O 400
Voltage - Supply 0.97V ~ 1.03V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)

Übersicht

Description

The XC7K160T-1FFG676I is a member of Xilinx's Kintex-7 FPGA family, built on a 28nm process. It features 160,000 logic cells, 12,020 Kb of block RAM, and 480 DSP slices, making it suitable for high-performance applications like signal processing, embedded systems, and communications.
The -1FFG676I suffix indicates:
- -1: Speed grade (moderate performance).
- FFG676: 676-pin flip-chip BGA package.
- I: Industrial temperature range (-40°C to +100°C).
Key interfaces include GTP/GTX transceivers (up to 12.5 Gbps), PCIe Gen2/3 support, and versatile I/O standards (LVDS, LVCMOS). It balances power efficiency and performance, ideal for cost-sensitive, mid-range designs.
For detailed specs, refer to Xilinx DS182 (Kintex-7 Overview) and UG470 (Packaging).

Equivalent

The XC7K160T-1FFG676I is a Kintex-7 FPGA from Xilinx (now AMD). Equivalent alternatives include:
- Xilinx Kintex-7 family: XC7K160T-2FFG676I (faster speed grade).
- Competitors:
- Intel (Altera) Cyclone 10 GX (e.g., 10CX085) or Arria 10 (lower-end).
- Lattice ECP5 or Certus-NX for lower power/cost.
For exact replacements, verify specs (logic cells, I/O, speed). Check AMD/Xilinx's product tables or distributors like Digi-Key for availability.

Features

The XC7K160T-1FFG676I is a Kintex-7 FPGA from Xilinx (now AMD) with key features:
- Logic Cells: 162,240
- DSP Slices: 480
- Block RAM: 12.6 Mb (540 x 36Kb)
- Transceivers: 8 GTX (6.6 Gbps each)
- I/O Pins: 400 (supports LVDS, LVCMOS, etc.)
- Package: 676-pin FineLine BGA (1.0mm pitch)
- Speed Grade: -1 (moderate performance)
- Power: Optimized for low static power
- Configuration: Supports JTAG, SPI, BPI, and multi-boot
Ideal for high-speed networking, DSP, and embedded systems.

Pinout

The XC7K160T-1FFG676I is a Kintex-7 FPGA from Xilinx (now AMD).
- Pin Count: 676 pins (FFG676 package).
- Key Functions:
- Logic Resources: ~160K logic cells, 12,620 slices.
- DSP Slices: 480 (for high-speed math operations).
- Block RAM: 12.8 Mb (445 blocks).
- I/O Pins: 400+ (supports multiple standards like LVDS, LVCMOS).
- Transceivers: Up to 16 GTX (6.6 Gbps each).
- Clock Management: 10 MMCM/PLLs.
Designed for high-performance applications like networking, DSP, and embedded systems.

Manufacturer

The XC7K160T-1FFG676I is a Kintex-7 series FPGA (Field-Programmable Gate Array) manufactured by Xilinx, now part of AMD after its acquisition in 2022.
Xilinx (AMD) is a leading semiconductor company specializing in FPGAs, adaptive SoCs, and programmable logic devices, widely used in industries like telecommunications, automotive, aerospace, and data centers.
The XC7K160T-1FFG676I is part of the Kintex-7 family, known for high performance, low power consumption, and cost-effectiveness, making it suitable for applications requiring high-speed processing and flexibility.

Application

The XC7K160T-1FFG676I, a Kintex-7 FPGA from Xilinx (now AMD), is widely used in:
- High-speed communications (5G, radar, optical networking)
- Aerospace & defense (avionics, secure comms, EW systems)
- Industrial automation (motor control, robotics, real-time processing)
- Medical imaging (ultrasound, MRI signal processing)
- Data centers (accelerators, networking, storage)
- Scientific research (high-energy physics, instrumentation)
Its high logic density, DSP slices, and 10G transceivers make it ideal for demanding, high-throughput applications.

Package

The XC7K160T-1FFG676I is a Kintex-7 FPGA from Xilinx (now AMD). It comes in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package (1FFG676). The "FFG" denotes flip-chip BGA, and "676" indicates the pin count. This package is designed for high-performance applications with fine-pitch solder balls for dense interconnects.

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