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XC7K325T-2FBG900C
+StücklisteIC FPGA 500 I/O 900FCBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC7K325T-2FBG900C
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Paket BGA-900
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Auf Lager2877
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Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Kintex®-7 |
| Part Status | Active |
| Number of LABs/CLBs | 25475 |
| Number of Logic Elements/Cells | 326080 |
| Total RAM Bits | 16404480 |
| Number of I/O | 500 |
| Voltage - Supply | 0.97V ~ 1.03V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Übersicht
Description
The "XC7K325T" indicates a Kintex-7 FPGA with approximately 325,000 logic cells. The "-2" denotes the speed grade, which influences the maximum operating speed of the device. "FBG900" specifies the package type and the number of pins—FBG indicates a fine-pitch ball grid array package, and 900 refers to the number of pins available for connectivity. The "C" at the end of the part number indicates the commercial temperature range, suitable for most general-purpose applications.
Kintex-7 FPGAs like the XC7K325T-2FBG900C provide advanced features such as high-speed transceivers, DSP slices, and abundant I/O options, making them ideal for demanding tasks while optimizing power efficiency and cost.
Equivalent
Features
1. Logic Cells and Slices: It offers approximately 326,080 logic cells, providing significant processing capabilities.
2. Block RAM: The FPGA includes 445 block RAMs, offering a total of 16,020 Kb of storage for data buffering and temporary storage.
3. DSP Slices: It contains 840 DSP slices, ideal for digital signal processing tasks, including multiply and accumulate operations.
4. I/O Pins: The device supports up to 500 user I/O pins, enabling extensive connectivity options.
5. Clock Management: It offers advanced clock management features, including multiple clock domains and phase-locked loop (PLL) support.
6. Transceivers: The FPGA is equipped with 16.3 Gbps transceivers, suitable for high-speed serial connectivity.
7. Power Optimization: Built on a 28nm process, it provides a balance of performance and power efficiency.
8. Package: It comes in a 900-ball BGA package.
The Kintex-7 series targets applications in communications, automotive, industrial, and more, offering a balance of performance, power, and cost.
Pinout
The XC7K325T FPGA is designed for high-performance and logic-intensive applications, offering a balance between cost and performance. It features a significant number of logic cells, block RAM, DSP slices, and high-speed transceivers, making it suitable for diverse applications such as communications, signal processing, and embedded systems.
For detailed pin functions and specific configurations, referring to the datasheet or user guide provided by Xilinx is recommended. This document will offer insights into the exact pin assignments and their functionalities based on the user's application requirements.
Manufacturer
Application
1. Telecommunications: Used in networking equipment for data processing and communication protocols.
2. Broadcasting: Facilitates video processing and transmission.
3. Aerospace and Defense: Employed in radar and signal processing systems.
4. Industrial Automation: Supports motor control and machine vision.
5. Medical Imaging: Enables high-speed image processing.
6. High-Performance Computing: Assists in data centers and scientific research for accelerated computing tasks.
7. Consumer Electronics: Powers advanced multimedia devices and gaming systems.
These areas leverage the FPGA’s reconfigurable architecture and parallel processing capabilities.