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XC7K325T-2FFG900I
+StücklisteIC FPGA 500 I/O 900FCBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC7K325T-2FFG900I
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Paket FBGA-900
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Auf Lager3384
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Kintex®-7 |
| Part Status | Active |
| Number of LABs/CLBs | 25475 |
| Number of Logic Elements/Cells | 326080 |
| Total RAM Bits | 16404480 |
| Number of I/O | 500 |
| Voltage - Supply | 0.97V ~ 1.03V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key features include:
1. Logic Cells: It contains approximately 325,000 logic cells, providing significant processing capability for complex designs.
2. Performance: The "-2" in its designation indicates the speed grade, which affects the maximum clock frequency and overall performance of the device.
3. Package: The FFG900 package entails a 900-ball fine-pitch ball grid array, supporting high-density and high-performance applications.
4. Temperature Range: The "I" signifies that this FPGA is industrial-grade, capable of operating in a temperature range suitable for harsh environments.
5. Power Efficiency: Designed with low power consumption in mind, it supports high-performance applications without excessive energy use.
The XC7K325T is ideal for applications that require high throughput and processing power while maintaining a cost-effective solution.
Equivalent
Features
1. Logic Cells: Approximately 326,080 logic cells, providing substantial capacity for complex designs.
2. DSP Slices: 840 DSP slices for high-speed digital signal processing tasks.
3. Block RAM: 16.2 Mb of block RAM for data storage, offering efficient memory utilization.
4. I/O Pins: 500 I/O pins, allowing for extensive connectivity and interface options.
5. Serial Transceivers: 16 GTH transceivers with data rates up to 12.5 Gbps, enabling high-speed serial communication.
6. Clock Management: Features multiple clock management tiles for precise and flexible clock management.
7. Process Technology: Built on a 28nm process, balancing performance and power efficiency.
8. Temperature Range: Industrial-grade temperature range, suitable for harsh environments.
9. Packaging: Offered in an FFG900 package.
These features make the XC7K325T ideal for applications like wireless communication, video processing, and industrial automation.
Pinout
Key functions and features of the XC7K325T-2FFG900I include:
1. Logic Resources: It offers around 326,080 logic cells.
2. DSP Slices: It contains 840 DSP slices, supporting complex mathematical operations.
3. Block RAM: Approximately 16,020 Kb of block RAM is available for efficient data storage.
4. I/O Pins: It provides extensive I/O capabilities, supporting various I/O standards for versatile connectivity.
5. Transceivers: Includes high-speed serial transceivers to facilitate fast data transmission.
This FPGA is suitable for applications requiring substantial parallel processing power and high-speed data handling, such as video processing, communications, and industrial automation systems.