XC7K325T-3FFG900E

Abbildungen dienen nur als Referenz

XC7K325T-3FFG900E

+Stückliste

IC FPGA 500 I/O 900FCBGA

  • HerstellerAMD Xilinx

  • Herstellerteil #XC7K325T-3FFG900E

  • Paket BGA-900

  • Auf Lager1953

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

Originalproduktgarantie

Spezifikationen

Attribut Wert
Package / Case Tray
Series Kintex®-7
Part Status Active
Number of LABs/CLBs 25475
Number of Logic Elements/Cells 326080
Total RAM Bits 16404480
Number of I/O 500
Voltage - Supply 0.97V ~ 1.03V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 100°C (TJ)

Übersicht

Description

The XC7K325T-3FFG900E is a member of Xilinx's Kintex-7 FPGA family, built on a 28nm process. It features 326,080 logic cells, 16,020 Kb of block RAM, and 840 DSP slices, making it suitable for high-performance applications like signal processing, embedded systems, and communications.
The -3FFG900E suffix indicates:
- Speed grade -3 (moderate performance).
- FFG900 package (900-pin flip-chip BGA).
- Extended temperature range (E) for industrial use.
Key features include:
- High-speed serial transceivers (up to 12.5 Gbps).
- PCIe Gen2/3 support.
- Low power consumption compared to older FPGAs.
Ideal for mid-range designs requiring a balance of performance, power, and cost.

Equivalent

The XC7K325T-3FFG900E is a Kintex-7 FPGA from Xilinx (now AMD). Equivalent alternatives include:
- Xilinx Kintex-7 family: XC7K410T, XC7K355T (similar performance, varying resources).
- Intel (Altera): Stratix IV EP4SGX230 or Cyclone 10 GX 10CX085 (different architectures, comparable logic).
- Lattice Semiconductor: ECP5-85F (lower-end alternative).
For exact replacements, consider newer AMD/Xilinx Ultrascale or Versal series for higher performance. Always verify specs for compatibility.

Features

The XC7K325T-3FFG900E is a Kintex-7 FPGA from Xilinx (now AMD) with key features:
- Logic Cells: 326,080
- DSP Slices: 840 (18x25 multipliers)
- Block RAM: 16,020 Kb (445 blocks)
- Transceivers: 16 GTX (6.6 Gbps each)
- I/O Pins: 500 (supports LVDS, LVCMOS, etc.)
- Package: 900-ball FFG (Fine-Pitch BGA)
- Speed Grade: -3 (performance-optimized)
- Power: ~3.5W typical (varies with design)
- Process: 28nm HP (High Performance)
Ideal for high-speed processing, wireless, and embedded systems.

Pinout

The XC7K325T-3FFG900E is a Kintex-7 FPGA from Xilinx (now AMD).
- Pin Count: 900 pins (FFG900 package, Fine-Pitch Ball Grid Array).
- Key Functions:
- Logic Cells: 326,080
- DSP Slices: 840
- Block RAM: 16,020 Kb
- High-speed I/O: Supports GTP/GTX transceivers (up to 12.5 Gbps).
- Configuration: JTAG, SPI, BPI, or SelectMAP.
- Power: Multiple voltage rails (core, I/O banks, transceivers).
Designed for high-performance applications like networking, DSP, and embedded systems.

Application

The XC7K325T-3FFG900E, a Kintex-7 FPGA from Xilinx (now AMD), is widely used in:
1. High-Speed Communications – 10G/40G/100G networking, baseband processing.
2. Aerospace & Defense – Radar, EW, and secure communications.
3. Industrial Automation – Real-time control, motor drives, and vision systems.
4. Medical Imaging – Ultrasound, MRI, and high-speed data processing.
5. Scientific Research – High-energy physics and signal processing.
6. Broadcast & Pro AV – 4K video processing and compression.
Its 325K logic cells, high-speed transceivers (6.6Gbps), and DSP slices make it ideal for compute-intensive, low-latency applications.

Package

The XC7K325T-3FFG900E is a Kintex-7 FPGA from Xilinx (now AMD). It comes in a 900-ball Fine-Pitch Ball Grid Array (FBGA) package with a 3FFG900E designation. The "FFG" indicates flip-chip packaging, "900" denotes the ball count, and "E" signifies an extended temperature range (-40°C to +100°C). This package supports high-performance applications with robust thermal and electrical characteristics.

Produkte, die mit XC7K325T-3FFG900E zusammenhängen

  • Schnellangebot

  • Senden Sie Ihre Angebotsanfrage für XC7K325T-3FFG900E Mit diesem Formular können Sie uns innerhalb von 12 Stunden kontaktieren.