Abbildungen dienen nur als Referenz
XC7K410T-2FFG676I
+StücklisteIC FPGA 400 I/O 676FCBGA
-
HerstellerAMD Xilinx
-
Herstellerteil #XC7K410T-2FFG676I
-
Paket BGA-676
-
Auf Lager2727
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Kintex®-7 |
| Part Status | Active |
| Number of LABs/CLBs | 31775 |
| Number of Logic Elements/Cells | 406720 |
| Total RAM Bits | 29306880 |
| Number of I/O | 400 |
| Voltage - Supply | 0.97V ~ 1.03V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
The "-2" denotes the speed grade, indicating its performance level, while "FFG676" specifies the package type and pin count, with FFG indicating a flip-chip ball grid array and 676 being the total number of pins. The "I" at the end signifies the industrial temperature range, supporting operation in more demanding environments.
Key features include advanced signal processing capabilities, high-speed transceivers, and extensive DSP resources, making it suitable for a variety of high-bandwidth applications. The Kintex-7 architecture balances performance and power efficiency, offering robust design flexibility. It's supported by Xilinx's Vivado Design Suite for development and implementation.
Equivalent
1. Altera's (now Intel) Stratix V series.
2. Lattice Semiconductor's ECP5 series.
3. Microsemi's (now Microchip) SmartFusion2 or IGLOO2 FPGAs.
Each brand and series may have specific variations, so it's essential to compare exact specifications and performance features to ensure compatibility.
Features
1. Logic Resources: It contains 406,720 logic cells, which are used to implement complex digital circuits.
2. DSP Slices: It offers 1,540 DSP slices, which are optimal for high-performance digital signal processing applications.
3. Memory: The device includes 28,620 Kbits of block RAM, facilitating efficient data storage and access.
4. I/O Pins: The FPGA supports up to 400 user I/O pins for external interfacing.
5. Performance: Operates with a speed grade of -2, balancing power consumption and performance.
6. Package: Housed in a flip-chip fine-pitch ball grid array (FCBGA) package with 676 pins, enhancing connectivity and thermal performance.
7. Temperature Range: The 'I' suffix indicates industrial-grade, supporting an operating temperature range of -40°C to 100°C.
8. Power Efficiency: Offers a blend of performance with power efficiency, suitable for demanding applications.
This FPGA is ideal for applications requiring mid-range performance and high DSP capabilities, such as communications, video processing, and industrial systems.
Pinout
The XC7K410T FPGA is designed for high-performance applications and includes a variety of functional resources:
1. Logic Cells: It contains a significant number of logic cells for implementing complex digital circuits.
2. DSP Slices: Equipped with DSP slices for high-performance digital signal processing tasks.
3. Block RAM: Provides on-chip memory blocks for data storage and processing.
4. I/O Pins: Offers a range of I/O pins with support for various I/O standards for interfacing with other components.
5. Clock Management: Features advanced clock management capabilities, including PLLs and mixed-mode clock managers.
6. Transceivers: Includes high-speed transceivers for serial communication.
This FPGA is suitable for applications requiring high-speed processing, flexibility, and efficient power consumption, such as telecommunications, video processing, and high-end consumer electronics.