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XC7K410T-2FFG900I
+StücklisteIC FPGA 500 I/O 900FCBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC7K410T-2FFG900I
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Paket FBGA-900
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Auf Lager1770
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Kintex®-7 |
| Part Status | Active |
| Number of LABs/CLBs | 31775 |
| Number of Logic Elements/Cells | 406720 |
| Total RAM Bits | 29306880 |
| Number of I/O | 500 |
| Voltage - Supply | 0.97V ~ 1.03V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key specifications include approximately 410,000 logic cells, over 1,540 DSP slices for efficient signal processing, and numerous I/O pins to support versatile connectivity options. It also supports high-speed GTP transceivers, enabling efficient data transmission.
The "-2" in its name indicates its speed grade, offering a good trade-off between performance and power efficiency. The "FFG900" denotes its package type and pin count, and the "I" specifies its industrial-grade temperature range, making it suitable for harsh environments.
Overall, the XC7K410T-2FFG900I is engineered for applications demanding high computational power, flexibility, and reliability while maintaining operational efficiency.
Equivalent
1. Intel (Altera) Stratix V series
2. Intel (Altera) Arria 10 series
3. Lattice ECP5 series
These FPGAs offer similar logic density and performance characteristics, but specific equivalency depends on the application requirements. Always compare specifications to ensure compatibility with your project needs.
Features
1. Logic Resources: It offers 406,720 logic cells, suitable for complex designs.
2. DSP Slices: Incorporates 1,540 DSP slices, ideal for signal processing tasks.
3. Memory: Features 28,620 Kbits of Block RAM for data storage and processing.
4. Transceivers: It includes 16 GTX transceivers, each capable of data rates up to 12.5 Gbps, facilitating high-speed serial communication.
5. I/O Pins: Provides a total of 500 user I/O pins, allowing for extensive interfacing capabilities.
6. Package: Comes in a FFG900 package, which denotes a Flip-Chip Ball Grid Array with 900 pins.
7. Speed Grade: A speed grade of "-2" indicates a balance between performance and power consumption.
8. Industrial Grade: The 'I' in the part number denotes that it is rated for industrial temperature ranges, ensuring reliability in harsh environments.
These features make it suitable for a range of applications including digital signal processing, high-speed networking, and aerospace systems.
Pinout
Key functions and features of the XC7K410T-2FFG900I include:
- Logic Cells: It contains approximately 410,000 logic cells, enabling complex digital circuitry and parallel processing.
- I/O Pins: Supports a variety of I/O standards with over 500 user I/Os.
- Memory: Includes block RAM, providing substantial on-chip memory.
- Transceivers: High-speed serial transceivers support data rates up to 12.5 Gbps.
- DSP Slices: Contains dedicated digital signal processing slices for efficient computation.
The device is well-suited for applications requiring high speed and reliability, leveraging advanced 28 nm process technology to achieve superior performance metrics.