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XC7S25-1FTGB196I
+StücklisteIC FPGA 100 I/O 196CSBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC7S25-1FTGB196I
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Paket CSBGA-196
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Auf Lager3272
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
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Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package | Tray |
| Series | Spartan®-7 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1825 |
| NumberofLogicElements/Cells | 23360 |
| TotalRAMBits | 1658880 |
| NumberofI/O | 100 |
| Voltage-Supply | 0.95V ~ 1.05V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 196-LBGA, CSPBGA |
Übersicht
Description
The device features 23,360 logic cells and offers a range of I/O options, making it versatile for various interfacing needs. It is housed in a 196-ball Fine-Pitch Ball Grid Array (FBGA) package, which is compact and suitable for space-constrained applications.
The "-1" denotes its speed grade, and the "I" suffix indicates that it is rated for industrial temperature ranges, typically -40°C to +100°C, ensuring reliability in harsh environments. This FPGA supports advanced features like block RAM, DSP slices, and a MicroBlaze soft processor, enhancing its capabilities for complex designs.
Overall, the XC7S25-1FTGB196I is ideal for applications requiring a cost-effective FPGA solution with moderate logic density and industrial-grade performance.
Equivalent
Features
1. Logic Cells: Approximately 23,360 logic cells.
2. DSP Slices: 80 DSP slices, suitable for digital signal processing tasks.
3. Block RAM: 1,620 Kb of block RAM, useful for data storage and buffering.
4. I/O Pins: Offers 150 general-purpose I/O pins.
5. Operating Temperature: Industrial grade, supporting a temperature range from -40°C to +100°C.
6. Package: Comes in a 196-pin FTGB (Flip-Chip Ball Grid Array) package.
7. Power Efficiency: Designed for low power consumption, making it suitable for power-sensitive applications.
8. Performance: Built on a 28nm process technology, providing a balance of performance, power, and cost.
9. Security: Includes secure boot features and bitstream encryption.
This FPGA is well-suited for applications in the automotive, industrial, and consumer electronics sectors where efficient performance and reliability are critical.
Pinout
Manufacturer
As part of AMD, the company's focus continues on producing a range of high-performance computing, graphics, and visualization technologies. The integration of Xilinx into AMD allows for an expanded portfolio that includes data center solutions, artificial intelligence, and embedded systems, enhancing the capabilities of both consumer and enterprise solutions. The combined expertise of AMD and Xilinx aims to drive innovation across industries such as automotive, 5G telecommunications, aerospace, and defense, solidifying its role as a leading provider of advanced semiconductor technology.
Application
1. Embedded Vision Systems: Used in image processing and video analytics.
2. Industrial Automation: Suitable for control systems, robotics, and machine vision.
3. Communications: Implements protocols and data processing in wired and wireless communication devices.
4. Consumer Electronics: Enhances functionality in smart devices and wearables.
5. Medical Devices: Provides custom processing in portable and diagnostic equipment.
6. Automotive: Assists in infotainment systems and advanced driver-assistance systems (ADAS).
These areas benefit from its low power consumption, high performance, and flexibility.