XC7S25-2CSGA225I

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XC7S25-2CSGA225I

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IC FPGA 150 I/O 225CSGA

  • HerstellerAMD Xilinx

  • Herstellerteil #XC7S25-2CSGA225I

  • Paket CSBGA-225

  • Auf Lager3419

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Attribut Wert
Package / Case Tray
Series Spartan®-7
Part Status Active
Number of LABs/CLBs 1825
Number of Logic Elements/Cells 23360
Total RAM Bits 1658880
Number of I/O 150
Voltage - Supply 0.95V ~ 1.05V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)

Übersicht

Description

The XC7S25-2CSGA225I is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-7 family, designed for applications that require cost-effectiveness and low power consumption. The "-2" indicates the speed grade, while "CSGA225I" refers to its package type and industrial temperature range.
This FPGA features 23,360 logic cells and offers a balance of performance, logic density, and power efficiency, making it suitable for a variety of applications, including consumer electronics, communications, and industrial automation. It includes DSP slices, block RAM, and high-speed connectivity options, such as I/O pins that support various signaling standards. The Spartan-7 series is built on a 28nm process technology, which contributes to its low power and high performance.
The XC7S25-2CSGA225I can be programmed using Xilinx's Vivado Design Suite, enabling developers to customize the logic design and optimize the FPGA for specific tasks. Its robust design and features make it an ideal choice for projects that require reliable performance in demanding environments.

Equivalent

The XC7S25-2CSGA225I is a part of the Xilinx Spartan-7 FPGA family. Equivalent products could include other FPGAs with similar logic cell count and features from other manufacturers like Intel's (formerly Altera) Cyclone V series or Lattice's ECP5 series. Specific models might include the Intel Cyclone V 5CEBA2 or the Lattice ECP5 LFE5U-25. It's important to compare specifications like logic elements, I/O count, power consumption, and package type for direct equivalency.

Features

The XC7S25-2CSGA225I is a member of the Xilinx Spartan-7 FPGA family, known for its efficient performance and low power consumption. Key features include:
1. Logic Cells: It contains approximately 23,360 logic cells.
2. Configurable Logic Blocks (CLBs): Utilizes a flexible CLB architecture for optimized logic design.
3. I/O Pins: Supports up to 150 user I/O pins, providing ample connectivity options.
4. Block RAM: Includes 1,620 Kbits of block RAM for advanced memory functions.
5. DSP Slices: Features 80 DSP slices for efficient signal processing operations.
6. Clock Management: Equipped with Clock Management Tiles (CMTs) to aid in clock signal handling.
7. Operating Temperature: Rated for industrial temperatures, from -40°C to +100°C, making it suitable for harsh environments.
8. Power Supply: Operates on a 1.0V core voltage for reduced power usage.
9. Package: Comes in a 225-ball grid array (BGA) package with a compact footprint.
10. Advanced I/O Features: Supports various I/O standards and supports DDR3 memory interfaces.
These features make the XC7S25-2CSGA225I ideal for cost-sensitive applications requiring robust computing power and versatile interfacing.

Pinout

The XC7S25-2CSGA225I is a part of the Xilinx Spartan-7 FPGA family. It comes in a CSGA225 package, which has a pin count of 225. The Spartan-7 series is designed for cost-sensitive applications that require high performance and low power consumption. These FPGAs are utilized in a wide range of applications, including industrial, consumer, and automotive markets.
The primary functions of the XC7S25-2CSGA225I include:
1. Programmability: It allows users to implement custom logic designs.
2. High I/O Flexibility: Offers multiple I/O standards and configurations.
3. Performance: Provides an optimal balance between performance and power efficiency.
4. Integration: Incorporates a variety of hard IP blocks, including DSP slices and high-speed serial connectivity.
5. Low Power: Designed to minimize power consumption, suitable for energy-efficient applications.
The "I" at the end of the part number indicates that it is rated for industrial temperature ranges. The "-2" denotes the speed grade, affecting performance characteristics such as maximum clock frequency.

Manufacturer

The XC7S25-2CSGA225I is manufactured by Xilinx, Inc., which is a company that specializes in designing and developing devices like field-programmable gate arrays (FPGAs), system-on-chips (SoCs), and associated software. Xilinx is known for its role in the semiconductor industry, providing programmable logic devices that enable hardware designers to customize their circuit designs after manufacturing. This flexibility is particularly valuable in industries such as telecommunications, aerospace, and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), a larger American multinational semiconductor company, which expanded its reach and capabilities in the field of adaptive computing.

Application

The XC7S25-2CSGA225I is a part of the Xilinx Spartan-7 FPGA family, designed for cost-sensitive applications that require high performance and low power consumption. Key application areas include:
1. Consumer Electronics: Used in devices requiring flexible processing power.
2. Automotive: Supports in-vehicle infotainment and driver assistance systems.
3. Industrial Automation: Ideal for control systems, robotics, and sensor interfacing.
4. IoT Devices: Facilitates connectivity and edge processing.
5. Communications: Used in wireless and wired networking equipment.
6. Medical Devices: Supports portable and diagnostic equipment.
7. Aerospace and Defense: Suitable for secure, reliable processing in rugged environments.
These applications leverage its programmable logic and adaptability to various protocols and standards.

Package

The XC7S25-2CSGA225I is a Xilinx Spartan-7 FPGA featuring a ball grid array package type known as "CSGA225." This package has 225 solder balls arranged in a grid and is suitable for surface mounting on a circuit board. It offers a compact form factor ideal for high-density applications.

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