XC7S50-1FTGB196C

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XC7S50-1FTGB196C

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IC FPGA 100 I/O 196CSBGA

  • HerstellerAMD Xilinx

  • Herstellerteil #XC7S50-1FTGB196C

  • Paket LBGA-196

  • Auf Lager3026

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Spezifikationen

Attribut Wert
Supplier AMD Xilinx
Package / Case Tray
Series Spartan®-7
Part Status Active
Number of LABs/CLBs 4075
Number of Logic Elements/Cells 52160
Total RAM Bits 2764800
Number of I/O 100
Voltage - Supply 0.95V ~ 1.05V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)

Übersicht

Description

XC7S50-1FTGB196C is an Artix-7 FPGA from Xilinx (AMD) at mid density. It’s designed for low power, cost‑sensitive designs with a balance of logic, memory, and DSP resources.
- Package: 196‑pin BGA (FTGB196), commercial temperature range, speed grade -1 (fastest).
- Fabric: LUT-based logic, flip-flops, distributed RAM, block RAM, DSP slices, and clock management via PLLs.
- I/O: multiple banks with various voltage standards for flexible external interfaces.
- Typical uses: embedded controllers, motor control, data acquisition, USB bridging, and other mid‑range FPGA applications.
- Tooling: use Xilinx Vivado (WebPACK or full), plus the 7‑series device files and IP; consult the datasheet and user guide for exact numbers and constraints.
- Start tips: verify I/O bank pinout and voltage requirements, plan configuration (JTAG or external flash), and leverage available IP blocks for speedier design.
Note: for exact resource counts (logic cells, BRAM, DSP slices) and package pinout, refer to the XC7S50 datasheet and user guide.

Features

Here are the key features of XC7S50-1FTGB196C (Spartan-7 S50 FPGA, 196-pin FTGB196 package):
- FPGA fabric: Spartan-7 with around 50K logic cells (LEs) for cost‑effective, low‑power designs
- I/O: dense I/O in a 196‑pin Fine‑Pitch BGA package, multiple I/O banks, 3.3V tolerant I/O
- Clocking: built‑in PLLs and robust clock routing for flexible, reliable timing
- Resources: DSP slices, block RAM/distributed RAM for data path and storage
- Performance: optimized for low power, small form factor applications
- I/O standards: supports common logic standards (LVCMOS/LVTTL, etc.) across banks
- Configuration: diverse boot options (Serial/Quad SPI, SelectMAP, etc.)
- Security: bitstream encryption and related security features
- Packaging: XF-196 pin FG-BGA package suitable for compact, high‑density boards
Note: exact BRAM counts, DSP block numbers, and speed grade specifics are in the datasheet; verify for final design requirements.

Pinout

- Pin count: 196 pins (FTGB196 package)
- Function: Xilinx Artix-7 FPGA (XC7S50) with ~50K logic cells, used for general digital logic, I/O, memory blocks, DSP, etc.

Manufacturer

- Manufacturer: Xilinx, Inc. (now a subsidiary of AMD)
- What kind of company: An American multinational semiconductor company that designs and manufactures programmable logic devices, notably FPGAs and CPLDs, along with the associated software tools.

Application

XC7S50-1FTGB196C is a mid‑density Artix‑7 FPGA in a compact 196‑pin package, optimized for low power and cost. Typical application areas:
- Automotive electronics (body controllers, sensors, cockpit/HMI)
- Industrial automation and motor control
- Edge networking and communications (gateways, front‑end processing)
- Consumer electronics and multimedia signal processing
- Medical devices and portable instrumentation
- Data acquisition, measurement, and test equipment
- Embedded/prototyping platforms and custom peripheral interfaces
These use cases leverage its moderate logic density, DSP/SIMD blocks, and I/O for real‑time, cost‑effective FPGA solutions.

Package

XC7S50-1FTGB196C uses the FTGB196 package: a fine-pitch BGA with 196 balls, commercial temperature range.

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