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XC7S50-2CSGA324I
+StücklisteIC FPGA 210 I/O 324CSBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC7S50-2CSGA324I
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Paket LFBGA-324
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Auf Lager3693
365 Tage Qualitätsgarantie
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Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Spartan®-7 |
| Part Status | Active |
| Number of LABs/CLBs | 4075 |
| Number of Logic Elements/Cells | 52160 |
| Total RAM Bits | 2764800 |
| Number of I/O | 210 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Operating at a speed grade of -2, the XC7S50 offers a balance between performance and power efficiency. The device supports a wide range of I/O standards and features, such as high-speed serial transceivers, advanced clock management, and DSP slices, which enhance signal processing capabilities. The Spartan-7 series devices are supported by Xilinx’s Vivado Design Suite, facilitating efficient design and implementation processes.
The "I" suffix indicates industrial-grade temperature range support, allowing the device to function reliably in harsher environments. Overall, the XC7S50-2CSGA324I provides a versatile solution for designers needing an affordable yet capable FPGA for diverse applications.
Equivalent
1. Altera (now Intel) Cyclone V series like 5CEFA5.
2. Lattice ECP5 series like LFE5UM-45F.
3. Microsemi (now Microchip) IGLOO2 series like M2GL090.
These alternatives offer similar capabilities in terms of logic elements and I/O features but may vary in specific performance characteristics like power consumption and speed. Always verify the compatibility based on your application's requirements.
Features
1. Logic Cells: Approximately 52,160 logic cells for versatile design implementation.
2. Configurable Logic Blocks: Includes 6-input Look-Up Tables (LUTs) for efficient logic functions.
3. DSP Slices: 120 DSP slices for high-performance arithmetic operations.
4. Memory: 2,700 Kbits of block RAM for data storage and processing.
5. I/O Pins: Up to 210 user I/O pins in a 324-ball Fine-Pitch Ball Grid Array (FBGA) package.
6. Operating Temperature: Industrial-grade temperature range, denoted by the 'I' suffix.
7. Performance: -2 speed grade, indicating mid-range performance.
8. Power: Designed for low power consumption, suitable for various applications.
9. Connectivity: Support for various interfaces and protocols, enhancing design flexibility.
10. Security: Features built-in security for protection against tampering and cloning.
These features make the XC7S50-2CSGA324I suitable for applications in consumer electronics, industrial automation, and more, where cost-efficiency and performance are essential.
Pinout
Key functions and features of the XC7S50-2CSGA324I include:
1. Logic Cells: It has 52,160 logic cells, enabling complex designs.
2. I/O Pins: This model has a significant number of general-purpose I/O pins for flexible interfacing with other components.
3. Block RAM: Provides 2,700 Kb of block RAM for efficient data storage.
4. DSP Slices: Equipped with 120 DSP slices for high-speed arithmetic and signal processing operations.
5. Clock Management: Includes features for clock management and routing, essential for synchronous designs.
6. Performance and Power Efficiency: Operates efficiently within a range of applications due to its balance of performance and power consumption.
Overall, the XC7S50-2CSGA324I is suited for applications that require moderate logic density and I/O flexibility.
Manufacturer
Founded in 1984 and headquartered in San Jose, California, Xilinx has played a pioneering role in the field of programmable logic. It offers a wide range of products that are used in various applications, including data centers, wireless communications, automotive technology, aerospace, and defense.
In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), a multinational semiconductor company, in a deal that was finalized in 2022. This acquisition has positioned AMD to strengthen its portfolio and expand its capabilities in adaptive computing solutions.
Application
1. Industrial Automation: Used for control systems, motor drives, and monitoring applications.
2. Consumer Electronics: Supports video processing, image enhancement, and interface bridging.
3. Automotive: Enables ADAS, infotainment systems, and vehicle networking.
4. Communications: Facilitates protocol bridging, data aggregation, and network processing.
5. Medical Devices: Utilized in diagnostic imaging, patient monitoring, and portable medical equipment.
6. Aerospace and Defense: Offers solutions for radar, avionics, and secure communications.
These applications leverage its low power consumption, high performance, and adaptability.