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XC7S75-2FGGA676I
+StücklisteIC FPGA 400 I/O 676FPBGA
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HerstellerAMD
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Herstellerteil #XC7S75-2FGGA676I
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Auf Lager3351
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Spezifikationen
| Attribut | Wert |
| Series | Spartan®-7 |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Number of Logic Elements / Cells | 76800 |
| Total RAM Bits | 4331520 |
| Number of I/O | 400 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-FPBGA (27x27) |
| Base Product Number | XC7S75 |
| Number of LA Bs / CL Bs | 6000 |
Übersicht
Description
Key features include advanced power management capabilities, up to 1.2 Mbits of block RAM, and an array of digital signal processing (DSP) slices for efficient signal manipulation. The 676-ball Fine Pitch Ball Grid Array (FBGA) package provides a compact and reliable form factor suitable for space-constrained designs.
The Spartan-7 series is well-suited for applications in automotive, industrial, and consumer electronics, leveraging Xilinx's Vivado Design Suite for development, which simplifies design, verification, and implementation. Overall, the XC7S75-2FGGA676I serves as an effective solution for engineers seeking flexibility and performance in their FPGA designs.
Equivalent
1. XC7S100 - Higher logic resources.
2. XC7S50 - Lower logic resources.
3. Lattice ICE40 - A lower-power alternative.
4. Intel MAX 10 - For similar applications, though with different architecture.
For direct comparisons, consider specific requirements like I/O count, power consumption, and application needs.
Features
1. Logic Cells: Contains 75K logic cells with a flexible architecture for complex designs.
2. DSP Slices: Offers 30 DSP slices for efficient digital signal processing.
3. Block RAM: Includes up to 4.9 Mb of block RAM for data storage.
4. I/O Pins: Provides 676 I/O pins with support for various I/O standards, enabling interface flexibility.
5. Speed Grade: Operates at speed grade -2, ensuring reliable performance.
6. Power Efficiency: Designed for low power consumption, making it ideal for battery-operated devices.
7. Configuration Options: Supports various configuration methods, including JTAG and SPI.
8. Embedded Features: Supports embedded system design with integrated clock management and system monitoring.
This FPGA is suitable for applications in automotive, industrial control, and consumer electronics, offering a balance of performance and cost.
Pinout
The primary functions of the XC7S75 include providing programmable logic resources, digital signal processing capabilities, and I/O interfaces. It supports a wide range of I/O standards and configurations, making it suitable for various applications, including embedded systems, communications, and image processing. The device features up to 75,000 logic cells, allowing for complex designs and a versatile range of applications.
Key features include:
- 676 package pins
- 75,000 logic cells
- Multiple I/O configurations and standards
- Integrated block RAM and DSP slices
Overall, the XC7S75 is designed to deliver performance, power efficiency, and flexibility for a variety of digital design tasks.
Manufacturer
Application
1. Embedded Systems: For real-time processing and control tasks.
2. Industrial Automation: In factory automation, robotics, and motor control.
3. Consumer Electronics: For video processing and signal acceleration.
4. Automotive: In advanced driver-assistance systems (ADAS) and infotainment.
5. Communications: Enabling data processing in telecommunications and networking.
6. Medical Devices: For imaging and diagnostic equipment.
Its low power consumption and cost-effectiveness make it suitable for these diverse applications.