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XC7VX485T-2FFG1157I
+StücklisteIC FPGA 600 I/O 1157FCBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC7VX485T-2FFG1157I
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Paket FBGA-1157
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Auf Lager5337
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Virtex®-7 XT |
| Part Status | Active |
| Number of LABs/CLBs | 37950 |
| Number of Logic Elements/Cells | 485760 |
| Total RAM Bits | 37969920 |
| Number of I/O | 600 |
| Voltage - Supply | 0.97V ~ 1.03V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key features include:
1. Logic Resources: It provides around 485,760 logic cells, which allows for complex designs and computational tasks.
2. I/O and Interfaces: The chip supports a variety of high-speed I/O standards, making it versatile for different interface requirements.
3. Memory: It includes abundant block RAM for data buffering and storage, crucial for high-speed data processing.
4. DSP Slices: Over 2,800 DSP slices are available, ideal for signal processing applications like digital communication and image processing.
5. Power Efficiency: Despite its high performance, it maintains a low power profile relative to its capabilities.
6. Form Factor: Packaged in a FFG1157 package, it fits on standard PCBs, facilitating integration in larger systems.
This FPGA is suitable for applications in telecommunications, aerospace, defense, and high-performance computing due to its scalability and advanced feature set.
Equivalent
Features
1. Logic Resources: It has around 485,760 logic cells, providing substantial capacity for complex designs.
2. Memory: Features 37,680 Kb of block RAM, catering to significant on-chip data storage requirements.
3. DSP Slices: Equipped with 2,800 DSP slices, ideal for high-performance signal processing tasks.
4. I/O Capacity: Offers multiple high-speed I/O options, with 600 user I/O pins for versatile connectivity.
5. Transceivers: Includes 28 GTH transceivers, supporting up to 13.1 Gbps, suitable for high-speed serial communication.
6. Clock Management: Integrated clock management tiles for advanced clocking capabilities.
7. Operating Temperature: Designed for industrial applications, with an operating temperature range of -40°C to +100°C.
8. Package: Comes in an FFG1157 package, which is a flip-chip ball grid array format for efficient heat dissipation and performance.
These features make the XC7VX485T-2FFG1157I suitable for demanding applications in sectors like telecommunications, defense, and computing.
Pinout
Key functions of the XC7VX485T include:
1. Logic Cells: It has a large number of logic cells for complex computations.
2. DSP Slices: Provides efficient digital signal processing capabilities.
3. Block RAM: Includes substantial on-chip memory for data storage.
4. I/O Options: Supports various high-speed I/O standards for connectivity.
5. Transceivers: Integrated high-speed serial transceivers for data communication.
6. Configurable Logic Blocks (CLBs): Fundamental building blocks for implementing customized logic.
These features make it suitable for applications in communications, aerospace, and defense sectors, where high performance and flexibility are crucial.
Manufacturer
Application
1. High-Performance Computing (HPC): Ideal for data-intensive tasks and simulations.
2. Telecommunications: Supports high-speed data processing in network infrastructure.
3. Aerospace and Defense: Used in radar systems, signal processing, and secure communications.
4. Broadcast and Video Processing: Facilitates real-time video encoding, decoding, and streaming.
5. Medical Imaging: Enhances image processing capabilities in diagnostic equipment.
6. Finance: Accelerates algorithmic trading and risk analysis.
Its high logic density and fast processing capabilities make it suitable for any application requiring intensive parallel processing and high-speed data throughput.