XC7VX485T-2FFG1157I

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XC7VX485T-2FFG1157I

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IC FPGA 600 I/O 1157FCBGA

  • HerstellerAMD Xilinx

  • Herstellerteil #XC7VX485T-2FFG1157I

  • Paket FBGA-1157

  • Auf Lager5337

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Attribut Wert
Package / Case Tray
Series Virtex®-7 XT
Part Status Active
Number of LABs/CLBs 37950
Number of Logic Elements/Cells 485760
Total RAM Bits 37969920
Number of I/O 600
Voltage - Supply 0.97V ~ 1.03V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)

Übersicht

Description

The XC7VX485T-2FFG1157I is part of Xilinx's Virtex-7 FPGA family, designed to deliver high performance and capacity for demanding applications. It is built using 28nm process technology, offering a balance of power efficiency and processing capability.
Key features include:
1. Logic Resources: It provides around 485,760 logic cells, which allows for complex designs and computational tasks.
2. I/O and Interfaces: The chip supports a variety of high-speed I/O standards, making it versatile for different interface requirements.
3. Memory: It includes abundant block RAM for data buffering and storage, crucial for high-speed data processing.
4. DSP Slices: Over 2,800 DSP slices are available, ideal for signal processing applications like digital communication and image processing.
5. Power Efficiency: Despite its high performance, it maintains a low power profile relative to its capabilities.
6. Form Factor: Packaged in a FFG1157 package, it fits on standard PCBs, facilitating integration in larger systems.
This FPGA is suitable for applications in telecommunications, aerospace, defense, and high-performance computing due to its scalability and advanced feature set.

Equivalent

The XC7VX485T-2FFG1157I is a Xilinx Virtex-7 FPGA. Equivalent products could include other high-performance FPGAs in the same class, such as Intel's Stratix V series or Altera's Arria 10 series, depending on the specific application requirements like logic elements, I/O capabilities, and power consumption. Always check specific features to ensure compatibility with your project needs.

Features

The XC7VX485T-2FFG1157I is a member of the Xilinx Virtex-7 FPGA family, designed for high-performance and high-capacity applications. Key features include:
1. Logic Resources: It has around 485,760 logic cells, providing substantial capacity for complex designs.
2. Memory: Features 37,680 Kb of block RAM, catering to significant on-chip data storage requirements.
3. DSP Slices: Equipped with 2,800 DSP slices, ideal for high-performance signal processing tasks.
4. I/O Capacity: Offers multiple high-speed I/O options, with 600 user I/O pins for versatile connectivity.
5. Transceivers: Includes 28 GTH transceivers, supporting up to 13.1 Gbps, suitable for high-speed serial communication.
6. Clock Management: Integrated clock management tiles for advanced clocking capabilities.
7. Operating Temperature: Designed for industrial applications, with an operating temperature range of -40°C to +100°C.
8. Package: Comes in an FFG1157 package, which is a flip-chip ball grid array format for efficient heat dissipation and performance.
These features make the XC7VX485T-2FFG1157I suitable for demanding applications in sectors like telecommunications, defense, and computing.

Pinout

The XC7VX485T-2FFG1157I is a part of the Xilinx Virtex-7 FPGA family. It comes in a flip-chip package designated as FFG1157, which implies it has 1157 pins. This FPGA is designed for high-performance applications and includes a range of features for processing and connectivity.
Key functions of the XC7VX485T include:
1. Logic Cells: It has a large number of logic cells for complex computations.
2. DSP Slices: Provides efficient digital signal processing capabilities.
3. Block RAM: Includes substantial on-chip memory for data storage.
4. I/O Options: Supports various high-speed I/O standards for connectivity.
5. Transceivers: Integrated high-speed serial transceivers for data communication.
6. Configurable Logic Blocks (CLBs): Fundamental building blocks for implementing customized logic.
These features make it suitable for applications in communications, aerospace, and defense sectors, where high performance and flexibility are crucial.

Manufacturer

The XC7VX485T-2FFG1157I is a Field-Programmable Gate Array (FPGA) manufactured by Xilinx, which is now a part of Advanced Micro Devices, Inc. (AMD). Xilinx was renowned for designing and supplying programmable logic devices, known for their versatility and high-performance capabilities in various applications such as telecommunications, automotive, and data centers. As of 2022, Xilinx was acquired by AMD, a company known for its high-performance computing and graphics solutions. AMD provides a range of products including processors, graphics cards, and now, through the acquisition of Xilinx, FPGAs and adaptive computing solutions. This acquisition expands AMD’s portfolio and enhances its ability to provide comprehensive solutions across a wider array of applications and industries.

Application

The XC7VX485T-2FFG1157I is a versatile FPGA from Xilinx's Virtex-7 family, offering high performance and capacity for various applications. Key application areas include:
1. High-Performance Computing (HPC): Ideal for data-intensive tasks and simulations.
2. Telecommunications: Supports high-speed data processing in network infrastructure.
3. Aerospace and Defense: Used in radar systems, signal processing, and secure communications.
4. Broadcast and Video Processing: Facilitates real-time video encoding, decoding, and streaming.
5. Medical Imaging: Enhances image processing capabilities in diagnostic equipment.
6. Finance: Accelerates algorithmic trading and risk analysis.
Its high logic density and fast processing capabilities make it suitable for any application requiring intensive parallel processing and high-speed data throughput.

Package

The XC7VX485T-2FFG1157I is a model within Xilinx's Virtex-7 FPGA family. It features a Fine-Pitch Flip-Chip Ball Grid Array (FBGA) package type, specifically the FFG1157, which denotes a 1157-ball grid layout. This package is designed for high-performance applications, providing efficient thermal and electrical performance.

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