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XC7VX690T-2FFG1157I
+StücklisteIC FPGA 600 I/O 1157FCBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC7VX690T-2FFG1157I
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Paket FCBGA-1157
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Auf Lager5965
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Virtex®-7 XT |
| Part Status | Active |
| Number of LABs/CLBs | 54150 |
| Number of Logic Elements/Cells | 693120 |
| Total RAM Bits | 54190080 |
| Number of I/O | 600 |
| Voltage - Supply | 0.97V ~ 1.03V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
The "-2" in its name indicates the speed grade, with lower numbers representing faster performance. The "FFG1157" denotes the package type and size, with FFG indicating a fine-pitch ball grid array and 1157 specifying the number of pins. The "I" at the end indicates that this model is rated for industrial temperature ranges, making it suitable for more demanding environmental conditions.
The XC7VX690T offers a range of features, including high-speed I/O, ample DSP slices, and integrated memory blocks, making it a versatile choice for engineers designing cutting-edge systems requiring robust computational capabilities.
Equivalent
Features
1. Logic Cells: Approximately 693,120 logic cells for complex design implementations.
2. System Gates: Equivalent to millions of system gates for extensive design capabilities.
3. DSP Slices: 3,600 DSP slices for efficient digital signal processing tasks.
4. Block RAM: Around 52.9 Mb of total block RAM for enhanced data storage and retrieval.
5. Transceivers: Incorporates 80 GTH transceivers, each capable of up to 13.1 Gb/s data rates, suitable for high-speed serial communication.
6. I/O Pins: Features 600 user I/O pins for flexible interfacing options.
7. Power Efficiency: Fabricated using 28nm process technology for optimal power efficiency and performance.
8. Environmental: The "I" in the part number indicates industrial-grade, suitable for a wide temperature range (-40°C to +100°C).
9. Package: Comes in an FFG1157 package, offering a compact form factor for integration into various systems.
This FPGA is ideal for applications requiring high throughput, such as telecommunications, data centers, and high-performance computing.
Pinout
1. Logic Cells: It contains approximately 693,120 logic cells, facilitating complex computations and extensive data processing.
2. I/O Pins: The FPGA supports a variety of I/O standards, and the pin configuration allows for flexible interfacing options with external components.
3. Transceivers: It includes high-speed serial transceivers suitable for applications requiring high data throughput, such as networking and communications systems.
4. DSP Slices: The device incorporates DSP slices optimized for digital signal processing tasks, enhancing performance in applications like audio/video processing and wireless communications.
5. Memory: The FPGA features embedded memory blocks for efficient data storage and retrieval.
6. Clock Management: It provides advanced clock management capabilities with multiple clock sources and PLLs for timing optimization.
Overall, the XC7VX690T-2FFG1157I is suitable for high-performance computing, signal processing, and networking applications, offering a robust and flexible platform for designers.
Manufacturer
Xilinx is recognized for its innovation in creating flexible and scalable integrated circuits that can be customized by designers for specific tasks and applications after manufacturing. This flexibility allows Xilinx products to be used in a wide range of applications, from simple logic operations to complex algorithms. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a leading company in the design and manufacturing of microprocessors, graphics processors, and related technologies. This acquisition expanded AMD's portfolio to include Xilinx's expertise in programmable logic and adaptive computing.
Application
1. Telecommunications: Supports high-bandwidth and signal processing for network infrastructure.
2. Aerospace and Defense: Used in radar, electronic warfare, and avionics systems.
3. Data Centers: Enhances data throughput and processing in servers.
4. Broadcast and Pro Audio: Facilitates video processing and real-time broadcasting.
5. Scientific Instrumentation: Used in high-frequency data acquisition and processing.
6. Medical Imaging: Supports complex image processing tasks.
These applications leverage its high logic density, DSP capabilities, and fast transceivers.