XC7Z035-2FBG676I

Abbildungen dienen nur als Referenz

XC7Z035-2FBG676I

+Stückliste

IC SOC CORTEX-A9 800MHZ 676FCBGA

  • HerstellerAMD Xilinx

  • Herstellerteil #XC7Z035-2FBG676I

  • Paket FCBGA-676

  • Auf Lager6534

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

Originalproduktgarantie

Spezifikationen

Attribut Wert
Package / Case Tray
Series Zynq®-7000
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)

Übersicht

Description

The XC7Z035-2FBG676I is a model from the Xilinx Zynq-7000 family, which integrates a dual-core ARM Cortex-A9 processor with 28nm Xilinx programmable logic. This device combines the strengths of a microprocessor system with the flexibility of FPGA technology, making it highly suitable for applications requiring custom hardware acceleration alongside powerful processing capabilities.
Key features include:
- Processing System (PS): Dual-core ARM Cortex-A9 MPCore processor, offering high performance for complex applications.
- Programmable Logic (PL): Equivalent to Artix-7 FPGA, providing customizable logic resources for tailored applications.
- I/O and Memory Interfaces: Includes DDR3, DDR3L, and LPDDR2 memory interfaces, along with a wide range of I/O options to support various peripheral connections.
- Performance: Operates at a speed grade of -2, offering a balance between performance and power efficiency.
- Package: FBG676, a 676-ball grid array, facilitating efficient integration into complex systems.
- Industrial Grade: The "I" denotes industrial temperature range, making it suitable for challenging environmental conditions.
The XC7Z035-2FBG676I is ideal for applications in automotive, industrial, communications, and consumer electronics, where integrated processing and customization are crucial.

Equivalent

The XC7Z035-2FBG676I is a Xilinx Zynq-7000 SoC. Equivalent products could include other Zynq-7000 series devices with similar capabilities, or SoCs from other manufacturers like the Altera (now Intel) Cyclone V series. Specific equivalent models depend on the application's requirements such as processing power, I/O, and memory. Always compare key specifications to ensure compatibility.

Features

The XC7Z035-2FBG676I is a member of the Xilinx Zynq-7000 SoC family, integrating a dual-core ARM Cortex-A9 processor with Xilinx 7 series FPGA fabric. Key features include:
1. Processor System: Dual-core ARM Cortex-A9 MPCore, with NEON extensions and a floating-point unit, facilitating high-performance processing capabilities.
2. FPGA Fabric: Includes approximately 274K logic cells, supporting extensive parallel processing and custom hardware acceleration.
3. Memory: Offers various integrated memory interfaces, including DDR3, DDR3L, and LPDDR2, for efficient data handling.
4. I/O and Connectivity: Provides numerous I/O pins with multiple high-speed connectivity options, such as gigabit Ethernet, USB, and PCIe.
5. Power Management: Features dynamic power management, which helps in optimizing power consumption based on application requirements.
6. Temperature Range: The "I" suffix indicates industrial-grade, suitable for extended temperature ranges.
This combination of processing power and programmable logic makes the XC7Z035-2FBG676I suitable for applications requiring complex computational tasks alongside flexible hardware design.

Pinout

The XC7Z035-2FBG676I is a part of the Xilinx Zynq-7000 family, which integrates a dual-core ARM Cortex-A9 processor with FPGA logic. This specific model comes in a FBG676 package, which means it has a ball grid array (BGA) with 676 pins. These pins serve multiple functions, including:
1. Power and Ground Pins: Provide power and grounding for the operation of the chip.
2. Processor System (PS) Interfaces: Include memory interfaces, peripheral interfaces like USB, Ethernet, and UART, allowing communication and data exchange between the processor and external devices.
3. Programmable Logic (PL) Interfaces: Connect to the customizable FPGA logic, supporting various configurable I/O standards and protocols.
4. Dedicated Configuration Pins: Used for configuring the FPGA part of the device.
5. Multi-gigabit Transceivers (MGTs): Provide high-speed serial communication capabilities.
Overall, the XC7Z035 offers a blend of processing power and FPGA flexibility, suitable for advanced embedded applications requiring significant computational resources and customization.

Manufacturer

The XC7Z035-2FBG676I is manufactured by Xilinx, Inc. Xilinx is an American technology company that is primarily known for designing and developing programmable logic devices, such as field-programmable gate arrays (FPGAs), system-on-chips (SoCs), and adaptive compute acceleration platforms (ACAPs). Founded in 1984 and headquartered in San Jose, California, Xilinx has been at the forefront of providing flexible and customizable solutions for a variety of industries, including telecommunications, automotive, aerospace, defense, and data centers.
Xilinx's products are renowned for their high performance, adaptability, and efficiency, making them a popular choice for applications requiring specialized processing capabilities and rapid prototyping. The company's innovations have been critical in sectors where tailored hardware solutions are necessary to meet specific computationally intensive tasks. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a leading semiconductor company, which further expanded its reach and combined expertise in producing high-performance computing solutions.

Application

The XC7Z035-2FBG676I is a Zynq-7000 series All Programmable System-on-Chip (SoC) from Xilinx, integrating a dual-core ARM Cortex-A9 processor with FPGA logic. Its application areas include:
1. Embedded Systems: Used for high-performance embedded computing in industrial, automotive, and consumer electronics.
2. Signal Processing: Suitable for applications in telecommunications and video processing.
3. Industrial Control: Employed in robotics and automation for real-time processing and control.
4. Medical Devices: Utilized in imaging and diagnostic equipment for data processing.
5. Aerospace and Defense: Used in avionics and secure communication systems due to its high reliability and performance capabilities.
These areas leverage the combination of processing system and programmable logic to optimize performance and flexibility.

Package

The XC7Z035-2FBG676I is a part of Xilinx's Zynq-7000 series of SoCs. It comes in a Fine-Pitch Ball Grid Array (FBGA) package with 676 balls, denoted by 'FBG676'. The 'I' stands for industrial temperature range, and '-2' indicates a specific performance grade.

Produkte, die mit XC7Z035-2FBG676I zusammenhängen