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XC7Z035-2FBG676I
+StücklisteIC SOC CORTEX-A9 800MHZ 676FCBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC7Z035-2FBG676I
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Paket FCBGA-676
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Auf Lager6534
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Zynq®-7000 |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz |
| Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key features include:
- Processing System (PS): Dual-core ARM Cortex-A9 MPCore processor, offering high performance for complex applications.
- Programmable Logic (PL): Equivalent to Artix-7 FPGA, providing customizable logic resources for tailored applications.
- I/O and Memory Interfaces: Includes DDR3, DDR3L, and LPDDR2 memory interfaces, along with a wide range of I/O options to support various peripheral connections.
- Performance: Operates at a speed grade of -2, offering a balance between performance and power efficiency.
- Package: FBG676, a 676-ball grid array, facilitating efficient integration into complex systems.
- Industrial Grade: The "I" denotes industrial temperature range, making it suitable for challenging environmental conditions.
The XC7Z035-2FBG676I is ideal for applications in automotive, industrial, communications, and consumer electronics, where integrated processing and customization are crucial.
Equivalent
Features
1. Processor System: Dual-core ARM Cortex-A9 MPCore, with NEON extensions and a floating-point unit, facilitating high-performance processing capabilities.
2. FPGA Fabric: Includes approximately 274K logic cells, supporting extensive parallel processing and custom hardware acceleration.
3. Memory: Offers various integrated memory interfaces, including DDR3, DDR3L, and LPDDR2, for efficient data handling.
4. I/O and Connectivity: Provides numerous I/O pins with multiple high-speed connectivity options, such as gigabit Ethernet, USB, and PCIe.
5. Power Management: Features dynamic power management, which helps in optimizing power consumption based on application requirements.
6. Temperature Range: The "I" suffix indicates industrial-grade, suitable for extended temperature ranges.
This combination of processing power and programmable logic makes the XC7Z035-2FBG676I suitable for applications requiring complex computational tasks alongside flexible hardware design.
Pinout
1. Power and Ground Pins: Provide power and grounding for the operation of the chip.
2. Processor System (PS) Interfaces: Include memory interfaces, peripheral interfaces like USB, Ethernet, and UART, allowing communication and data exchange between the processor and external devices.
3. Programmable Logic (PL) Interfaces: Connect to the customizable FPGA logic, supporting various configurable I/O standards and protocols.
4. Dedicated Configuration Pins: Used for configuring the FPGA part of the device.
5. Multi-gigabit Transceivers (MGTs): Provide high-speed serial communication capabilities.
Overall, the XC7Z035 offers a blend of processing power and FPGA flexibility, suitable for advanced embedded applications requiring significant computational resources and customization.
Manufacturer
Xilinx's products are renowned for their high performance, adaptability, and efficiency, making them a popular choice for applications requiring specialized processing capabilities and rapid prototyping. The company's innovations have been critical in sectors where tailored hardware solutions are necessary to meet specific computationally intensive tasks. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a leading semiconductor company, which further expanded its reach and combined expertise in producing high-performance computing solutions.
Application
1. Embedded Systems: Used for high-performance embedded computing in industrial, automotive, and consumer electronics.
2. Signal Processing: Suitable for applications in telecommunications and video processing.
3. Industrial Control: Employed in robotics and automation for real-time processing and control.
4. Medical Devices: Utilized in imaging and diagnostic equipment for data processing.
5. Aerospace and Defense: Used in avionics and secure communication systems due to its high reliability and performance capabilities.
These areas leverage the combination of processing system and programmable logic to optimize performance and flexibility.