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XC7Z045-1FFG676I
+StücklisteIC SOC CORTEX-A9 667MHZ 676FCBGA
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HerstellerAMD Xilinx
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Herstellerteil #XC7Z045-1FFG676I
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Paket FCBGA-676
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Auf Lager5829
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Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Zynq®-7000 |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 667MHz |
| Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
The key features of the XC7Z045 include a high level of system integration, with up to 350K logic cells, 21800 DSP slices, and a comprehensive set of I/O options. The device supports advanced power management features, which help optimize performance while minimizing power consumption. Additionally, it offers high-speed connectivity options, including PCIe, SATA, and Gigabit Ethernet, making it versatile for diverse applications.
Packaged in an FFG676 package, this specific variant has an industrial temperature range, denoted by the "I" suffix, ensuring reliable operation in harsh environments. Overall, the XC7Z045-1FFG676I is ideal for designers needing a robust, scalable platform for complex applications.
Equivalent
1. Intel (Altera) Cyclone V SoC series.
2. Microsemi (Microchip) SmartFusion2 series.
3. Lattice ECP5 series (though not ARM-based, offers FPGA capabilities).
4. Xilinx's own other Zynq-7000 models with similar specs.
These alternatives can vary in specifics like performance, power consumption, and I/O capabilities. Always verify compatibility with your application's requirements.
Features
It supports up to 533 MHz DDR3 and DDR3L memory interfaces, and features high-speed connectivity options with multiple gigabit transceivers supporting speeds up to 12.5 Gbps. The device also includes a rich set of I/O capabilities, including USB, Ethernet, and SDIO, for versatile interfacing.
The XC7Z045-1FFG676I operates in an industrial temperature range and comes in a 676-pin FFG676 package. It is designed for high-performance applications in areas such as communications, automotive, and industrial automation, providing a highly integrated solution for complex designs.
Pinout
The "FFG676" part of the designation indicates the package type and pin count. "FFG676" specifies a Fine-Pitch Ball Grid Array (FBGA) package with 676 balls (pins).
As for the function, the XC7Z045-1FFG676I serves various roles due to its hybrid nature, combining processor and FPGA capabilities. It is designed for applications requiring high performance and flexibility, such as embedded systems, automotive, medical devices, and communications.
In summary, the XC7Z045-1FFG676I has 676 pins and functions as a high-performance, flexible processing platform within the Zynq-7000 family, leveraging both ARM processing power and FPGA configurability.
Manufacturer
Application
1. Embedded Systems: Used in automotive, aerospace, and industrial control for real-time processing.
2. Telecommunications: Supports high-speed data processing for wireless communications and networking equipment.
3. Signal Processing: Ideal for video and image processing applications.
4. Medical Devices: Utilized in imaging and diagnostic equipment for its processing capabilities.
5. Consumer Electronics: Powers advanced features in audio/visual equipment.
These applications benefit from its versatility, integrating ARM processing with FPGA capabilities.