XC7Z045-2FFG676I

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XC7Z045-2FFG676I

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IC SOC CORTEX-A9 800MHZ 676FCBGA

  • HerstellerAMD Xilinx

  • Herstellerteil #XC7Z045-2FFG676I

  • Paket FCBGA-676

  • Auf Lager1934

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Spezifikationen

Attribut Wert
Package Tray
Series Zynq®-7000
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAMSize 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
PrimaryAttributes Kintex™-7 FPGA, 350K Logic Cells
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 676-BBGA, FCBGA

Übersicht

Equivalent

The XC7Z045-2FFG676I is a Zynq-7000 SoC from Xilinx (now AMD). Equivalent alternatives include:
1. Xilinx Zynq-7000 family:
- XC7Z100-2FFG676I (higher logic capacity)
- XC7Z020-2CLG484I (lower capacity, smaller package)
2. Competitors:
- Intel (Altera) Cyclone V SoC (5CSXFC6D6F31C6N)
- Microchip PolarFire SoC (MPFS250T-1FCG1152E)
Check pin compatibility and features for exact replacements.

Pinout

The XC7Z045-2FFG676I is a Zynq-7000 SoC from Xilinx (now AMD), combining an ARM Cortex-A9 dual-core processor with FPGA fabric.
- Pin Count: 676 pins (FFG676 package).
- Key Functions:
- Dual-core ARM Cortex-A9 (up to 800MHz) for processing.
- FPGA fabric (350K logic cells) for programmable logic.
- High-speed interfaces (PCIe, Gigabit Ethernet, USB, UART, SPI, I2C).
- Memory support (DDR3, DDR2, LPDDR2).
- On-chip ADCs for system monitoring.
Used in embedded systems requiring both processing and FPGA flexibility.

Application

The XC7Z045-2FFG676I, a Zynq-7000 SoC, combines dual-core ARM Cortex-A9 processors with FPGA logic. Key application areas include:
- Embedded Systems: High-performance processing with real-time control.
- Industrial Automation: Motor control, robotics, and PLCs.
- Aerospace & Defense: Radar, avionics, and secure communications.
- Automotive: ADAS, infotainment, and vehicle networking.
- Medical Imaging: Ultrasound and MRI signal processing.
- Communications: 4G/5G base stations and networking equipment.
Its FPGA flexibility and ARM processing make it ideal for complex, high-speed applications.

Package

The XC7Z045-2FFG676I is a Zynq-7000 SoC from Xilinx (now AMD). It comes in a 676-pin Fine-Pitch Ball Grid Array (FFG676) package. This surface-mount BGA package is designed for high-performance applications, offering robust thermal and electrical performance. The "2" in the part number indicates its industrial temperature range (-40°C to +100°C).

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