XCKU025-1FFVA1156I

XCKU025-1FFVA1156I is a Kintex UltraScale FPGA from Xilinx. It belongs to the XCKU025 family, built on the UltraScale architecture, with speed grade -1 (highest performance). It is housed in an FFVA1156I flip-chip BGA package containing 1156 balls and rated for industrial temperature (I).
Key points:
- Dense programmable logic fabric with LUTs, registers, and DSP slices for high‑performance signal processing
- On‑chip memory: BRAM and UltraRAM blocks
- High‑speed serial transceivers for multi‑Gbps I/O
- Clock management tiles and PLLs for advanced timing
- Multiple I/O banks supporting various standards
- IP/embedded options (e.g., PCIe, Ethernet, memory controllers) via Vivado
Typical applications: data processing, wireless infrastructure, video processing, networking, instrumentation, and other mid/high‑density FPGA tasks requiring DSP, memory, and high I/O throughput.

- Pin count: 1156 pins (FFVA1156 package).
- Function: Xilinx Kintex UltraScale FPGA (XCKU025) in a FFVA1156I flip-chip BGA package, providing programmable logic, I/O banks, and high-speed transceivers for digital designs (industrial temperature range).

- Manufacturer: Xilinx, Inc. (now part of AMD since 2020).
- What kind of company: A US-based multinational semiconductor company that designs and manufactures programmable logic devices, primarily FPGAs, along with SoCs, adaptive compute acceleration platforms, and related design tools/IP.

XCKU025-1FFVA1156I is a Kintex UltraScale FPGA; suitable for:
- High-performance networking and telecom (packet processing, line-rate switching)
- Data-center and edge acceleration (DPU/NIC offload, programmable acceleration)
- RF/wireless infrastructure and SDR (baseband DSP, OFDM, beamforming)
- Video, imaging and vision systems (real-time encoding/decoding, processing)
- Industrial, aerospace/defense instrumentation and test equipment
- Automotive-grade machine-vision and control systems
- Storage and data-processing accelerators (protocol offload, controllers)
Note: Provides balanced DSP, memory, and high-speed transceivers for these domains.

FFVA1156 — Flip-Chip Ball-Grid Array package with 1156 balls (industrial temperature variant “I”).