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XCKU035-2FBVA676I
+StücklisteIC FPGA 312 I/O 676FCBGA
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HerstellerAMD
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Herstellerteil #XCKU035-2FBVA676I
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Auf Lager9482
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Spezifikationen
| Attribut | Wert |
| Series | Kintex® UltraScale™ |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Total RAM Bits | 19456000 |
| Number of I/O | 312 |
| Voltage - Supply | 0.922V ~ 0.979V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| Base Product Number | XCKU035 |
| Number of Logic Elements / Cells | 444343 |
| Number of LA Bs / CL Bs | 25391 |
Übersicht
Description
This specific model includes 35,000 logic cells, up to 1,080 DSP slices for intensive arithmetic processing, and a large number of I/O pins, making it suitable for complex designs. It also supports various communication standards, including PCIe and Ethernet, allowing for versatile connectivity options.
The XCKU035 is ideal for applications in industries like aerospace, automotive, and telecommunications, where speed, reliability, and adaptability are crucial. Additionally, it offers advanced features like partial reconfiguration, which allows users to update portions of the design without interrupting operation.
Overall, the XCKU035-2FBVA676I is a robust choice for developers seeking a powerful and flexible FPGA solution.
Equivalent
Features
1. Logic Cells: Up to 35,000 logic cells for high-performance processing.
2. DSP Slices: 120 dedicated DSP slices for efficient digital signal processing.
3. Block RAM: 2.1 Mbits of block RAM for flexible memory options.
4. Transceivers: Supports up to 16 transceivers with speeds up to 28.05 Gbps.
5. I/O Pins: 676 I/O pins for extensive connectivity.
6. Power Efficiency: Low power consumption suitable for demanding applications.
7. Configurability: Supports various design configurations for diverse applications.
8. High-Speed Interfaces: Compatible with PCIe, Ethernet, and other standards.
9. Advanced Security: Features for secure design implementations.
This FPGA is ideal for applications in communications, automotive, and data processing.
Pinout
Key functions of the pins include:
1. Power and Ground: Dedicated pins for power supply and ground connections.
2. I/O Pins: Configurable input/output pins that support various standards like LVDS, LVCMOS, and others for interfacing with external devices.
3. Clock Pins: For connecting clock signals, including dedicated clock management resources.
4. Configuration Pins: Used for loading the FPGA configuration on power-up.
5. Management Pins: Enable thermal and power management functionalities.
The versatility of the pinouts supports a wide range of applications in communications, automotive, and industrial systems.
Manufacturer
XCKU035-2FBVA676I specifically refers to a model from Xilinx's Kintex UltraScale FPGA family, designed for high performance and power efficiency. Xilinx's products are characterized by their flexibility, allowing engineers to adapt their designs to meet specific requirements across diverse industries. As a leader in the FPGA market, Xilinx plays a crucial role in enabling advancements in technology, particularly in the areas of artificial intelligence, machine learning, and data processing.
Application
1. Data Center Acceleration: Enhancing performance in cloud computing and big data analytics.
2. High-Performance Computing (HPC): Supporting complex algorithms and parallel processing needs.
3. Networking: Used in routers and switches for high-speed data processing and protocol management.
4. Automotive: Applications in advanced driver-assistance systems (ADAS) and autonomous vehicles.
5. Industrial Automation: Implementing control systems and machine vision applications.
6. Medical Imaging: Processing data from imaging devices for diagnostics.
Its flexibility and high processing capability make it ideal for these demanding fields.