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XCKU060-1FFVA1156C
+StücklisteIC FPGA 520 I/O 1156FCBGA
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HerstellerAMD Xilinx
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Herstellerteil #XCKU060-1FFVA1156C
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Paket FCBGA-1156
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Auf Lager4938
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Kintex® UltraScale™ |
| Part Status | Active |
| Number of LABs/CLBs | 41460 |
| Number of Logic Elements/Cells | 725550 |
| Total RAM Bits | 38912000 |
| Number of I/O | 520 |
| Voltage - Supply | 0.922V ~ 0.979V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Übersicht
Description
With a 20nm process technology, the XCKU060-1FFVA1156C offers a balance between power efficiency and performance. It supports high-speed connectivity with integrated transceivers and various I/O standards, enabling seamless integration with other system components. Its packaging, the FFVA1156, is a BGA (Ball Grid Array) format, facilitating efficient heat dissipation and reliable mounting on PCBs.
The FPGA includes advanced security features, making it suitable for secure applications. Its reconfigurability allows for flexibility and adaptability in evolving technological environments. Overall, the XCKU060-1FFVA1156C is a robust solution for demanding, high-performance electronic designs.
Equivalent
Features
1. UltraScale Architecture: Utilizes the Xilinx UltraScale architecture which enhances system performance and reduces power consumption.
2. Logic Cells: Contains approximately 726,000 logic cells, providing ample resources for complex designs.
3. DSP Slices: Equipped with 2,760 DSP slices for efficient processing of mathematical functions.
4. Memory: Offers 38.0 Mb of block RAM for data storage and fast access.
5. I/O Capability: Supports a wide range of I/O standards with high-speed serial connectivity options.
6. Package and Speed Grade: Housed in an FFVA1156 package with a speed grade of -1, indicating a standard performance level.
7. Power Efficiency: Designed for optimized power efficiency, suitable for applications requiring lower power consumption and heat dissipation.
These features make the XCKU060-1FFVA1156C suitable for applications in data centers, communications, and industrial automation.
Pinout
1. General Purpose I/O (GPIO): Used for interfacing with various peripherals and other devices.
2. Power and Ground Pins: Supply power to the FPGA and provide a reference ground.
3. Configuration Pins: Used for programming the FPGA.
4. Clock Pins: For input and distribution of clock signals.
5. Dedicated High-Speed I/O: For interfaces such as PCIe, DDR, and other high-speed communication protocols.
6. Control Pins: Include reset and test pins for device control and maintenance.
The exact function of each pin can be found in the device's datasheet or user guide provided by Xilinx. These documents provide comprehensive details on pin assignments and configurations for specific applications.
Manufacturer
Application
1. Telecommunications: For high-speed data processing in network infrastructure.
2. Data Centers: Enhancing performance in data storage, processing, and networking.
3. Broadcasting: Enabling advanced video processing and real-time analytics.
4. Medical Imaging: Providing high-resolution image processing capabilities.
5. Financial Computing: Accelerating complex computations and data analysis.
6. Aerospace and Defense: Supporting signal processing and secure communications.
These applications benefit from the FPGA's high throughput, flexibility, and scalability.