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XCKU060-2FFVA1156I
+StücklisteIC FPGA 520 I/O 1156FCBGA
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HerstellerAMD Xilinx
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Herstellerteil #XCKU060-2FFVA1156I
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Paket FCBGA-1156
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Auf Lager7214
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
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Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Bulk |
| Series | Kintex® UltraScale™ |
| Part Status | Active |
| Number of LABs/CLBs | 41460 |
| Number of Logic Elements/Cells | 725550 |
| Total RAM Bits | 38912000 |
| Number of I/O | 520 |
| Voltage - Supply | 0.922V ~ 0.979V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
This specific model is housed in a fine-pitch Ball Grid Array (BGA) package, denoted by "FFVA1156", which supports advanced pin configurations for high-speed data transfers. The "2" in "2FFVA1156I" refers to the speed grade, affecting the maximum operational frequency. Lastly, the "I" indicates that the chip is rated for industrial temperature ranges, enhancing its reliability in various environmental conditions.
Overall, the XCKU060-2FFVA1156I offers an effective solution for complex, high-throughput FPGA applications, balancing cost and performance while maintaining flexibility for different operating conditions.
Equivalent
Features
1. Architecture: Based on the 20nm UltraScale architecture, offering high performance and power efficiency.
2. Logic Resources: Approximately 726,000 logic cells, making it suitable for complex computational tasks.
3. Memory: Integrated with substantial block RAM for data storage and processing.
4. DSP Slices: Over 2,760 DSP slices, ideal for high-performance digital signal processing applications.
5. I/O Capabilities: Supports a wide range of I/O standards with high-speed serial connectivity, offering flexibility in interfacing.
6. Packaging: Comes in a FFVA1156 package, which provides a reliable and robust form factor for various applications.
7. Operating Conditions: The "-2" speed grade indicates a balance between performance and power consumption.
8. Temperature Range: The 'I' denotes an industrial-grade temperature range, suitable for harsh environments.
These features make the XCKU060-2FFVA1156I well-suited for applications in communications, automotive, industrial, and data center sectors.
Pinout
The functions of the XCKU060 include:
- High-performance DSP capabilities for signal processing applications.
- Enhanced memory hierarchy with high-speed interfaces.
- Advanced I/O capabilities supporting high-speed communication protocols.
- Configurable logic blocks (CLBs) for implementing custom logic designs.
The device's combination of pin count and functionality allows it to support complex, compute-intensive tasks while facilitating efficient data throughput and system integration.
Manufacturer
Xilinx, founded in 1984 and headquartered in San Jose, California, is known for its significant contributions to the semiconductor industry, particularly in the field of programmable logic. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a prominent multinational semiconductor company. This acquisition was aimed at expanding AMD's capabilities and offerings in high-performance computing and adaptive computing solutions.
Overall, Xilinx operates as a key player in the technology and semiconductor sectors, providing advanced solutions for a wide range of industries including telecommunications, automotive, aerospace, and consumer electronics.
Application
1. Data Center Acceleration: Enhances performance for compute-intensive tasks like AI and machine learning.
2. Networking: Supports high-speed networking applications with advanced data processing capabilities.
3. Wireless Communications: Utilized in baseband processing and other wireless infrastructure tasks.
4. Broadcast and Pro AV: Enables real-time video processing and high-speed data transfer.
5. Aerospace and Defense: Suitable for applications requiring reliability and high-speed data handling.
6. Industrial Automation: Used for precision control and real-time data processing in industrial systems.
These applications leverage the FPGA's high-performance, low-latency, and adaptable architecture.