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XCKU085-2FLVA1517I
+StücklisteIC FPGA 624 I/O 1517FCBGA
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HerstellerAMD Xilinx
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Herstellerteil #XCKU085-2FLVA1517I
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Paket FBGA-1517
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Auf Lager1699
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Bulk |
| Series | Kintex® UltraScale™ |
| Part Status | Active |
| Number of LABs/CLBs | 62190 |
| Number of Logic Elements/Cells | 1088325 |
| Total RAM Bits | 58265600 |
| Number of I/O | 624 |
| Voltage - Supply | 0.922V ~ 0.979V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
The "XCKU085" indicates the specific model, and the "2FLVA1517I" provides details about the speed grade, package type, and temperature range. The "2" denotes the speed grade, affecting the performance characteristics. The "FLVA1517" signifies the package, which is a specific format and size that influences the device's physical integration into circuits. The "I" indicates an industrial temperature range, ensuring reliability in diverse environmental conditions.
The Kintex UltraScale architecture offers advanced features like high DSP (Digital Signal Processing) slices, abundant block RAM, and support for high-speed transceivers. This makes the XCKU085-2FLVA1517I ideal for systems requiring significant parallel processing power and flexibility, such as real-time signal processing and high-speed data transfer applications.
Equivalent
Features
1. Architecture: Utilizes the UltraScale architecture, offering high performance and efficiency for a broad range of applications.
2. Logic Cells: Approximately 1.2 million logic cells, providing substantial resources for complex designs.
3. Configuration: Supports a range of configuration options, including JTAG and SelectMAP.
4. DSP Slices: Includes a significant number of DSP slices, enhancing its capabilities for signal processing applications.
5. Memory: Features integrated block RAM and UltraRAM for flexible storage solutions.
6. I/O Resources: Offers multiple high-speed I/O options, including gigabit transceivers for robust data throughput.
7. Power Efficiency: Designed for low power consumption without compromising performance.
8. Environmental: The “-2FLVA1517I” designation indicates it operates in the industrial temperature range, suitable for harsh environments.
These features make the XCKU085-2FLVA1517I suitable for applications that require high processing power and flexibility, such as telecommunications, aerospace, and defense systems.
Pinout
The functions of the XCKU085-2FLVA1517I include:
1. Logic Resources: It provides substantial logic cells for implementing complex digital designs.
2. Memory Resources: Includes block RAM and UltraRAM for efficient data storage and processing.
3. DSP Slices: Contains numerous DSP slices for high-speed digital signal processing tasks.
4. I/O Capabilities: Offers a wide range of I/O standards and high-speed transceivers for interfacing with other components and systems.
5. Scalability: Supports scalability for system upgrades and integration with other devices in the Kintex UltraScale family.
This FPGA is suitable for applications such as telecommunications, data centers, and advanced driver assistance systems, where high throughput and efficient processing are required.