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XCKU115-2FLVA1517E
+StücklisteIC FPGA 624 I/O 1517FCBGA
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HerstellerAMD Xilinx
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Herstellerteil #XCKU115-2FLVA1517E
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Paket FBGA-1517
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Auf Lager7700
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Kintex® UltraScale™ |
| Part Status | Active |
| Number of LABs/CLBs | 82920 |
| Number of Logic Elements/Cells | 1451100 |
| Total RAM Bits | 77721600 |
| Number of I/O | 624 |
| Voltage - Supply | 0.922V ~ 0.979V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
Übersicht
Description
Key features include:
1. Architecture: Incorporates the UltraScale architecture, offering enhanced system performance, scalability, and connectivity.
2. Logic Cells: Provides a significant amount of logic cells, making it suitable for complex computational tasks.
3. DSP Slices: Includes a substantial number of DSP slices, optimizing it for signal processing applications.
4. Memory: Equipped with high-bandwidth memory resources, ensuring effective data handling and processing.
5. I/O Options: Offers extensive I/O capabilities, supporting high-speed communication protocols.
The XCKU115-2FLVA1517E is suitable for industries requiring robust performance and adaptability, such as aerospace, defense, and high-performance computing. Its advanced features enable developers to implement complex algorithms and high-speed data processing tasks efficiently.
Equivalent
Features
1. Architecture: Utilizes the UltraScale architecture, which offers enhanced performance and scalability.
2. Logic Cells: Contains over 1 million logic cells, suitable for complex processing tasks.
3. Memory: Equipped with substantial on-chip memory, including numerous block RAMs and UltraRAM blocks, providing ample storage for data and instructions.
4. DSP Slices: Features thousands of DSP slices for efficient processing of arithmetic and signal processing functions.
5. I/O Bandwidth: Provides high I/O bandwidth with multiple high-speed serial transceivers, supporting data rates up to several gigabits per second.
6. Power Efficiency: Designed for low power consumption, making it suitable for energy-sensitive applications.
7. Packaging: Comes in a FFG1517 package, facilitating integration into various form factors and system designs.
This FPGA model is ideal for applications in fields such as telecommunications, data center acceleration, and advanced imaging systems.
Pinout
Manufacturer
Xilinx is particularly known for its innovation in the FPGA market, where its products offer flexibility and adaptability for designers and engineers to implement custom hardware circuits. The company's devices enable users to program the hardware directly, allowing for rapid development and deployment of complex digital systems. This capability is crucial in industries requiring high performance, real-time processing, and adaptability to changing requirements. Xilinx was acquired by Advanced Micro Devices (AMD) in February 2022, further integrating its technology into AMD's broader portfolio of computing solutions.
Application
1. Data Center Acceleration: Enhances computing tasks like AI inference and data processing.
2. High-Speed Networking: Supports high-bandwidth applications with robust data throughput.
3. Wireless Communications: Used in systems requiring fast data rates and low latency.
4. Broadcast and Pro AV: Ideal for video processing and real-time data handling.
5. Aerospace and Defense: Supports complex algorithms and secure data transmission.
6. Industrial Automation: Facilitates real-time processing and control.
These applications leverage the FPGA's flexibility, high speed, and energy efficiency.