XCKU15P-2FFVA1156I

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XCKU15P-2FFVA1156I

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IC FPGA 516 I/O 1156FCBGA

  • HerstellerAMD Xilinx

  • Herstellerteil #XCKU15P-2FFVA1156I

  • Paket FCBGA-1156

  • Auf Lager1328

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Spezifikationen

Attribut Wert
Package / Case Tray
Series Kintex® UltraScale+™
Part Status Active
Number of LABs/CLBs 65340
Number of Logic Elements/Cells 1143450
Total RAM Bits 82329600
Number of I/O 516
Voltage - Supply 0.825V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)

Übersicht

Equivalent

The XCKU15P-2FFVA1156I is a Kintex UltraScale+ FPGA from Xilinx (now AMD). Equivalent alternatives include:
- Xilinx Kintex UltraScale+ KU15P (same family, similar specs)
- Intel Stratix 10 GX 1650 (comparable performance)
- Microchip PolarFire MPF300T (lower power, mid-range FPGA)
For exact replacements, verify specs like logic cells, transceivers, and package compatibility. Always check datasheets for precise matches.

Features

The Xilinx XCKU15P-2FFVA1156I is a Kintex UltraScale+ FPGA with key features:
- Logic Cells: ~1,020K
- DSP Slices: 5,520 (27x18 multipliers)
- Block RAM: 75.9 Mb (4,860 Kb ultra RAM)
- Transceivers: 32x GTH (16.3 Gbps)
- I/O Pins: 600+ (supports HP & HR banks)
- Process: 16nm FinFET+
- Power: Optimized for performance/watt (2-speed grade)
- Package: 1156-ball FFVA (Flip-Chip Fine-Pitch BGA)
- PCIe: Integrated Gen3 x16 support
- Configuration: Supports SEU mitigation (ECC, CRC).
Ideal for high-speed networking, DSP, and compute acceleration.

Pinout

The XCKU15P-2FFVA1156I is a Kintex UltraScale+ FPGA with:
- Pin count: 1,156 pins (FFVA package).
- Key functions:
- High-speed serial transceivers (up to 32.75 Gbps).
- Logic cells (~1.7 million).
- DSP slices (~6,840).
- Block RAM (~75.9 Mb).
- PCIe Gen4 support.
- Advanced power management.
It targets high-performance computing, networking, and signal processing.

Application

The XCKU15P-2FFVA1156I, a high-performance Kintex UltraScale+ FPGA, is widely used in:
- Data Centers: Accelerating AI/ML, networking, and storage.
- Telecommunications: 5G infrastructure, baseband processing.
- Aerospace & Defense: Radar, EW, and secure communications.
- Industrial Automation: Real-time control and vision systems.
- Medical Imaging: High-speed data processing.
- Scientific Research: High-energy physics and signal processing.
Its high-speed transceivers (up to 16.3 Gbps), DSP slices, and large logic capacity make it ideal for demanding applications.

Package

The XCKU15P-2FFVA1156I is a Flip-Chip Fine-Pitch Ball Grid Array (FFVA) package. It has 1156 pins and is designed for high-performance applications. The "FFVA" designation indicates its fine-pitch BGA structure, optimized for high-density interconnects and thermal performance. This package type is commonly used in Xilinx UltraScale+ FPGAs for advanced computing and signal processing.

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