XCKU15P-2FFVE1517E

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XCKU15P-2FFVE1517E

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IC FPGA 512 I/O 1517FCBGA

  • HerstellerAMD Xilinx

  • Herstellerteil #XCKU15P-2FFVE1517E

  • Paket FBGA-1517

  • Auf Lager7001

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Spezifikationen

Attribut Wert
Package / Case Tray
Series Kintex® UltraScale+™
Part Status Active
Number of LABs/CLBs 65340
Number of Logic Elements/Cells 1143450
Total RAM Bits 82329600
Number of I/O 512
Voltage - Supply 0.825V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 100°C (TJ)

Übersicht

Description

The XCKU15P-2FFVE1517E is a member of Xilinx's (now AMD) Kintex UltraScale+ FPGA family. It features:
- High-performance FPGA: Built on 16nm FinFET+ technology, offering high logic density and power efficiency.
- Logic resources: ~1.1M logic cells, 6,840 DSP slices, and 75.9 Mb of UltraRAM.
- I/O & interfaces: Supports high-speed transceivers (up to 32.75 Gbps), PCIe Gen4, and DDR4 memory.
- Package: 1517-pin flip-chip BGA (FFVE1517) for robust signal integrity.
- Applications: Ideal for data center acceleration, high-speed networking, and advanced signal processing.
This FPGA balances performance, power, and cost, making it suitable for demanding embedded and compute applications.

Equivalent

The XCKU15P-2FFVE1517E is a Kintex UltraScale+ FPGA. Equivalent alternatives include:
- Xilinx Kintex UltraScale+ KU15P (same family, different package/speed grade)
- Intel Stratix 10 GX 2800 (competitive FPGA with similar logic/resources)
- AMD Versal AI Core VC1902 (for advanced applications, though not a direct replacement)
Check specific requirements for exact compatibility.

Features

The Xilinx XCKU15P-2FFVE1517E is a Kintex UltraScale+ FPGA with key features:
- Logic Cells: ~1.5M
- DSP Slices: 6,840
- Block RAM: 108 Mb (4,860 Kb)
- Transceivers: 32 GTH (16.3 Gbps max)
- PCIe Gen3/4: Up to x16 support
- I/O Pins: 600+ (HP & HR banks)
- Process: 16nm FinFET+
- Power: Optimized for performance-per-watt
- Package: 1517-ball FCBGA (1.0mm pitch)
Ideal for high-speed networking, data centers, and signal processing.

Pinout

The XCKU15P-2FFVE1517E is a Kintex UltraScale+ FPGA with the following key details:
- Pin Count: 1,517 pins (FFVE1517 package).
- Primary Functions:
- High-speed I/O: Supports up to 32.75 Gb/s transceivers (GTY).
- Logic & DSP: ~1.1M logic cells, ~5,520 DSP slices.
- Memory: ~75.9 Mb UltraRAM, ~38.3 Mb block RAM.
- Power: Requires multiple voltage rails (VCCINT, VCCAUX, VCCO, etc.).
- Configuration: Supports JTAG, SPI, BPIs, and PCIe-based config.
This FPGA is optimized for high-performance computing, networking, and signal processing.

Application

The XCKU15P-2FFVE1517E, a high-performance Xilinx Kintex UltraScale+ FPGA, is widely used in:
- Data Centers (accelerators, networking)
- 5G & Wireless (baseband processing, fronthaul/backhaul)
- Aerospace & Defense (radar, EW, avionics)
- Medical Imaging (real-time processing)
- Automotive (ADAS, LiDAR)
- High-Speed Networking (100G+ interfaces, packet processing)
- AI/ML Acceleration (inference, custom algorithms)
Its high-speed transceivers (up to 32.75 Gbps), DSP slices, and large logic capacity make it ideal for compute-intensive, low-latency applications.

Package

The XCKU15P-2FFVE1517E is a Xilinx UltraScale+ FPGA in a FFVE1517 package. This is a Flip-Chip Fine-Pitch Ball Grid Array (FF) package with 1517 pins, designed for high-performance applications. The "E" suffix indicates it is a commercial-grade part with extended temperature support. The package supports high-speed interfaces and dense logic integration.

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