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XCKU5P-L2FFVB676E
+StücklisteIC FPGA 280 I/O 676FCBGA
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HerstellerAMD Xilinx
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Herstellerteil #XCKU5P-L2FFVB676E
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Paket FBGA-676
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Auf Lager7112
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Spezifikationen
| Attribut | Wert |
| Package | Tray |
| Series | Kintex® UltraScale+™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 27120 |
| NumberofLogicElements/Cells | 474600 |
| TotalRAMBits | 41984000 |
| NumberofI/O | 280 |
| Voltage-Supply | 0.698V ~ 0.876V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 110°C (TJ) |
| Package/Case | 676-BBGA, FCBGA |
Übersicht
Description
The XCKU5P-L2FFVB676E features advanced 16nm FinFET+ technology, offering improved speed and power efficiency over previous generations. It includes a range of resources such as programmable logic cells, DSP slices, memory blocks, and high-speed transceivers, enabling a wide variety of digital signal processing, data center, and communication applications.
This FPGA is packaged in the FFVB676, which ensures a compact form factor suitable for integration into various systems. Its architecture supports high-speed connectivity and extensive I/O flexibility, making it ideal for applications in areas such as 5G wireless, video processing, automotive, and industrial automation. Additionally, the device supports advanced security features and design tools, enhancing both its functionality and ease of development.
Equivalent
Features
1. Architecture: Built on a 16nm FinFET process, it offers improved performance and power efficiency.
2. Logic Resources: Provides a substantial number of logic cells and programmable slices for complex designs.
3. DSP Slices: Equipped with numerous DSP slices, ideal for signal processing applications.
4. Memory: Includes ample on-chip memory resources, such as block RAM and UltraRAM, for efficient data handling.
5. I/O Flexibility: Supports a wide range of I/O standards with configurable I/O banks, enabling versatile connectivity options.
6. Transceivers: High-speed transceivers are available for data-intensive tasks and high-bandwidth communication.
7. Security: Features robust security options including bitstream encryption and authentication.
8. Power Management: Designed for low power consumption while maintaining high performance levels.
9. Design Tools: Compatible with Xilinx's Vivado Design Suite for efficient design and implementation.
These features make it suitable for applications in telecommunications, data centers, and aerospace, among others.
Pinout
1. I/O Pins: Configurable for different I/O standards and used for interfacing with other components.
2. Power and Ground Pins: Supply power and provide a ground path for the FPGA.
3. Configuration Pins: Used for programming the FPGA during the configuration phase.
4. Clock Pins: Dedicated pins for clock input to drive the FPGA's clock management resources.
5. JTAG Pins: Used for testing and debugging through the JTAG interface.
6. Dedicated High-Speed Transceiver Pins: For high-speed serial communication.
The exact function of each pin can be found in the device's datasheet or user guide provided by Xilinx, which details the pinout and configuration options specific to the FFVB676 package.
Manufacturer
Xilinx’s products are widely used in various industries, including telecommunications, automotive, aerospace, defense, and consumer electronics, where they provide flexible and efficient solutions for a variety of applications. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), another leading company in the semiconductor industry, further enhancing their capabilities and market reach.
Application
1. Data Center Acceleration: Enhances processing capabilities for tasks like machine learning and data analytics.
2. Wireless Communications: Supports advanced protocols for 5G networks and beyond.
3. Broadcast and Pro Audio/Visual: Used in video processing and transmission.
4. Test and Measurement: Facilitates precise data acquisition and analysis.
5. Aerospace and Defense: Provides reliable processing for radar and electronic warfare systems.
6. Industrial IoT: Supports smart manufacturing with real-time data processing and connectivity.
These applications leverage its high logic density, low latency, and power efficiency.