XCV150-4FG456I

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XCV150-4FG456I

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IC FPGA 260 I/O 456FBGA

  • HerstellerAMD Xilinx

  • Herstellerteil #XCV150-4FG456I

  • Paket BBGA-456

  • Auf Lager2626

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Spezifikationen

Attribut Wert
Supplier AMD Xilinx
Package / Case Tray
Series Virtex®
Part Status Obsolete
Number of LABs/CLBs 864
Number of Logic Elements/Cells 3888
Total RAM Bits 49152
Number of I/O 260
Number of Gates 164674
Voltage - Supply 2.375V ~ 2.625V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)

Übersicht

Description

XCV150-4FG456I does not appear in public catalogs as a standard, widely documented IC. It’s likely OEM-specific or possibly a misread part number. To give a proper introduction you’ll need the manufacturer’s data sheet. A concise intro template (once you have the data) would be:
- XCV150-4FG456I is a [type of device] from [vendor], built around [core architecture], operating from [voltage range] to [voltage], with up to [clock speed], [memory/peripherals], and [I/O/interfaces].
- It is packaged in [packaging/footprint] and supports [operating temperature range].
- Typical applications include [examples].
How to get it: locate the official data sheet or distributor page, confirm the exact part number and packaging, review pinout, electrical specs, operating conditions, and key features from the block diagram and specs. If you provide the manufacturer or a link, I can summarize the exact features in a short introduction.

Equivalent

There is no public 1:1 equivalent for XCV150-4FG456I. It’s an older Xilinx CPLD; cross-references depend on package, speed, and I/O. To identify an equivalent, use Xilinx’s cross-reference tool or your distributor. If redesign is feasible, consider modern CPLDs/FPGA families with similar density and I/O in FG456 packaging (e.g., Lattice MachXO2/MachXO3, or Intel MAX 10) and update the PCB accordingly.

Features

XCV150-4FG456I features (concise):
- Xilinx CPLD, XCV150 family
- ~150 macrocells for glue logic and small designs
- FG456I package: 456-pin fine-grain package
- 3.3V I/O with common standards (LVCMOS/TTL); multiple I/O banks
- In-system programmable via JTAG; non-volatile configuration memory
- Built-in clocking resources and programmable interconnect
- Industrial temperature grade (I)
- Low power with separate core and I/O supply options
- Suitable for glue logic, small controllers, interface bridging and state machines
Note: For exact specs (I/O counts, speeds, timing, and voltage tolerances), refer to the official Xilinx XCV150 datasheet.

Pinout

- Pin count: 456 pins (FG456 package)
- Function: Xilinx Virtex FPGA (XCV family) with about 150K logic cells; a programmable logic device. Industrial temperature range (-I), speed grade -4.

Manufacturer

Manufacturer: Xilinx, Inc.
What kind of company: A semiconductor company that designs and manufactures programmable logic devices (FPGAs and CPLDs) and related design tools/IP.

Application

Typical application areas for XCV150-4FG456I (a Xilinx CPLD) include:
- Glue logic for microprocessors/memory interfaces
- State machines and control units
- Address decoding, bus interfacing, and timing generation
- Clock-domain crossing and synchronization circuits
- Interface bridges (SPI/I2C/UART) and parallel-to-serial logic
- Prototyping, education, and small/medium digital designs requiring deterministic timing
- Automotive, industrial, and consumer electronics where reliable, low‑power digital logic is needed

Package

FG456 indicates a 456-ball Fine-Pitch Ball Grid Array (FG-BGA) package. Industrial temperature rating (I) applies.

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