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XCVU065-2FFVC1517I
+StücklisteIC FPGA 520 I/O 1517FCBGA
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HerstellerAMD
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Herstellerteil #XCVU065-2FFVC1517I
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Auf Lager2450
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Series | Virtex® UltraScale™ |
| PartStatus | Active |
| DigiKeyProgrammable | Not Verified |
| NumberofLogicElements/Cells | 783300 |
| TotalRAMBits | 45363200 |
| NumberofI/O | 520 |
| Voltage-Supply | 0.922V ~ 0.979V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 1517-BBGA, FCBGA |
| SupplierDevicePackage | 1517-FCBGA (40x40) |
| BaseProductNumber | XCVU065 |
| NumberofLABs/CLBs | 44760 |
Übersicht
Description
Key features include:
1. UltraScale Architecture: Utilizes a scalable architecture that enhances performance and power efficiency.
2. High Logic Density: Offers a substantial amount of programmable logic for complex designs.
3. Advanced I/O Capabilities: Supports high-speed serial transceivers and a variety of interface standards.
4. Integrated Memory: Includes block RAM and UltraRAM, providing large memory bandwidth.
5. Power Efficiency: Designed to deliver optimal performance per watt.
The "-2FFVC1517I" suffix indicates specific packaging and speed grade information, with "I" denoting industrial temperature range suitability. This FPGA is ideal for applications demanding extensive data throughput and processing capabilities.
Equivalent
Features
1. Architecture: Built on a 16nm FinFET process, ensuring high performance and power efficiency.
2. Logic Cells: It includes a significant number of logic cells, providing substantial capacity for implementing complex designs.
3. Memory: The device offers abundant on-chip memory, including block RAM and UltraRAM, which are crucial for data-intensive applications.
4. DSP Slices: Equipped with numerous DSP slices for high-speed arithmetic operations, essential for signal processing tasks.
5. I/O and Transceivers: Features high-performance I/O capabilities and high-speed serial transceivers for efficient data communication.
6. Scalability and Flexibility: Supports a wide range of applications due to its scalable architecture and reconfigurable logic.
7. Temperature Range: The “I” in the part number indicates an industrial-grade temperature range, suitable for demanding environmental conditions.
8. Package: Comes in an FFVC1517 package, which defines its physical dimensions and pin count.
These features make the XCVU065-2FFVC1517I ideal for high-performance computing, networking, and advanced signal processing applications.
Pinout
1. Logic Resources: Provides a large number of logic cells for implementing complex digital circuits.
2. I/O Capability: Offers a wide range of I/O options to interface with various peripherals and external devices.
3. High-Speed Transceivers: Includes high-speed serial transceivers for communication at high data rates.
4. Memory: Contains embedded memory blocks for data storage and buffering.
5. DSP Slices: Equipped with DSP slices for efficient implementation of signal processing algorithms.
6. Clock Management: Features dedicated clock management resources for precise timing control.
7. Configuration: Supports multiple configuration modes for flexibility in device programming.
This combination of features makes the XCVU065-2FFVC1517I suitable for demanding applications in fields like telecommunications, data centers, and advanced computing.
Manufacturer
Application
1. Data Centers: Used for accelerating data processing tasks in cloud computing and network infrastructure.
2. Telecommunications: Supports high-speed networking and communication protocols, enhancing bandwidth and connectivity.
3. Aerospace and Defense: Suitable for radar systems, secure communication, and signal processing.
4. Broadcast and Pro AV: Enables video processing, encoding, and distribution systems.
5. High-Performance Computing (HPC): Used in computationally intensive tasks, such as scientific simulations and machine learning applications.
These applications leverage the XCVU065-2FFVC1517I's advanced capabilities in processing, logic density, and connectivity.