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XCVU13P-2FHGB2104I
+StücklisteIC FPGA 702 I/O 2104FCBGA
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HerstellerAMD Xilinx
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Herstellerteil #XCVU13P-2FHGB2104I
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Paket FBGA-2104
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Auf Lager7144
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
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Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Virtex® UltraScale+™ |
| Part Status | Active |
| Number of LABs/CLBs | 216000 |
| Number of Logic Elements/Cells | 3780000 |
| Total RAM Bits | 514867200 |
| Number of I/O | 702 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key features of the XCVU13P-2FHGB2104I include:
1. High Logic Density: It contains a large number of logic cells, enabling complex designs.
2. Advanced I/O: Equipped with numerous high-speed SerDes transceivers for rapid data throughput.
3. Memory Capabilities: Features high-bandwidth memory interfaces for efficient data handling.
4. Power Efficiency: Designed with advanced power management features to optimize energy consumption.
5. Scalability: Offers scalability options for a wide range of applications.
Overall, the XCVU13P-2FHGB2104I is a powerful tool for engineers looking to implement sophisticated and high-performance electronic systems.
Equivalent
Features
1. High Logic Density: Offers a large number of logic cells for complex designs.
2. UltraRAM: Provides substantial on-chip memory for data-intensive applications.
3. High Bandwidth: Supports high-speed I/O and memory interfaces, suitable for data centers and networking.
4. Advanced DSP Capabilities: Includes DSP slices for efficient digital signal processing tasks.
5. Low Power: Designed with power efficiency in mind, making it suitable for various power-sensitive applications.
6. Scalability: Supports scaling through stacking silicon interconnect technology.
7. Security Features: Includes features like bitstream encryption for secure applications.
8. Versatility: Suitable for a range of applications from AI/ML to automotive and telecommunication infrastructures.
These features make the XCVU13P-2FHGB2104I ideal for high-performance computing tasks requiring substantial processing power and data handling capabilities.
Pinout
The functions of these pins are diverse and include:
1. General Purpose I/O (GPIO): Used for a variety of input and output operations.
2. Power and Ground Pins: Provide necessary power and grounding for the FPGA's operation.
3. Configuration Pins: Used for programming and configuring the FPGA.
4. Clock Pins: Manage the clock signals that synchronize operations within the FPGA.
5. Special Function Pins: Include dedicated pins for interfaces like PCIe, Ethernet, and memory controllers.
The specific distribution and function of these pins are detailed in the device's datasheet provided by Xilinx. For detailed design and development, consulting the datasheet and reference manual is essential to understand pin assignments and ensure proper utilization in applications.