XCVU23P-2VSVA1365E

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XCVU23P-2VSVA1365E

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IC FPGA VIRTEX-UP 1365FCBGA

  • HerstellerAMD

  • Herstellerteil #XCVU23P-2VSVA1365E

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Spezifikationen

Attribut Wert
Series Virtex® UltraScale+™
Part Status Active
DigiKey Programmable Not Verified
Number of Logic Elements/Cells 2252250
Total RAM Bits 77909197
Number of I/O 364
Voltage - Supply 0.825V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 1365-BFBGA, FCBGA
Supplier Device Package 1365-FCBGA (35x35)
Number of LABs/CLBs 128700

Übersicht

Description

The XCVU23P-2VSVA1365E refers to a specific model of a field-programmable gate array (FPGA) from Xilinx's Virtex UltraScale+ family. These FPGAs are designed for high-performance applications and are known for their advanced features, including high logic density, extensive I/O capabilities, and adaptable architecture. The model number provides specific details: "XCVU23P" indicates the Virtex UltraScale+ platform, where "23" usually denotes the series or size within the family, and the "P" suggests certain performance or power characteristics. The "-2" is a speed grade, indicating the performance level, with lower numbers typically representing faster speeds. "VSVA1365" is the package type and pin count, indicating the physical form and connectivity options. These FPGAs are suitable for demanding tasks like data center processing, 5G infrastructure, and advanced computing applications, offering high throughput, low latency, and excellent energy efficiency. They support a range of development tools and libraries, allowing engineers to implement complex digital circuits tailored to specific application needs.

Equivalent

The XCVU23P-2VSVA1365E is a part of Xilinx's Virtex UltraScale+ FPGA family. Equivalent products would be those in the same family or similar offerings from competing brands. Within Xilinx, other Virtex UltraScale+ models with similar specifications could be considered. From competitors like Intel, equivalent products might be in the Stratix 10 or Agilex series. Specific equivalence would depend on the exact performance, logic cell count, I/O options, and other features required. Always check the latest datasheets for precise equivalences.

Features

The XCVU23P-2VSVA1365E is a Virtex UltraScale+ FPGA from Xilinx, designed to deliver high performance and adaptability for data-intensive and compute-centric applications. Key features include:
1. Advanced Architecture: Built on a 16nm FinFET process, providing improved power efficiency and performance.

2. High Logic Density: Contains a large number of logic cells, enhancing its capability for complex computations and data processing.
3. Enhanced Memory: Features UltraRAM and high-speed block RAM to support data-intensive applications with ample storage and fast data access.
4. DSP Slices: Equipped with DSP slices optimized for high-speed arithmetic operations, supporting complex signal processing tasks.
5. High-Speed Connectivity: Includes multiple high-speed transceivers and I/O options for robust data exchange with peripheral components.
6. Scalability: Offers flexibility and scalability for a wide range of applications, including telecommunications, data centers, and high-performance computing.
7. Security Features: Incorporates advanced security mechanisms to protect data integrity and intellectual property.
These features make the XCVU23P-2VSVA1365E suitable for applications requiring high throughput, low latency, and efficient processing capabilities.

Pinout

The XCVU23P-2VSVA1365E is a part of the Xilinx Virtex UltraScale+ FPGA family. This specific FPGA comes in a VSVA1365 package, indicating it has 1,365 pins. The pins on an FPGA like the XCVU23P-2VSVA1365E are used for various functions including:
1. Power and Ground Pins: Supply power to the FPGA and provide a return path for current.
2. Configuration Pins: Used for configuring the FPGA at startup.
3. I/O Pins: These are general-purpose input/output pins that can be configured for various standards and used for interfacing with other devices.
4. Dedicated Clock Pins: Used for clock inputs and distributions.
5. Multi-Gigabit Transceivers (MGTs): High-speed transceiver pins for serial communication.
6. Special Function Pins: Such as pins for JTAG interface, which is used for testing and programming.
These pins allow the FPGA to be highly versatile, supporting complex designs and interfacing with a wide range of peripherals and systems. For detailed pin functions, refer to the specific datasheet or user guide provided by Xilinx.

Manufacturer

The XCVU23P-2VSVA1365E is manufactured by Xilinx, Inc. Xilinx is a technology company known for designing and producing programmable logic devices, including field-programmable gate arrays (FPGAs), system-on-chips (SoCs), and adaptive compute acceleration platforms (ACAPs). Founded in 1984 and headquartered in San Jose, California, Xilinx is recognized for pioneering the fabless manufacturing model in the semiconductor industry. This means that while they design their semiconductor devices, they outsource the actual manufacturing to foundry partners.
The company’s products are widely used in various applications such as data centers, wireless communications, automotive systems, industrial control, and consumer electronics. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a major player in the semiconductor industry known for its processors and graphics technologies. This acquisition, completed in February 2022, aims to enhance AMD's product portfolio and capabilities in FPGA and adaptive computing solutions, broadening its ability to serve a range of markets with high-performance and high-efficiency computing products.

Application

The XCVU23P-2VSVA1365E is a Virtex UltraScale+ FPGA from Xilinx, designed for high-performance applications. Its main application areas include:
1. Data Centers: Enhances processing for AI, machine learning, and big data analytics.
2. Telecommunications: Supports next-generation networking, including 5G infrastructure.
3. Aerospace and Defense: Provides robust processing for radar, avionics, and secure communications.
4. Broadcast and Pro AV: Facilitates video processing and transcoding.
5. Industrial Automation: Powers real-time processing for automation and robotics.
6. Scientific Research: Supports simulations and high-performance computing tasks.
Its high capacity and performance make it ideal for applications demanding intensive computational tasks and data throughput.

Package

The XCVU23P-2VSVA1365E is a Virtex UltraScale+ FPGA from Xilinx, and it utilizes a flip-chip ball grid array (FCBGA) package with 1365 pins. The package type is designed to support high-density and high-performance applications, providing efficient power and signal integrity for complex FPGA designs.

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