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XCVU9P-3FLGB2104E
+StücklisteIC FPGA 702 I/O 2104FCBGA
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HerstellerAMD
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Herstellerteil #XCVU9P-3FLGB2104E
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Spezifikationen
| Attribut | Wert |
| Series | Virtex® UltraScale+™ |
| PartStatus | Active |
| BaseProductNumber | XCVU9 |
| DigiKeyProgrammable | Not Verified |
| NumberofLABs/CLBs | 147780 |
| NumberofLogicElements/Cells | 2586150 |
| TotalRAMBits | 391168000 |
| NumberofI/O | 702 |
| Voltage-Supply | 0.873V ~ 0.927V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 100°C (TJ) |
| Package | 2104-BBGA, FCBGA |
| SupplierDevicePackage | 2104-FCBGA (47.5x47.5) |
| Packaging | Tray |
Übersicht
Description
Equivalent
Features
1. Architecture: Built on TSMC's 16nm FinFET technology, it offers improved power efficiency and performance.
2. Logic Cells: It includes a large number of logic cells, providing extensive processing capabilities suitable for complex algorithms and parallel processing.
3. Memory: Equipped with abundant on-chip memory resources, including block RAM and UltraRAM, it supports data-intensive tasks and real-time processing.
4. I/O and Transceivers: The FPGA has high-speed I/O capabilities and multiple transceivers, allowing for fast data transfer and communication with other components or systems.
5. DSP Slices: It includes numerous DSP slices for efficient signal processing, which is essential for applications like wireless communication and video processing.
6. Scalability and Flexibility: The FPGA's architecture allows for customization and scalability, making it suitable for a wide range of applications.
These features make the XCVU9P-3FLGB2104E highly versatile and capable of handling demanding computational tasks.
Pinout
The device is suitable for applications such as data centers, aerospace and defense, and high-performance computing. It supports a variety of interfaces and protocols to facilitate integration into complex systems. The FPGA architecture allows for significant flexibility in designing custom logic circuits, making it ideal for tasks that require parallel processing. Additionally, it offers features like embedded memory, DSP slices, and support for high-speed transceivers, enhancing its versatility in handling demanding applications.
Manufacturer
Xilinx is a technology company that specializes in creating highly flexible and adaptive processing platforms, primarily focusing on FPGAs, adaptive SoCs (System on Chips), and ACAPs (Adaptive Compute Acceleration Platforms). Their products are widely used in a variety of applications, including telecommunications, data centers, automotive, aerospace, and defense industries.
Xilinx has historically been recognized as a leader in the programmable logic device market, contributing significantly to advancements in computing and processing technologies. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), expanding AMD's portfolio in high-performance computing solutions.