XCVU9P-3FLGB2104E

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XCVU9P-3FLGB2104E

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IC FPGA 702 I/O 2104FCBGA

  • HerstellerAMD

  • Herstellerteil #XCVU9P-3FLGB2104E

  • Auf Lager8668

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Attribut Wert
Series Virtex® UltraScale+™
PartStatus Active
BaseProductNumber XCVU9
DigiKeyProgrammable Not Verified
NumberofLABs/CLBs 147780
NumberofLogicElements/Cells 2586150
TotalRAMBits 391168000
NumberofI/O 702
Voltage-Supply 0.873V ~ 0.927V
MountingType Surface Mount
OperatingTemperature 0°C ~ 100°C (TJ)
Package 2104-BBGA, FCBGA
SupplierDevicePackage 2104-FCBGA (47.5x47.5)
Packaging Tray

Übersicht

Description

The XCVU9P-3FLGB2104E is a model number representing a specific FPGA (Field-Programmable Gate Array) from Xilinx, now part of AMD. It belongs to the Virtex UltraScale+ family, which is known for high performance and capacity suited for demanding applications like data centers, wireless communications, and advanced signal processing. The "XCVU9P" identifier indicates its place in the Virtex UltraScale+ lineup, with features that may include massive logic capacity, multiple transceivers, and high-speed I/O capabilities. The "3FLGB2104E" part of the number typically denotes specific package type, temperature grade, and other configuration details, where "FLGB2104" describes the package and "3E" might indicate the speed grade and temperature range. This FPGA is designed to provide flexibility and scalability for developers, allowing for custom hardware accelerations and optimizations. It's often used in environments where high throughput and low latency are crucial.

Equivalent

The XCVU9P-3FLGB2104E is part of the Xilinx Virtex UltraScale+ series of FPGAs. Equivalent products would typically be other high-performance FPGAs from competitors such as Intel’s Stratix 10 series or similar models from other FPGA manufacturers. When selecting an equivalent, consider factors like logic density, number of logic cells, DSP slices, memory, and I/O capabilities to ensure similar performance and functionality.

Features

The XCVU9P-3FLGB2104E is a model from Xilinx's Virtex UltraScale+ FPGA family. It is designed for high-performance computing, data centers, and advanced communication applications. Here are some key features:
1. Architecture: Built on TSMC's 16nm FinFET technology, it offers improved power efficiency and performance.

2. Logic Cells: It includes a large number of logic cells, providing extensive processing capabilities suitable for complex algorithms and parallel processing.
3. Memory: Equipped with abundant on-chip memory resources, including block RAM and UltraRAM, it supports data-intensive tasks and real-time processing.
4. I/O and Transceivers: The FPGA has high-speed I/O capabilities and multiple transceivers, allowing for fast data transfer and communication with other components or systems.
5. DSP Slices: It includes numerous DSP slices for efficient signal processing, which is essential for applications like wireless communication and video processing.
6. Scalability and Flexibility: The FPGA's architecture allows for customization and scalability, making it suitable for a wide range of applications.
These features make the XCVU9P-3FLGB2104E highly versatile and capable of handling demanding computational tasks.

Pinout

The XCVU9P-3FLGB2104E is a part of Xilinx's Virtex UltraScale+ FPGA family. It has a pin count of 2104, as indicated by the "FLGB2104" part of its designation. This FPGA is designed for high-performance applications and offers a range of functionalities including large-scale processing power, high-speed connectivity, and advanced I/O capabilities.
The device is suitable for applications such as data centers, aerospace and defense, and high-performance computing. It supports a variety of interfaces and protocols to facilitate integration into complex systems. The FPGA architecture allows for significant flexibility in designing custom logic circuits, making it ideal for tasks that require parallel processing. Additionally, it offers features like embedded memory, DSP slices, and support for high-speed transceivers, enhancing its versatility in handling demanding applications.

Manufacturer

The XCVU9P-3FLGB2104E is a product manufactured by Xilinx, Inc., which is known for designing and producing programmable logic devices. Specifically, this product is a part of the Virtex UltraScale+ FPGA (Field-Programmable Gate Array) series.
Xilinx is a technology company that specializes in creating highly flexible and adaptive processing platforms, primarily focusing on FPGAs, adaptive SoCs (System on Chips), and ACAPs (Adaptive Compute Acceleration Platforms). Their products are widely used in a variety of applications, including telecommunications, data centers, automotive, aerospace, and defense industries.
Xilinx has historically been recognized as a leader in the programmable logic device market, contributing significantly to advancements in computing and processing technologies. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), expanding AMD's portfolio in high-performance computing solutions.

Application

The XCVU9P-3FLGB2104E is a high-performance FPGA from the Xilinx Virtex UltraScale+ family. It is used in applications requiring intensive data processing and high bandwidth. Key areas include telecommunications, where it supports 5G infrastructure and advanced networking; data centers, enhancing server performance and AI workloads; aerospace and defense, for signal processing and secure communications; and broadcast, facilitating high-resolution video processing. Additionally, it is utilized in scientific research for accelerated computing tasks and complex simulations. Its versatility and high-speed capabilities make it suitable for various demanding computational tasks across industries.

Package

The XCVU9P-3FLGB2104E is a Virtex UltraScale+ FPGA from Xilinx. The package type is FLGB, which refers to a flip-chip ball grid array (BGA) with 2104 balls.

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