XCZU3CG-2SBVA484I

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XCZU3CG-2SBVA484I

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IC SOC CORTEX-A53 484FCBGA

  • HerstellerAMD Xilinx

  • Herstellerteil #XCZU3CG-2SBVA484I

  • Paket FBGA-484

  • Auf Lager6578

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Spezifikationen

Attribut Wert
Package / Case Tray
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)

Übersicht

Description

The XCZU3CG-2SBVA484I is part of the Zynq UltraScale+ MPSoC family by Xilinx, designed for high-performance applications that require complex processing capabilities. This device integrates a quad-core Arm Cortex-A53 processor, a dual-core Arm Cortex-R5 real-time processor, and Mali-400 MP2 graphics processing unit. These components provide a versatile platform for applications demanding a combination of high processing power, real-time performance, and advanced graphics.
Manufactured with a 16nm process technology, the XCZU3CG-2SBVA484I features extensive programmable logic resources, making it suitable for applications in fields such as automotive, industrial, and communications. It is equipped with high-speed connectivity options, including PCIe, SATA, and Gigabit Ethernet, and supports a wide range of peripherals through its flexible I/O configurations.
The "-2" denotes its speed grade, and the "SBVA484" indicates its package type, which is a 484-pin BGA. The "I" at the end signifies that the device is rated for industrial temperature ranges, making it robust for various environmental conditions. This chip offers a compact and efficient solution for embedded systems requiring high integration and performance.

Equivalent

The XCZU3CG-2SBVA484I is a Xilinx Zynq UltraScale+ MPSoC. Equivalent products might include:
1. Intel Cyclone V SoC series or Arria V SoC series, which also offer integrated processor cores with FPGA fabric.
2. Microsemi (now Microchip Technology) SmartFusion2 SoC FPGAs, combining ARM Cortex-M3 processors with FPGA.
3. Altera's (now part of Intel) Stratix 10 SoCs, depending on specific use-case needs.
These alternatives vary in capabilities, so ensure they meet your specific application requirements.

Features

The XCZU3CG-2SBVA484I is a part of the Xilinx Zynq UltraScale+ MPSoC family. It features a combination of processing system and programmable logic, making it suitable for a wide range of applications. Here are key features:
1. Architecture: It integrates a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and a Mali-400 MP2 GPU.
2. Programmable Logic: Includes FPGA-like logic with 154K system logic cells.
3. Memory: Supports DDR4, LPDDR4, DDR3, and DDR3L memory interfaces.
4. Connectivity: Offers a range of connectivity options, including PCIe, SATA, USB, and Gigabit Ethernet.
5. Security: Provides features such as secure boot, encryption, and authentication for robust security.
6. Power Management: Advanced power management techniques for efficient energy use.
7. Package: Comes in a 484-ball BGA package.
The device targets applications in automotive, industrial, communications, and consumer markets, providing high performance and versatility.

Pinout

The XCZU3CG-2SBVA484I is part of the Xilinx Zynq UltraScale+ MPSoC family. It comes in a 484-pin BGA (Ball Grid Array) package. This device integrates a heterogeneous multi-processing system with features that include a quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5 real-time processors, and a Mali-400 MP2 GPU, along with FPGA fabric.
Key functions of the XCZU3CG-2SBVA484I include:
1. Processing System (PS): Handles applications requiring high processing power and real-time operations.
2. Programmable Logic (PL): Allows for customization and implementation of custom logic and interface designs.
3. High-Performance Interfaces: Supports high-speed connectivity options including PCIe, Ethernet, and other communication protocols.
4. Security Features: Provides encryption and decryption, secure boot, and other security functions for data protection.
5. Integrated Peripherals: Includes controllers for USB, I2C, SPI, SDIO, and UART for interfacing with various external devices.
This combination of features makes it suitable for applications in areas such as automotive, industrial, and telecommunications where high performance and flexibility are needed.

Manufacturer

The XCZU3CG-2SBVA484I is manufactured by Xilinx, Inc. Xilinx is a company known for designing and developing programmable logic devices, including field-programmable gate arrays (FPGAs), system-on-chips (SoCs), and adaptive compute acceleration platforms (ACAPs). These products are widely used in various industries such as telecommunications, automotive, aerospace, defense, and consumer electronics for their ability to be customized and optimized for specific applications. Xilinx's technologies are known for offering high performance, flexibility, and efficiency, making them suitable for a wide range of applications that require processing power and adaptability. As of 2021, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a prominent company in the semiconductor industry known for its CPUs and GPUs, integrating Xilinx's capabilities into AMD's broader product offerings.

Application

The XCZU3CG-2SBVA484I is a Zynq UltraScale+ MPSoC, which integrates a processor system and programmable logic. It is used in various application areas, including:
1. Embedded Systems: For complex embedded applications requiring integrated processing and programmable capabilities.
2. Industrial Automation: For control systems, robotics, and real-time data processing.
3. Automotive: In advanced driver-assistance systems (ADAS) and infotainment.
4. Telecommunications: For signal processing, network management, and 5G applications.
5. Medical Devices: In imaging and diagnostic equipment.
6. Aerospace and Defense: For avionics, radar, and secure communications.
7. Consumer Electronics: In high-performance devices requiring custom processing solutions.
These applications leverage the chip's combination of ARM cores and FPGA fabric.

Package

The XCZU3CG-2SBVA484I is a Xilinx Zynq UltraScale+ MPSoC device. It comes in a BGA (Ball Grid Array) package with 484 pins. The package type is "SBVA484," which indicates specifics about the pin layout and thermal characteristics, making it suitable for high-performance applications. The "-2" denotes the speed grade, and the "I" indicates it is rated for industrial temperature ranges.

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