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XCZU6CG-2FFVC900I
+StücklisteIC SOC CORTEX-A53 900FCBGA
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HerstellerAMD Xilinx
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Herstellerteil #XCZU6CG-2FFVC900I
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Paket FBGA-900
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Auf Lager1864
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key features of the XCZU6CG-2FFVC900I include advanced processing with ARM cores for enhanced system control and real-time applications, integrated FPGA logic for custom hardware acceleration, and high-speed connectivity options. It supports multiple interfaces like PCIe, USB, and Ethernet, making it suitable for diverse applications ranging from automotive and industrial to telecommunications and medical devices.
The -2 speed grade indicates its performance level, and the FFVC900 package type specifies the chip's physical form factor and pin configuration. The 'I' at the end of the model number denotes that the chip is rated for industrial temperature ranges, ensuring reliability in varied environmental conditions. This SoC is ideal for developers looking to leverage a heterogeneous computing platform to achieve optimized performance and integration.
Equivalent
Features
1. Processing System:
- Quad-core ARM Cortex-A53 64-bit processors.
- Dual-core ARM Cortex-R5 real-time processors.
- ARM Mali-400 MP2 GPU for graphics processing.
2. Programmable Logic:
- Over 600K system logic cells for custom hardware acceleration and flexibility.
- High-speed DSP slices for signal processing applications.
3. Memory and Interfaces:
- Integrated memory controllers supporting DDR4, LPDDR4, DDR3, and LPDDR3.
- High-speed connectivity options including Gigabit Ethernet, PCIe Gen2, and USB 3.0.
4. Security and Safety:
- Features for secure boot, encryption, and authentication to ensure data integrity and protection.
5. Temperature and Power:
- The 'I' suffix indicates an industrial-grade temperature range, ensuring reliability in harsh environments.
Overall, the XCZU6CG-2FFVC900I is designed for applications requiring high performance, flexibility, and robust security.
Pinout
The pin count of 900 includes various functions such as power supply, ground, configuration, clocking, I/O banks, and more. These pins support a diverse set of interfaces, including DDR memory interfaces, high-speed transceivers, and peripheral interfaces like I2C, SPI, UART, and others. It supports a broad range of industrial applications due to its extensive input/output capabilities and high-performance processing features.
Manufacturer
In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a company that designs and produces central processing units (CPUs), graphics processing units (GPUs), and other semiconductor products. This acquisition was completed in 2022, allowing AMD to expand its product portfolio and enhance its capabilities in the data center, embedded, and communications markets through Xilinx's expertise in FPGAs and SoCs.
Application
1. Embedded Systems: Ideal for complex embedded applications requiring high processing power and flexibility.
2. Industrial Automation: Used for real-time control and data processing.
3. Automotive: Applied in advanced driver-assistance systems (ADAS) and infotainment.
4. Telecommunications: Supports 5G infrastructure and network acceleration.
5. Medical Devices: Powers complex imaging systems and diagnostics.
6. Aerospace and Defense: Used for secure, high-performance computing tasks.
These applications benefit from its powerful processing capabilities and customizable architecture.