XCZU6CG-2FFVC900I

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XCZU6CG-2FFVC900I

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IC SOC CORTEX-A53 900FCBGA

  • HerstellerAMD Xilinx

  • Herstellerteil #XCZU6CG-2FFVC900I

  • Paket FBGA-900

  • Auf Lager1864

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Spezifikationen

Attribut Wert
Package / Case Tray
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)

Übersicht

Description

The XCZU6CG-2FFVC900I is a model from the Xilinx Zynq UltraScale+ MPSoC series, which integrates a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and FPGA fabric. This versatile system-on-chip (SoC) is designed for high-performance applications requiring significant processing capabilities, flexibility, and power efficiency.
Key features of the XCZU6CG-2FFVC900I include advanced processing with ARM cores for enhanced system control and real-time applications, integrated FPGA logic for custom hardware acceleration, and high-speed connectivity options. It supports multiple interfaces like PCIe, USB, and Ethernet, making it suitable for diverse applications ranging from automotive and industrial to telecommunications and medical devices.
The -2 speed grade indicates its performance level, and the FFVC900 package type specifies the chip's physical form factor and pin configuration. The 'I' at the end of the model number denotes that the chip is rated for industrial temperature ranges, ensuring reliability in varied environmental conditions. This SoC is ideal for developers looking to leverage a heterogeneous computing platform to achieve optimized performance and integration.

Equivalent

The XCZU6CG-2FFVC900I is a member of Xilinx's Zynq UltraScale+ MPSoC family. Equivalent products include other Zynq UltraScale+ devices with similar capabilities, such as the XCZU5CG and XCZU7CG, depending on your specific requirements like logic cells, I/O, and speed grades. From other brands, you might consider Intel's Agilex FPGAs or SoC FPGAs from Microsemi or Lattice, keeping in mind the specific application needs and feature sets. Always compare specifications to ensure compatibility with your application.

Features

The XCZU6CG-2FFVC900I is a versatile System-on-Chip (SoC) from Xilinx's Zynq UltraScale+ MPSoC family. It combines processing, programmable logic, and I/O capabilities on a single chip. Key features include:
1. Processing System:
- Quad-core ARM Cortex-A53 64-bit processors.
- Dual-core ARM Cortex-R5 real-time processors.
- ARM Mali-400 MP2 GPU for graphics processing.
2. Programmable Logic:
- Over 600K system logic cells for custom hardware acceleration and flexibility.
- High-speed DSP slices for signal processing applications.
3. Memory and Interfaces:
- Integrated memory controllers supporting DDR4, LPDDR4, DDR3, and LPDDR3.
- High-speed connectivity options including Gigabit Ethernet, PCIe Gen2, and USB 3.0.
4. Security and Safety:
- Features for secure boot, encryption, and authentication to ensure data integrity and protection.
5. Temperature and Power:
- The 'I' suffix indicates an industrial-grade temperature range, ensuring reliability in harsh environments.
Overall, the XCZU6CG-2FFVC900I is designed for applications requiring high performance, flexibility, and robust security.

Pinout

The XCZU6CG-2FFVC900I is part of the Xilinx Zynq UltraScale+ MPSoC family. It is housed in a 900-pin flip-chip package (FFVC900). This device integrates a quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5 real-time processors, and an ARM Mali-400MP graphics processing unit. It also features programmable logic that can be used for a wide range of applications, making it versatile for both computational and custom logic tasks.
The pin count of 900 includes various functions such as power supply, ground, configuration, clocking, I/O banks, and more. These pins support a diverse set of interfaces, including DDR memory interfaces, high-speed transceivers, and peripheral interfaces like I2C, SPI, UART, and others. It supports a broad range of industrial applications due to its extensive input/output capabilities and high-performance processing features.

Manufacturer

The XCZU6CG-2FFVC900I is manufactured by Xilinx, Inc. Xilinx is a company specializing in the development and production of programmable logic devices, including field-programmable gate arrays (FPGAs), system-on-chips (SoCs), and adaptive compute acceleration platforms (ACAPs). The company is known for its innovation in the semiconductor industry, providing products and solutions that enable a wide range of applications in areas such as data centers, automotive, industrial, and telecommunications.
In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a company that designs and produces central processing units (CPUs), graphics processing units (GPUs), and other semiconductor products. This acquisition was completed in 2022, allowing AMD to expand its product portfolio and enhance its capabilities in the data center, embedded, and communications markets through Xilinx's expertise in FPGAs and SoCs.

Application

The XCZU6CG-2FFVC900I is a Zynq UltraScale+ MPSoC, which integrates a quad-core ARM Cortex-A53, a dual-core ARM Cortex-R5, and programmable logic. It is used in various application areas including:
1. Embedded Systems: Ideal for complex embedded applications requiring high processing power and flexibility.
2. Industrial Automation: Used for real-time control and data processing.
3. Automotive: Applied in advanced driver-assistance systems (ADAS) and infotainment.
4. Telecommunications: Supports 5G infrastructure and network acceleration.
5. Medical Devices: Powers complex imaging systems and diagnostics.
6. Aerospace and Defense: Used for secure, high-performance computing tasks.
These applications benefit from its powerful processing capabilities and customizable architecture.

Package

The XCZU6CG-2FFVC900I is a part of the Xilinx Zynq UltraScale+ MPSoC family. It features a flip-chip, fine-pitch ball grid array (FCBGA) package with 900 pins. The "FFVC900" indicates the package type and pin count, while the "I" signifies its industrial temperature range.

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