XCZU6EG-2FFVB1156I

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XCZU6EG-2FFVB1156I

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IC SOC CORTEX-A53 1156FCBGA

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  • Herstellerteil #XCZU6EG-2FFVB1156I

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Attribut Wert
Series Zynq® UltraScale+™ MPSOC EG
Part Status Active
Base Product Number XCZU6
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
Packaging Tray

Übersicht

Description

The XCZU6EG-2FFVB1156I is part of Xilinx's Zynq UltraScale+ MPSoC family, which integrates heterogeneous computing elements into a single device. This specific model is built with the Xilinx 16nm FinFET+ process technology and features a quad-core ARM Cortex-A53 processor for application processing, a dual-core ARM Cortex-R5 for real-time processing, and a Mali-400 MP2 GPU for graphics processing. It also includes a robust programmable logic fabric similar to that found in the Xilinx FPGA family, allowing for extensive customization.
The -2FFVB1156I variant includes advanced capabilities such as high-speed serial transceivers, DDR4 memory interfaces, and support for various I/O protocols, making it suitable for high-performance applications. This model is designed to operate in industrial temperature ranges, indicated by the "I" at the end of its name, ensuring reliability in harsh environments. Its versatility makes it ideal for applications in automotive, industrial automation, telecommunications, and advanced driver-assistance systems (ADAS), where processing power and flexibility are paramount.

Equivalent

The XCZU6EG-2FFVB1156I is a Zynq UltraScale+ MPSoC by Xilinx. Equivalent products might include:
1. Xilinx XCZU7EV-1FFVC1156I - offers similar processing capabilities with video codec.
2. Intel Cyclone 10 GX - for high-performance FPGA requirements.
3. Microchip PolarFire FPGA - for low-power applications.
4. Lattice ECP5 - for cost-sensitive projects with moderate performance needs.
Each alternative should be evaluated for specific requirements like power, performance, and I/O configuration.

Features

The XCZU6EG-2FFVB1156I is a member of the Xilinx Zynq UltraScale+ MPSoC family, which integrates a high-performance processing system with programmable logic. Key features include:
1. Processing System (PS): It includes a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and a Mali-400 MP2 graphics processor. This combination supports complex processing tasks and efficient real-time performance.
2. Programmable Logic (PL): The device features substantial programmable logic resources, ideal for custom hardware acceleration and adaptable to various applications.
3. Memory: Supports DDR4, DDR3, LPDDR4, and LPDDR3 memory interfaces, providing flexibility for different memory requirements.
4. Connectivity: Offers high-speed connectivity options such as PCIe Gen3, USB 3.0, SATA 3.1, Gigabit Ethernet, and more, ensuring versatile integration with other system components.
5. Security: Incorporates features like secure boot, cryptographic services, and hardware root of trust to enhance system security.
6. Package and Temperature: Comes in a 1156-ball BGA package and is rated for industrial temperature ranges, making it suitable for demanding environments.
These features make the XCZU6EG-2FFVB1156I a powerful solution for applications requiring a combination of processing power, flexibility, and connectivity.

Pinout

The XCZU6EG-2FFVB1156I is a Zynq UltraScale+ MPSoC from Xilinx. It comes in a package with 1156 pins. This device integrates a quad-core ARM Cortex-A53 application processor, a dual-core ARM Cortex-R5 real-time processor, and an UltraScale+ programmable logic fabric. The FFVB1156 package type indicates that it is a Flip-Chip Ball Grid Array (FCBGA) with a 35 x 35 mm footprint.
The functions of these pins are diverse, supporting a broad range of applications. They include power pins, ground pins, and configurable I/O pins that can be used for various interfaces such as GPIO, high-speed serial transceivers, memory interfaces (such as DDR4 memory), and peripheral connectivity (like USB, Ethernet, and more). The pins are also used for programming and configuration functions, clock input and output, and other necessary control signals.
For precise pin functions and assignments, refer to the official datasheet and pin configuration files provided by Xilinx, as these documents offer detailed and specific information on individual pin functions and their configurations.

Manufacturer

The XCZU6EG-2FFVB1156I is manufactured by Xilinx, Inc. Xilinx is a technology company that specializes in the development of highly flexible and adaptive processing platforms. It is best known for inventing the field-programmable gate array (FPGA) and is a leader in adaptive and intelligent computing. Xilinx's products are used across various industries, including telecommunications, automotive, aerospace, and data centers, offering advanced computing solutions that cater to a wide range of applications. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a multinational semiconductor company known for its CPUs and GPUs, further expanding its reach and capabilities in the semiconductor industry.

Application

The XCZU6EG-2FFVB1156I is a Zynq UltraScale+ MPSoC, which combines a high-performance ARM processor with FPGA capabilities. Its application areas include:
1. Embedded Systems: Ideal for complex embedded applications requiring both processing power and reconfigurability.
2. Automotive: Used in advanced driver-assistance systems (ADAS), infotainment, and vehicle networking.
3. Industrial Automation: Supports robotics, control systems, and smart sensors.
4. Telecommunications: Suitable for 5G infrastructure, wireless communications, and network acceleration.
5. Aerospace and Defense: Used in radar, electronic warfare, and secure communication systems.
6. Medical Imaging: Provides real-time processing for imaging devices such as MRI and CT scanners.
Its versatility and performance make it suitable for any application needing high processing power and flexibility.

Package

The XCZU6EG-2FFVB1156I is a Zynq UltraScale+ MPSoC from Xilinx, featuring a System on Chip (SoC) architecture. It comes in an FFG1156 package, which is a Flip-Chip Ball Grid Array (FCBGA) with 1156 pins, designed for high-performance applications. The "-2" denotes the speed grade, and the "I" indicates it is rated for industrial temperature ranges.

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