Abbildungen dienen nur als Referenz
XCZU6EG-2FFVB1156I
+StücklisteIC SOC CORTEX-A53 1156FCBGA
-
HerstellerAMD
-
Herstellerteil #XCZU6EG-2FFVB1156I
-
Auf Lager1272
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Series | Zynq® UltraScale+™ MPSOC EG |
| Part Status | Active |
| Base Product Number | XCZU6 |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35x35) |
| Packaging | Tray |
Übersicht
Description
The -2FFVB1156I variant includes advanced capabilities such as high-speed serial transceivers, DDR4 memory interfaces, and support for various I/O protocols, making it suitable for high-performance applications. This model is designed to operate in industrial temperature ranges, indicated by the "I" at the end of its name, ensuring reliability in harsh environments. Its versatility makes it ideal for applications in automotive, industrial automation, telecommunications, and advanced driver-assistance systems (ADAS), where processing power and flexibility are paramount.
Equivalent
1. Xilinx XCZU7EV-1FFVC1156I - offers similar processing capabilities with video codec.
2. Intel Cyclone 10 GX - for high-performance FPGA requirements.
3. Microchip PolarFire FPGA - for low-power applications.
4. Lattice ECP5 - for cost-sensitive projects with moderate performance needs.
Each alternative should be evaluated for specific requirements like power, performance, and I/O configuration.
Features
1. Processing System (PS): It includes a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and a Mali-400 MP2 graphics processor. This combination supports complex processing tasks and efficient real-time performance.
2. Programmable Logic (PL): The device features substantial programmable logic resources, ideal for custom hardware acceleration and adaptable to various applications.
3. Memory: Supports DDR4, DDR3, LPDDR4, and LPDDR3 memory interfaces, providing flexibility for different memory requirements.
4. Connectivity: Offers high-speed connectivity options such as PCIe Gen3, USB 3.0, SATA 3.1, Gigabit Ethernet, and more, ensuring versatile integration with other system components.
5. Security: Incorporates features like secure boot, cryptographic services, and hardware root of trust to enhance system security.
6. Package and Temperature: Comes in a 1156-ball BGA package and is rated for industrial temperature ranges, making it suitable for demanding environments.
These features make the XCZU6EG-2FFVB1156I a powerful solution for applications requiring a combination of processing power, flexibility, and connectivity.
Pinout
The functions of these pins are diverse, supporting a broad range of applications. They include power pins, ground pins, and configurable I/O pins that can be used for various interfaces such as GPIO, high-speed serial transceivers, memory interfaces (such as DDR4 memory), and peripheral connectivity (like USB, Ethernet, and more). The pins are also used for programming and configuration functions, clock input and output, and other necessary control signals.
For precise pin functions and assignments, refer to the official datasheet and pin configuration files provided by Xilinx, as these documents offer detailed and specific information on individual pin functions and their configurations.
Manufacturer
Application
1. Embedded Systems: Ideal for complex embedded applications requiring both processing power and reconfigurability.
2. Automotive: Used in advanced driver-assistance systems (ADAS), infotainment, and vehicle networking.
3. Industrial Automation: Supports robotics, control systems, and smart sensors.
4. Telecommunications: Suitable for 5G infrastructure, wireless communications, and network acceleration.
5. Aerospace and Defense: Used in radar, electronic warfare, and secure communication systems.
6. Medical Imaging: Provides real-time processing for imaging devices such as MRI and CT scanners.
Its versatility and performance make it suitable for any application needing high processing power and flexibility.