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XCZU9CG-L1FFVB1156I
+StücklisteIC SOC CORTEX-A53 1156FCBGA
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HerstellerAMD Xilinx
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Herstellerteil #XCZU9CG-L1FFVB1156I
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Paket FCBGA-1156
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Auf Lager1981
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Spezifikationen
| Attribut | Wert |
| Package / Case | Bulk |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
The FFVB1156 package indicates a specific BGA (Ball Grid Array) form factor, with 1156 pins, providing robust connectivity options. The "L1" designation relates to the speed grade and power supply requirements, optimizing power efficiency.
Its programmable logic can be customized through Xilinx's Vivado Design Suite, allowing developers to implement tailored hardware accelerations and parallel processing tasks. With high-speed connectivity options like PCIe, Ethernet, and USB, the XCZU9CG-L1FFVB1156I supports advanced data transfer and communication protocols. This flexibility, combined with its processing prowess, makes the device a versatile choice for complex, data-intensive applications.
Equivalent
Features
Key features include:
1. Programmable Logic: It offers advanced FPGA fabric with numerous configurable logic blocks, DSP slices, and block RAM, enabling custom hardware acceleration.
2. Memory Interface: Supports DDR4, DDR3, and LPDDR4 memory interfaces for high-speed data transfer.
3. Connectivity: Includes multiple high-speed transceivers for interfaces such as PCIe, SATA, and Gigabit Ethernet, plus a wide range of peripheral interfaces like USB, I2C, and SPI.
4. Security: Features integrated security with secure boot, encryption, and authentication capabilities.
5. Power Management: Advanced power management options for efficient energy usage.
This makes the XCZU9CG-L1FFVB1156I suitable for applications requiring complex processing and reconfigurable logic, such as embedded systems, automotive, and communications infrastructure.
Pinout
Key functionalities of the XCZU9CG include:
1. Processing System (PS): It features a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and a Mali-400 MP2 GPU, which handles complex processing tasks.
2. Programmable Logic (PL): The device includes a substantial amount of configurable logic blocks, DSP slices, and block RAM, allowing custom hardware design.
3. I/O Capabilities: The extensive pin count supports a variety of interfaces and I/O standards, facilitating connectivity and data transfer with external devices.
4. Integrated Peripherals: It supports features like PCIe, USB, Gigabit Ethernet, and more, enhancing its use in diverse applications.
Overall, the XCZU9CG-L1FFVB1156I is designed for applications in telecommunications, automotive, and industrial automation, among others, where high performance and flexibility are crucial.
Manufacturer
FPGAs, like the XCZU9CG-L1FFVB1156I, are semiconductor devices that can be configured by the customer or designer after manufacturing, which makes them highly versatile for various applications. These applications can range from data centers and artificial intelligence to industrial, automotive, and telecommunications sectors.
In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a multinational semiconductor company known for its computer processors and related technologies. This acquisition was completed in 2022 and made Xilinx a part of AMD's business operations, further broadening AMD's product offerings and capabilities in the semiconductor market.
Application
1. Embedded Systems: Utilized in advanced embedded computing platforms for its efficient hardware and software integration.
2. Automotive: Supports advanced driver-assistance systems (ADAS) and infotainment solutions due to its high performance and reliability.
3. Networking: Suitable for high-speed data processing and communications infrastructure.
4. Industrial Automation: Used in smart factories for real-time control and machine learning tasks.
5. Aerospace and Defense: Offers secure and flexible solutions for avionics and military applications.
6. Medical Devices: Powers imaging and diagnostic equipment with its robust processing capabilities.