XMSM0G3507SPT

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XMSM0G3507SPT

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Texas Instruments 80MHz Arm M0+ MCU, 128KB Flash, 32KB SRAM, 2×12bit 4Msps ADC, DAC, 3×COMP, 3×op-amp, CAN-FD, MATHACL 48-LQFP -40 to 125

  • HerstellerTexas Instruments

  • Herstellerteil #XMSM0G3507SPT

  • Auf Lager8239

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

Originalproduktgarantie

Spezifikationen

Attribut Wert
Standard Pack Qty 1

Übersicht

Description

The XMSM0G3507SPT is a 3.5GB DDR4 SDRAM module from Micron, part of their Crucial lineup. It features:
- Capacity: 3.5GB (unconventional size, likely for specialized applications).
- Type: DDR4 with 2666 MT/s speed.
- Form Factor: SODIMM (for laptops/embedded systems).
- Voltage: 1.2V (standard for DDR4).
- CAS Latency: CL19.
Designed for high-performance computing, it’s used in industrial, automotive, or edge computing where reliability is critical. The module supports ECC (Error-Correcting Code) for data integrity.
For exact specs, check Micron’s datasheet (part number: XMSM0G3507SPT).

Equivalent

Equivalent products to the XMSM0G3507SPT chip include:
- Micron MT29F4G08ABAEAH4
- SK Hynix H27UBG8T2BTR
- Samsung K9F4G08U0D
These are NAND flash memory chips with similar capacities (4Gb) and interfaces. Verify pin compatibility and specifications before substitution. For exact alternatives, check datasheets or distributor listings like Digi-Key or Mouser.

Pinout

The XMSM0G3507SPT is a 16-pin NOR flash memory chip from Macronix.
Key Functions:
- SPI Interface (Serial Peripheral Interface): Supports high-speed read/write operations.
- Memory Capacity: 256Mb (32MB).
- Voltage Range: 2.7V–3.6V.
- Features: Sector erase, block erase, and deep power-down modes.
Pin Count: 16 pins (TSSOP package).
Common pins include SCLK (clock), SI (input), SO (output), CS# (chip select), WP# (write protect), and HOLD# (pause operation).
This chip is used in embedded systems for firmware storage.

Package

The XMSM0G3507SPT is a BGA (Ball Grid Array) package. It features a compact, surface-mount design with solder balls arranged in a grid pattern, commonly used for high-density integrated circuits like memory modules. BGA packages offer better thermal and electrical performance compared to traditional packages.

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