Part A
10M16SAU169I7G
Intel
- Lifecycle
- Active
- Stock
- 6216 Stückzahl
- Package
- BGA-169
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M16SAU169I7G and 10M16DCF484C7G are both Intel MAX 10 FPGA devices sharing the same 16,000 logic element density and 10M16 core architecture, making them functionally comparable in logic capacity. However, they differ in package type, operating temperature grade, and speed grade, so a direct drop-in replacement is not possible without design and PCB adaptation. The 10M16SAU169I7G offers an industrial temperature range in a 169-pin UBGA package, while the 10M16DCF484C7G provides a commercial temperature range in a 484-pin FBGA package. Designers must verify pinout, thermal requirements, and timing closure before substituting one for the other.
Logic Element Density
High match
Package Type
Not compatible
Operating Temperature
Validation required
Speed Grade
Validation required
Parts at a glance
Part B
10M16DCF484C7G
Intel
- Lifecycle
- Active
- Stock
- 6411 Stückzahl
- Package
- BGA-484
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16SAU169I7G | 10M16DCF484C7G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both belong to the same Intel MAX 10 FPGA family, which is the baseline requirement for functional substitutability. |
| Logic Elements (LEs) | 16,000 | 16,000 | Identical logic capacity means equivalent programmable logic resources for the target design. |
| Package | 169-pin UBGA (FineLine BGA) | 484-pin FBGA | Different package footprints and pin counts prevent direct drop-in replacement on the same PCB. |
| Operating Temperature Range | Industrial (-40°C to +100°C junction) | Commercial (0°C to +85°C junction) | Industrial-grade parts support harsher environments; commercial parts are limited to benign conditions. |
| Speed Grade | 7 (fastest) | 7 (fastest) | Matching speed grades ensures comparable timing performance and Fmax for the same design. |
| Embedded Memory (M9K blocks) | 549 Kbits | 549 Kbits | Equal on-chip memory supports the same buffering, FIFO, and data storage requirements. |
| User I/O Count | 130 | 320 | Different I/O counts affect how many peripherals and interfaces can be connected, impacting system integration. |
| Configuration Method | Single-supply (internal configuration flash) | Dual-supply (internal configuration flash) | Configuration supply scheme affects board power design and whether external configuration memory is needed. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Identical core voltage allows reuse of the same power rail design and decoupling strategy. |
| RoHS Compliance | RoHS compliant | RoHS compliant | Both meet environmental regulations, so no compliance barrier exists for substitution in regulated markets. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16SAU169I7G | 10M16DCF484C7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 130 | 320 |
| Voltage - Supply | 2.85V ~ 3.465V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 10M16SAU169I7G and the 10M16DCF484C7G?
The 10M16SAU169I7G is a MAX 10 FPGA in a 169-pin UBGA package with a commercial-grade speed grade of 7 and an industrial temperature range of -40°C to 100°C (TJ). The 10M16DCF484C7G is a MAX 10 FPGA in a 484-pin FBGA package with a commercial-grade speed grade of 7 and a commercial temperature range of 0°C to 85°C (TJ). Both devices offer 16,000 logic elements (LEs), but they differ in package, pin count, and operating temperature range.
Do the 10M16SAU169I7G and 10M16DCF484C7G have the same logic density and memory resources?
Yes. Both devices are part of the Intel MAX 10 FPGA family and feature 16,000 logic elements (LEs), 549 Kbits of M9K embedded memory, and 32 18x18 multipliers. They also both include integrated analog-to-digital converter (ADC) blocks and flash memory for configuration.
Are the 10M16SAU169I7G and 10M16DCF484C7G pin-to-pin compatible?
No. The 10M16SAU169I7G uses a 169-pin UBGA package, while the 10M16DCF484C7G uses a 484-pin FBGA package. The different package sizes, ball counts, and ball maps make them physically and electrically incompatible for direct PCB replacement without a redesign.
Can the 10M16SAU169I7G and 10M16DCF484C7G operate in the same temperature environments?
No. The 10M16SAU169I7G is rated for industrial temperature operation with a junction temperature range of -40°C to 100°C. The 10M16DCF484C7G is rated for commercial temperature operation with a junction temperature range of 0°C to 85°C. The industrial-grade device is suitable for harsher environments, while the commercial-grade device is intended for controlled environments.
Do both devices support the same configuration methods?
Yes. Both the 10M16SAU169I7G and 10M16DCF484C7G support dual configuration from internal flash and external sources, as well as instant-on configuration from internal flash. They also support remote system upgrade and configuration via JTAG, active serial, and passive serial modes, consistent with the MAX 10 family features.
Which device is better suited for space-constrained designs?
The 10M16SAU169I7G is better suited for space-constrained designs because its 169-pin UBGA package (11 mm x 11 mm) occupies significantly less PCB area than the 484-pin FBGA package (23 mm x 23 mm) of the 10M16DCF484C7G. However, the smaller package offers fewer user I/O pins.
Are the 10M16SAU169I7G and 10M16DCF484C7G RoHS compliant?
Yes. Both devices are offered in RoHS-compliant packages as part of Intel's MAX 10 FPGA family. The "G" suffix in both part numbers indicates RoHS compliance and lead-free packaging.
Can the 10M16DCF484C7G be used as a drop-in replacement for the 10M16SAU169I7G?
No. The 10M16DCF484C7G cannot be used as a drop-in replacement for the 10M16SAU169I7G due to differences in package type, pin count, ball map, and temperature grade. A redesign of the PCB and thermal management system would be required, and the commercial temperature rating of the 10M16DCF484C7G may not meet the industrial temperature requirements of the original design.