10M16SAU169I7G
Intel
- Lifecycle
- Active
- Stock
- 6216 Stückzahl
- Package
- BGA-169
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Dieser detaillierte Vergleich von 10M16SAU169I7G und 10M16DCF484I6G bietet wertvolle Einblicke in deren Spezifikationen und Hauptmerkmale. Wir gehen ausführlich auf wichtige Faktoren ein, darunter RoHS-Konformität, REACH-Status, Serie, Montageart, Gehäusetyp und weitere relevante Eigenschaften. Die übersichtliche Darstellung der Unterschiede vereinfacht die Komponentenauswahl und erleichtert Ihnen die Wahl der optimalen Lösung für Ihre Anwendung.
Replacement verdict
The 10M16SAU169I7G and 10M16DCF484I6G are both Intel MAX 10 FPGA devices sharing 16,000 logic elements, but they differ in package, I/O count, and speed grade. The 10M16SAU169I7G offers a higher I/O count in a UBGA-169 package with a faster speed grade, while the 10M16DCF484I6G provides fewer I/Os in a larger FBGA-484 package. They are functionally related but not pin-to-pin drop-in replacements; design migration requires package, pinout, and timing revalidation.
Intel
Intel
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16SAU169I7G | 10M16DCF484I6G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both belong to the same Intel MAX 10 FPGA family, which is the baseline requirement for functional substitutability. |
| Logic Elements (LEs) | 16,000 | 16,000 | Identical logic capacity means the same user logic can fit in either device without redesign. |
| Package | 169-pin UBGA (FineLine BGA) | 484-pin FBGA | Different package footprints and pin counts prevent direct drop-in replacement on the same PCB. |
| Operating Temperature Range | Industrial (-40°C to +100°C junction) | Industrial (-40°C to +100°C junction) | Matching temperature grades ensure both parts are suitable for the same environmental conditions. |
| Speed Grade | 7 (faster) | 6 (slower) | Different speed grades affect maximum operating frequency and timing closure; a slower grade may not meet the same timing requirements. |
| Embedded Memory (M9K blocks) | 549 Kbits | 549 Kbits | Identical embedded memory capacity supports the same buffering and storage functions. |
| User I/O Count | 130 | 320 | Different I/O counts affect how many peripherals and interfaces can be connected, impacting system integration. |
| Configuration Flash (Internal) | Yes (single-chip) | Yes (single-chip) | Both are single-chip MAX 10 devices with integrated configuration flash, simplifying board design. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Same core voltage allows reuse of the same power supply design. |
| Analog-to-Digital Converter (ADC) | Yes (12-bit, 1 Msps) | Yes (12-bit, 1 Msps) | Both include the same ADC block, enabling analog sensing without external components. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M16SAU169I7G | 10M16DCF484I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 130 | 320 |
| Voltage - Supply | 2.85V ~ 3.465V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
The 10M16SAU169I7G is a MAX 10 FPGA in a 169-pin UBGA package with speed grade 7 and industrial temperature range. The 10M16DCF484I6G is a MAX 10 FPGA in a 484-pin FBGA package with speed grade 6 and industrial temperature range. Both devices feature 16,000 logic elements, but they differ in package, pin count, speed grade, and I/O count.
Yes. Both the 10M16SAU169I7G and 10M16DCF484I6G are members of the Intel MAX 10 FPGA family with 16,000 logic elements (LEs), as confirmed by Intel MAX 10 device datasheets.
No. The 10M16SAU169I7G uses a 169-pin UBGA package, while the 10M16DCF484I6G uses a 484-pin FBGA package. The different package sizes, ball counts, and ball maps prevent direct pin-to-pin compatibility.
The 10M16SAU169I7G has a speed grade of 7, while the 10M16DCF484I6G has a speed grade of 6. In Intel MAX 10 nomenclature, a lower speed grade number indicates a faster device, so the 10M16DCF484I6G offers higher performance than the 10M16SAU169I7G.
Yes. Both the 10M16SAU169I7G and 10M16DCF484I6G are specified for the industrial temperature range (I-grade), typically -40°C to +100°C junction temperature, as defined in Intel MAX 10 datasheets.
No. Although both are 16,000-LE MAX 10 FPGAs, they differ in package, pin count, speed grade, and I/O count. A direct substitution would require a complete redesign of the PCB layout, pin assignment, and timing closure. Designers must validate all differences against the respective device datasheets before considering any replacement.
The 10M16DCF484I6G, in the 484-pin FBGA package, provides a higher number of user I/O pins than the 10M16SAU169I7G in the 169-pin UBGA package. The exact I/O counts are specified in the Intel MAX 10 device pin-out files and datasheets.
Yes. Both the 10M16SAU169I7G and 10M16DCF484I6G belong to the Intel MAX 10 FPGA family, which features non-volatile instant-on configuration, integrated analog-to-digital converters, and embedded memory blocks.