10M25DAF484C8G
Intel
- Lifecycle
- Active
- Stock
- 4515 Stückzahl
- Package
- FBGA-484
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Dieser detaillierte Vergleich von 10M25DAF484C8G und 10M25DAF484I7G bietet wertvolle Einblicke in deren Spezifikationen und Hauptmerkmale. Wir gehen ausführlich auf wichtige Faktoren ein, darunter RoHS-Konformität, REACH-Status, Serie, Montageart, Gehäusetyp und weitere relevante Eigenschaften. Die übersichtliche Darstellung der Unterschiede vereinfacht die Komponentenauswahl und erleichtert Ihnen die Wahl der optimalen Lösung für Ihre Anwendung.
Replacement verdict
The 10M25DAF484I7G and 10M25DAF484C8G are functionally compatible replacements, sharing identical logic density, package, and I/O configuration, with the primary distinction being the industrial versus commercial temperature grade. The industrial-grade 10M25DAF484I7G can directly replace the commercial-grade 10M25DAF484C8G in most applications, provided the system timing budget accommodates the slightly slower industrial speed grade.
Intel
Intel
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M25DAF484I7G | 10M25DAF484C8G | Why it matters |
|---|---|---|---|
| Operating Temperature Range | -40°C to 100°C (Industrial) | 0°C to 85°C (Commercial) | Determines the environments in which the device can reliably operate; industrial-grade parts support wider temperature extremes than commercial-grade parts. |
| Speed Grade | 7 (faster) | 8 (slower) | A lower speed grade number indicates faster maximum operating frequency and tighter timing, affecting achievable clock rates and timing closure. |
| Family / Series | MAX 10 | MAX 10 | Both devices belong to the same FPGA family, ensuring similar architecture, tool support, and feature set. |
| Logic Elements (LEs) | 25,000 | 25,000 | Logic capacity determines the complexity of digital designs the FPGA can implement. |
| Package | 484-pin FBGA | 484-pin FBGA | Package type and pin count must match for physical board compatibility and footprint interchangeability. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Core voltage must be compatible with the board power design; identical values allow direct substitution without power changes. |
| Embedded Memory | Up to 1,152 Kbits | Up to 1,152 Kbits | On-chip memory capacity affects the ability to store data, buffers, and implement memory-intensive functions. |
| Configuration Flash | Integrated (up to 8 Mb) | Integrated (up to 8 Mb) | Integrated configuration flash enables single-chip, instant-on operation without external configuration memory. |
| DSP Blocks | Yes (18x18 multipliers) | Yes (18x18 multipliers) | Dedicated DSP blocks accelerate arithmetic operations such as filtering and signal processing. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M25DAF484C8G | 10M25DAF484I7G |
|---|---|---|
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1563 | 1563 |
| Number of Logic Elements/Cells | 25000 | 25000 |
| Total RAM Bits | 691200 | 691200 |
| Number of I/O | 360 | 360 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
Both are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the same 484-pin FineLine BGA (FBGA) package. They share the same 25,000-logic-element density, on-chip analog-to-digital converter (ADC) blocks, and non-volatile configuration flash. The suffix difference indicates the speed grade and operating temperature range: the 10M25DAF484I7G is an industrial-grade device (I7), while the 10M25DAF484C8G is a commercial-grade device (C8).
The "I7" suffix denotes an industrial temperature grade with a speed grade of 7, while "C8" denotes a commercial temperature grade with a speed grade of 8. Industrial-grade devices are specified for a wider ambient temperature range (typically -40°C to +100°C junction, per Intel MAX 10 datasheet), whereas commercial-grade devices are specified for 0°C to +85°C junction. Speed grade 7 is faster than speed grade 8, meaning the I7 device offers shorter propagation delays and higher maximum operating frequencies.
Yes. Both devices use the same 484-pin FineLine BGA package with identical pinouts as defined in the Intel MAX 10 device pin-out files. The package dimensions, ball pitch, and ball assignments are the same, so they are footprint-compatible. However, pin compatibility does not guarantee electrical or timing equivalence; the speed grade and temperature grade differences must be validated for the target design.
Not unconditionally. Although both are pin-compatible 25,000-LE MAX 10 FPGAs in the same 484-pin FBGA package, the I7 device is faster (speed grade 7) and rated for industrial temperature range, while the C8 device is slower (speed grade 8) and rated for commercial temperature range. A drop-in replacement is only valid if the design's timing margins, power budget, and thermal environment are re-verified against the C8 speed grade and commercial temperature limits using Intel's timing analysis tools and the MAX 10 datasheet.
Yes. Both the 10M25DAF484I7G and 10M25DAF484C8G are MAX 10 devices with the same 25,000-LE architecture, integrated non-volatile configuration flash, and support for dual configuration images. They both include on-chip ADC blocks, internal oscillator, and support for instant-on configuration. Configuration scheme options, including JTAG, active serial, and internal configuration, are identical across both speed and temperature grades as documented in the Intel MAX 10 general-purpose I/O and configuration user guides.
The 10M25DAF484I7G is the appropriate choice for industrial-temperature applications because its "I" suffix indicates an industrial temperature grade, typically specified for -40°C to +100°C junction temperature per the Intel MAX 10 datasheet. The 10M25DAF484C8G is a commercial-grade device and is not rated for the industrial temperature range. Selecting the C8 device for an industrial environment would exceed its specified operating conditions and is not supported by Intel's published specifications.
Yes, speed grade can influence dynamic power consumption. A faster speed grade (7, as in the 10M25DAF484I7G) generally allows operation at lower supply voltage corners or completes switching faster, which can affect dynamic power. However, static power and leakage also depend on temperature grade and operating conditions. Intel's PowerPlay Early Power Estimator and the MAX 10 power datasheet should be used to compare power for both the I7 and C8 variants under the actual design's clock frequencies, toggle rates, and temperature conditions.
Intel MAX 10 devices, including the 10M25DAF484I7G and 10M25DAF484C8G, are offered in RoHS-compliant package options as stated in Intel's product material declarations. Both part numbers are cataloged by authorized distributors such as DigiKey, Mouser, and Arrow, subject to availability. Designers should confirm the specific ordering code, RoHS status, and lead-free finish from the distributor's product page or Intel's ordering information before finalizing a bill of materials.