10M40DCF256I7G
Intel
- Lifecycle
- Active
- Stock
- 4120 Stückzahl
- Package
- LBGA-256
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Dieser detaillierte Vergleich von 10M40DCF256I7G und 10M40DAF256C7G bietet wertvolle Einblicke in deren Spezifikationen und Hauptmerkmale. Wir gehen ausführlich auf wichtige Faktoren ein, darunter RoHS-Konformität, REACH-Status, Serie, Montageart, Gehäusetyp und weitere relevante Eigenschaften. Die übersichtliche Darstellung der Unterschiede vereinfacht die Komponentenauswahl und erleichtert Ihnen die Wahl der optimalen Lösung für Ihre Anwendung.
Replacement verdict
The 10M40DCF256I7G and 10M40DAF256C7G are both Intel MAX 10 field-programmable gate arrays sharing the same 40,000-logic-element density, 256-ball FineLine BGA package, and core architecture, making them functionally interchangeable in many designs. However, they differ in speed grade and operating temperature range, so the 10M40DAF256C7G (commercial, faster grade) can generally substitute for the 10M40DCF256I7G (industrial, slower grade) only when the application does not require industrial temperature support and timing margins remain valid. Designers should verify thermal requirements and timing closure before committing to this substitution.
Intel
Intel
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M40DCF256I7G | 10M40DAF256C7G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both devices belong to the same MAX 10 FPGA family, which is essential for pinout, toolchain, and IP compatibility. |
| Logic Elements (LEs) | 40,000 | 40,000 | Matching logic density ensures equivalent design capacity and resource availability for the target application. |
| Package | 256-pin FBGA | 256-pin FBGA | Identical package and pin count allow the same PCB footprint and assembly process to be reused. |
| Operating Temperature Range | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) | The temperature grade determines whether the device can be used in industrial or commercial environments and affects reliability margins. |
| Speed Grade | 7 (Fastest) | 7 (Fastest) | The speed grade affects maximum operating frequency and timing closure; identical grades simplify timing migration. |
| Embedded Memory (M9K) | 1,260 Kbits | 1,260 Kbits | Equal embedded memory capacity supports the same buffering, FIFO, and data storage requirements. |
| User I/O Pins | 178 | 178 | Matching I/O count ensures the same number of external interfaces can be supported without redesign. |
| Configuration Method | Instant-on, dual configuration | Instant-on, dual configuration | Identical configuration features allow the same boot and fail-safe strategy to be used in both designs. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Same core voltage means the same power supply design and decoupling network can be applied. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M40DCF256I7G | 10M40DAF256C7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 2500 | 2500 |
| Number of Logic Elements/Cells | 40000 | 40000 |
| Total RAM Bits | 1290240 | 1290240 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
The primary differences are the operating temperature grade and the speed grade. The 10M40DCF256I7G is specified for the industrial temperature range (I7), while the 10M40DAF256C7G is specified for the commercial temperature range (C7). Both devices are members of the Intel (formerly Altera) MAX 10 family, feature 40,000 logic elements (LEs), and are supplied in a 256-pin FineLine BGA (FBGA) package. The suffix "D" indicates dual-supply configuration flash memory, and both support instant-on operation.
Yes. Both devices share the same 256-pin FineLine BGA (FBGA) package with identical pinouts as defined by the MAX 10 device family datasheet. This allows a common PCB footprint, but the designer must verify that the temperature and speed grade differences meet the target application requirements.
Not unconditionally. Although the package and pinout are identical, the 10M40DCF256I7G is rated for the industrial temperature range (typically –40°C to +100°C junction) and has a faster speed grade (7), while the 10M40DAF256C7G is rated for the commercial temperature range (0°C to +85°C junction) with speed grade 7. A drop-in replacement is possible only if the application's operating temperature and timing margins are satisfied by the industrial-grade device. Always confirm against the latest manufacturer datasheet.
Both the 10M40DCF256I7G and the 10M40DAF256C7G provide 40,000 logic elements (LEs), which is the defining feature of the MAX 10 10M40 density level. They also include embedded memory blocks and user flash memory as documented in the MAX 10 device family specifications.
Yes. The "D" in the part number (10M40D...) indicates dual-supply configuration flash memory, which supports dual configuration images. This feature allows the device to hold two separate configuration images and switch between them, as described in the MAX 10 device handbook.
The 10M40DCF256I7G is specified for the industrial temperature grade, which for MAX 10 devices typically corresponds to a junction temperature range of –40°C to +100°C. The 10M40DAF256C7G is specified for the commercial temperature grade, typically 0°C to +85°C junction. These ranges are defined in the MAX 10 device datasheet and must be observed for reliable operation.
No. The 10M40DCF256I7G has a speed grade of 7 (indicated by the "7" before the "G" in the part number), while the 10M40DAF256C7G also has a speed grade of 7. Both are speed grade 7 devices, but they differ in temperature grade. The speed grade affects timing parameters such as maximum operating frequency and propagation delays, which are detailed in the MAX 10 device datasheet.
Both devices support configuration via internal configuration flash memory, which enables instant-on operation. They also support external configuration through interfaces such as JTAG and passive serial. The dual-supply configuration flash memory in these "D" variants allows for dual configuration images. Refer to the MAX 10 configuration user guide for detailed options.