10M40DCF256I7G
Intel
- Lifecycle
- Active
- Stock
- 4120 Stückzahl
- Package
- LBGA-256
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Dieser detaillierte Vergleich von 10M40DCF256I7G und 10M40DCF256I6G bietet wertvolle Einblicke in deren Spezifikationen und Hauptmerkmale. Wir gehen ausführlich auf wichtige Faktoren ein, darunter RoHS-Konformität, REACH-Status, Serie, Montageart, Gehäusetyp und weitere relevante Eigenschaften. Die übersichtliche Darstellung der Unterschiede vereinfacht die Komponentenauswahl und erleichtert Ihnen die Wahl der optimalen Lösung für Ihre Anwendung.
Replacement verdict
The 10M40DCF256I7G and 10M40DCF256I6G are functionally equivalent Intel MAX 10 FPGA devices sharing identical logic density, package, and I/O configuration; the only verified distinction is the maximum operating temperature grade, making the I7G a valid functional substitute for the I6G provided the target application's thermal margin is confirmed.
Intel
Intel
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M40DCF256I7G | 10M40DCF256I6G | Why it matters |
|---|---|---|---|
| Speed Grade | 7 | 6 | A lower speed grade number indicates faster maximum operating frequency and tighter timing, directly affecting achievable clock rates and timing closure. |
| Family | MAX 10 | MAX 10 | Same device family ensures identical architecture, IP compatibility, and tool support. |
| Logic Elements (LEs) | 40000 | 40000 | Logic capacity determines how much custom logic can be implemented in the FPGA fabric. |
| Package | 256-FBGA | 256-FBGA | Identical package ensures the same footprint, pinout, and PCB layout compatibility. |
| Operating Temperature Range | -40°C to 100°C (Industrial) | -40°C to 100°C (Industrial) | Same temperature range confirms both parts are suitable for the same environmental conditions. |
| Supply Voltage | 1.2 V core | 1.2 V core | Matching core voltage ensures identical power supply design and compatibility. |
| Embedded Memory | 1260 kbit | 1260 kbit | On-chip memory capacity affects data buffering and storage capabilities within the FPGA. |
| Configuration Flash | Integrated | Integrated | Integrated configuration flash enables single-chip operation without external configuration memory. |
| Number of I/O Pins | 178 | 178 | I/O count determines how many external signals and peripherals can be interfaced. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M40DCF256I7G | 10M40DCF256I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 2500 | 2500 |
| Number of Logic Elements/Cells | 40000 | 40000 |
| Total RAM Bits | 1290240 | 1290240 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
The primary difference is the speed grade. The 10M40DCF256I7G is specified with a speed grade of 7, while the 10M40DCF256I6G is specified with a faster speed grade of 6. Both devices are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the same 256-pin FineLine BGA (FBGA) package, with the same 40,000 logic elements (LEs) and industrial temperature range.
Yes. Both devices share the same 256-pin FineLine BGA (FBGA) package and the same device family (MAX 10 10M40D). The pinout is identical across speed grades for the same package and device density, so they are pin-to-pin compatible.
In many cases yes, because the package and pinout are identical. However, the 10M40DCF256I6G has a faster speed grade (6 vs. 7), which can affect timing closure, power consumption, and signal integrity. The replacement should only be made after verifying that the design meets all timing and power requirements with the faster device, as documented in the Intel MAX 10 device datasheet and relevant timing models.
Both devices are specified for the industrial temperature range, which for Intel MAX 10 FPGAs is typically –40°C to +100°C junction temperature (TJ). The "I" in the part number indicates industrial grade. Designers should confirm the exact thermal limits in the official Intel MAX 10 datasheet for the specific speed grade and package.
Yes. Both the 10M40DCF256I7G and 10M40DCF256I6G are based on the same MAX 10 10M40D device die and therefore support the same configuration options, including internal configuration flash, dual configuration images, and analog-to-digital converter (ADC) blocks. The only difference is the speed grade, which affects maximum operating frequency and timing parameters, not the available hard IP or memory blocks.
The choice depends on the required system performance and timing margins. Speed grade 6 offers faster maximum frequencies and tighter timing specifications, which can help meet aggressive performance targets. Speed grade 7 is slower but may be sufficient for lower-speed designs and can sometimes reduce power consumption. Intel's MAX 10 datasheet provides the exact timing parameters for each speed grade to guide the selection.
Yes. Intel MAX 10 devices in the 256-pin FBGA package are offered as RoHS-compliant products. The "G" suffix in the part number indicates RoHS compliance. Designers should verify the latest compliance status through Intel's product material declaration or distributor documentation, as regulations and exemptions can change.