Part A
10M50DAF256I6G
Intel
- Lifecycle
- Active
- Stock
- 5635 Stückzahl
- Package
- LBGA-256
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M50DAF256I6G and 10M50DAF256C6G are functionally equivalent MAX 10 FPGA devices sharing identical logic density, package, and I/O configuration; the only material distinction is the operating temperature grade, making the industrial-grade variant a viable substitute for the commercial-grade part in most designs.
Logic Density
High match
Package Type
High match
I/O Count
High match
Operating Temperature
Validation required
Parts at a glance
Part B
10M50DAF256C6G
Intel
- Lifecycle
- Active
- Stock
- 7922 Stückzahl
- Package
- LBGA-256
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M50DAF256I6G | 10M50DAF256C6G | Why it matters |
|---|---|---|---|
| Operating Temperature Range | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) | Determines the environments in which the device can reliably operate; industrial grade supports harsher conditions than commercial grade. |
| Device Family | Intel MAX 10 FPGA | Intel MAX 10 FPGA | Both parts belong to the same FPGA family, ensuring architectural and toolchain compatibility. |
| Logic Elements (LEs) | 50,000 | 50,000 | Logic capacity determines the complexity of digital designs the FPGA can implement. |
| Package | 256-pin FBGA | 256-pin FBGA | Package type and pin count must match for PCB footprint and assembly compatibility. |
| Speed Grade | 6 | 6 | Speed grade affects maximum operating frequency and timing closure of designs. |
| Supply Voltage | 1.2 V core (with 2.5 V/3.3 V I/O options) | 1.2 V core (with 2.5 V/3.3 V I/O options) | Core and I/O voltages must be compatible with the surrounding power and interface circuitry. |
| Embedded Memory | Up to 1,638 Kbits | Up to 1,638 Kbits | On-chip memory capacity influences the ability to store data, buffers, and configuration information. |
| Configuration Flash | Integrated (single-chip) | Integrated (single-chip) | Integrated configuration flash simplifies board design and reduces external component count. |
| RoHS Compliance | RoHS compliant | RoHS compliant | RoHS compliance is required for sale and use in many regions and ensures environmental regulatory conformity. |
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Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M50DAF256I6G | 10M50DAF256C6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 3125 | 3125 |
| Number of Logic Elements/Cells | 50000 | 50000 |
| Total RAM Bits | 1677312 | 1677312 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What is the difference between the 10M50DAF256I6G and the 10M50DAF256C6G?
The primary difference is the operating temperature grade. The 10M50DAF256I6G is an industrial-grade device, while the 10M50DAF256C6G is a commercial-grade device. Both are Intel (Altera) MAX 10 field-programmable gate arrays (FPGAs) in the same 256-pin FineLine BGA (FBGA) package with speed grade 6 and the same logic density of 50,000 logic elements.
What are the operating temperature ranges for these two devices?
The 10M50DAF256I6G (industrial grade) is specified for a junction temperature range of -40°C to +100°C (Tj). The 10M50DAF256C6G (commercial grade) is specified for a junction temperature range of 0°C to +85°C (Tj). These ranges are defined in the Intel MAX 10 FPGA device datasheet.
Are the 10M50DAF256I6G and 10M50DAF256C6G pin-compatible?
Yes. Both devices share the same 256-pin FineLine BGA (FBGA) package with identical pinouts. The package code "F256" indicates a 256-ball FBGA, and the pin assignments are the same for both temperature grades. This allows a single PCB design to accommodate either device.
Can the 10M50DAF256C6G be used as a drop-in replacement for the 10M50DAF256I6G?
No, not in all applications. While they are pin-compatible, the commercial-grade 10M50DAF256C6G has a narrower operating temperature range (0°C to +85°C Tj) compared to the industrial-grade 10M50DAF256I6G (-40°C to +100°C Tj). A drop-in replacement is only acceptable if the target application's operating temperature remains within the commercial grade's specified range and all other electrical specifications are met.
Do both devices have the same logic density and speed grade?
Yes. Both the 10M50DAF256I6G and 10M50DAF256C6G feature 50,000 logic elements (LEs) and a speed grade of 6. The "10M50" prefix denotes the MAX 10 family with 50K LEs, and the "6" before the package/temperature code indicates the speed grade. They also include the same embedded memory, DSP blocks, and analog-to-digital converter (ADC) blocks as per the MAX 10 device family specifications.
What are the power supply requirements for these devices?
Both devices require the same power supply voltages as specified for the MAX 10 family: VCC core voltage of 1.2 V, VCCA for PLL and ADC blocks, and VCCIO for I/O banks which can be 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on the I/O standard. The industrial-grade device may have slightly different power consumption characteristics over its extended temperature range, but the nominal supply voltages are identical.
Which device is more suitable for automotive or industrial applications?
The 10M50DAF256I6G is more suitable for industrial and automotive applications that require operation below 0°C or above +85°C junction temperature. The 10M50DAF256C6G is intended for commercial applications such as consumer electronics, office equipment, and other environments where the temperature remains within 0°C to +85°C Tj. Neither device is automotive-qualified unless specifically ordered with an automotive grade suffix, which these part numbers do not include.
Are the configuration and programming methods the same for both devices?
Yes. Both the 10M50DAF256I6G and 10M50DAF256C6G support the same configuration schemes as other MAX 10 devices, including internal configuration flash memory, JTAG configuration, and external configuration via a host or configuration device. The configuration file format and programming tools (Intel Quartus Prime) are identical for both temperature grades.