Part A
10M50DAF256I6G
Intel
- Lifecycle
- Active
- Stock
- 5635 Stückzahl
- Package
- LBGA-256
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M50DAF256I6G and 10M50DCF256I6G are functionally compatible FPGA devices sharing the same logic density, package, and speed grade, with the primary distinction being the integrated high-speed transceiver capability. The 10M50DAF256I6G includes transceivers while the 10M50DCF256I6G does not, making the DCF variant a viable drop-in replacement only in designs that do not utilize the transceiver blocks. Designers must verify transceiver dependency before substituting.
Logic Density
High match
Package Type
High match
Transceiver Support
Validation required
Operating Temperature
High match
Parts at a glance
Part B
10M50DCF256I6G
Intel
- Lifecycle
- Active
- Stock
- 3446 Stückzahl
- Package
- LBGA-256
- Series
- Embedded feFPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M50DAF256I6G | 10M50DCF256I6G | Why it matters |
|---|---|---|---|
| Family | MAX 10 | MAX 10 | Both devices belong to the same FPGA family, ensuring similar architecture and toolchain support. |
| Logic Elements (LEs) | 50,000 | 50,000 | Matching logic capacity means equivalent programmable logic resources for the same design. |
| Package | 256-pin FBGA | 256-pin FBGA | Identical package ensures the same footprint and board-level compatibility. |
| Operating Temperature | -40°C to 100°C (Industrial) | -40°C to 100°C (Industrial) | Same temperature grade allows use in the same environmental conditions. |
| Embedded Memory | 1,638 Kbits (M9K) | 1,638 Kbits (M9K) | Embedded memory blocks support on-chip data storage and buffering; identical capacity supports the same memory-intensive functions. |
| Flash Memory (Configuration) | Dual configuration flash (analog feature) | Compact configuration flash | The 'A' variant includes analog-to-digital converter (ADC) capability and dual configuration flash, while the 'C' variant uses compact flash without ADC, affecting functionality and substitutability. |
| ADC (Analog-to-Digital Converter) | Yes (12-bit, up to 1 MSPS) | No | The presence of an integrated ADC in the 'A' variant enables analog signal monitoring, which is absent in the 'C' variant, making them functionally different for mixed-signal applications. |
| Supply Voltage | 1.2 V core, 2.5 V/3.3 V I/O | 1.2 V core, 2.5 V/3.3 V I/O | Same voltage requirements ensure compatibility with the same power supply design. |
| Configuration Method | Instant-on, internal flash | Instant-on, internal flash | Both support single-chip, instant-on configuration from internal flash, simplifying system design. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M50DAF256I6G | 10M50DCF256I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 3125 | 3125 |
| Number of Logic Elements/Cells | 50000 | 50000 |
| Total RAM Bits | 1677312 | 1677312 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What is the difference between the 10M50DAF256I6G and the 10M50DCF256I6G?
The primary difference is the integrated transceiver configuration. The 10M50DAF256I6G is a MAX 10 FPGA with a dual-configuration flash feature and no integrated high-speed transceivers, while the 10M50DCF256I6G includes integrated transceivers for high-speed serial interfaces. Both devices share the same 50,000 logic elements, 256-pin FineLine BGA package, and industrial temperature grade (I6).
Are the 10M50DAF256I6G and 10M50DCF256I6G pin-compatible?
No. Although both devices use the same 256-pin FineLine BGA package, the pinout differs because the 10M50DCF256I6G dedicates specific pins to high-speed transceiver channels that are not present on the 10M50DAF256I6G. A direct drop-in replacement is not possible without verifying pin assignments against the respective device pinout files.
Do both devices support dual-configuration flash?
Yes. Both the 10M50DAF256I6G and 10M50DCF256I6G are members of the Intel MAX 10 FPGA family, which features dual-configuration flash memory. This allows the devices to store two separate configuration images and support features such as instant-on operation and fail-safe updates.
What is the logic density of the 10M50DAF256I6G and 10M50DCF256I6G?
Both devices provide 50,000 logic elements (LEs). They also share the same embedded memory capacity of 1,638 Kbits and 288 embedded 18x18 multipliers, as specified in the Intel MAX 10 FPGA device family datasheet.
Can the 10M50DAF256I6G be used as a substitute for the 10M50DCF256I6G in an existing design?
Only if the design does not use the high-speed transceiver channels of the 10M50DCF256I6G. The 10M50DAF256I6G lacks those transceivers, so any design relying on them cannot use the DAF variant. Additionally, the pinout and PCB footprint must be revalidated because the transceiver pins on the DCF device may be assigned to different functions on the DAF device.
What temperature grade do the 10M50DAF256I6G and 10M50DCF256I6G support?
Both devices are rated for the industrial temperature grade, indicated by the "I6" suffix in the part number. This corresponds to an operating junction temperature range of -40°C to +100°C, as defined in the Intel MAX 10 FPGA datasheet.
Do the 10M50DAF256I6G and 10M50DCF256I6G require external configuration memory?
No. Both devices feature integrated flash configuration memory, allowing them to be configured directly from internal flash without an external configuration device. This is a key characteristic of the MAX 10 FPGA family.